CPU Comparison
AMD
AMD Ryzen 7 170
CORE STATE
Rembrandt-R
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.2 Base / 4.75 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
35W
ARCHITECTURE
Zen 3+
PROCESS
6 nm
LAUNCH DATE
2025
VS
INTEL
Pentium Silver N6000
CORE STATE
Jasper Lake
CORE SPECS
4 Cores / 4 Threads
CLOCK SPEED
1100 Base / 3.3 GHz Turbo
CACHE
4 MB (shared)
MAX TDP
6W
ARCHITECTURE
Tremont
PROCESS
10 nm
LAUNCH DATE
—
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
7 170
Pentium Silver N6000
Core Specs
Cores
8
4
-50.0%
Threads
16
4
-75.0%
Base Clock (GHz)
3.2
1,100
+34275.0%
Boost Clock (GHz)
4.75
3.3
-30.5%
Frequency (GHz)
3.2
1,100
+34275.0%
Turbo Clock (GHz)
4.75
3.3
-30.5%
Multiplier
32
11
-65.6%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1.5 MB (shared)
L3 Cache
16 MB (shared)
4 MB (shared)
Power
TDP (W)
35
6
-82.9%
PL1
—
6 W
PL2
—
20 W
Configurable TDP
35-54 W
—
Architecture
Architecture
Zen 3+
Tremont
Codename
Rembrandt-R
Jasper Lake
Generation
Ryzen 7
(Zen 3+ (Rembrandt))
Pentium Silver
(Tremont)
Process Size
6 nm
10 nm
Die Size
210 mm²
63.8 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, LPDDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
46.9 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FP7
Intel BGA 1338
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 3, 8 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon 680M
UHD Graphics 32EU
Other
Market
Mobile
Mobile
Production Status
Active
End-of-life
Part Number
100-000000989
SRKGY
Package
FP7r2
FC-BGA16F
Tj Max
95°C
105°C