CPU Comparison
AMD
AMD Ryzen 7 170
CORE STATE
Rembrandt-R
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.2 Base / 4.75 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
35W
ARCHITECTURE
Zen 3+
PROCESS
6 nm
LAUNCH DATE
2025
VS
INTEL
Core i5-110
CORE STATE
Comet Lake
CORE SPECS
6 Cores / 12 Threads
CLOCK SPEED
2.9 Base / 4.3 GHz Turbo
CACHE
12 MB (shared)
MAX TDP
65W
ARCHITECTURE
Comet Lake
PROCESS
14 nm
LAUNCH DATE
2025
PERFORMANCE BENCHMARKS
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
Analysis: AMD Ryzen 7 170 vs Intel Core i5-110
Looking at the test figures for Intel's Intel Core i5-110 chip and AMD Ryzen 7 170 (AMD), the trend of competitive performance appears. Not one CPU excels steadily throughout the workloads. This alternating of wins implies inherent balance. Buyers confront a actual decision with these options. Both options deliver strong throughput.
When those conflicted between Intel's Intel Core i5-110 chip and AMD Ryzen 7 170 (AMD), be comfortable that any option provides comparable capability. This performance data validates no clear winner. Make your decision on secondary factors and benefit from strong performance regardless. Both are champions in their given regard. Pick confidently.
DETAILED SPECIFICATIONS
SPECIFICATION
7 170
i5-110
Core Specs
Cores
8
6
-25.0%
Threads
16
12
-25.0%
Base Clock (GHz)
3.2
2.9
-9.4%
Boost Clock (GHz)
4.75
4.3
-9.5%
Frequency (GHz)
3.2
2.9
-9.4%
Turbo Clock (GHz)
4.75
4.3
-9.5%
Multiplier
32
29
-9.4%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
16 MB (shared)
12 MB (shared)
Power
TDP (W)
35
65
+85.7%
PL1
—
65 W
PL2
—
134 W
Configurable TDP
35-54 W
—
Architecture
Architecture
Zen 3+
Comet Lake
Codename
Rembrandt-R
Comet Lake
Generation
Ryzen 7
(Zen 3+ (Rembrandt))
Core i5
(Comet Lake)
Process Size
6 nm
14 nm
Die Size
210 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
42.7 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FP7
Intel Socket 1200
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon 680M
UHD Graphics 630
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
—
$200
Part Number
100-000000989
SA35X
Package
FP7r2
FC-LGA1200
Tj Max
95°C
100°C