CPU Comparison

A

AMD

AMD

AMD Ryzen 3 7335U

CORE STATE Rembrandt-R

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3 Base / 4.3 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 28W

ARCHITECTURE Zen 3+

nm

PROCESS 6 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI 9 HX 370

CORE STATE Strix Point

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 2000 Base / 5.1 GHz Turbo

CACHE 16 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE —

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,078

3,010

cinebench_cinebench_r15_singlecore

152

425

cinebench_cinebench_r20_multicore

4,495

12,545

cinebench_cinebench_r20_singlecore

634

1,771

cinebench_cinebench_r23_multicore

10,703

29,870

cinebench_cinebench_r23_singlecore

1,511

4,217

passmark_data_compression

146,309

445,719

passmark_data_encryption

9,335

22,252

passmark_extended_instructions

10,314

31,653

passmark_find_prime_numbers

36

126

passmark_floating_point_math

24,298

76,892

passmark_integer_math

42,493

122,933

passmark_multithread

12,592

35,148

passmark_physics

647

1,881

passmark_random_string_sorting

15,361

48,723

passmark_single_thread

3,053

3,973

passmark_singlethread

3,053

3,973

3dmark_16_threads

N/A

9,365

3dmark_2_threads

N/A

2,179

3dmark_4_threads

N/A

3,970

3dmark_8_threads

N/A

6,992

3dmark_max_threads

N/A

9,725

3dmark_single_thread

N/A

1,153

DETAILED SPECIFICATIONS

SPECIFICATION

3 7335U

AI 9 HX 370

Core Specs

Cores

4

12 +200.0%

Threads

8

24 +200.0%

Base Clock (GHz)

3

2,000 +66566.7%

Boost Clock (GHz)

4.3

5.1 +18.6%

Frequency (GHz)

3

2,000 +66566.7%

Turbo Clock (GHz)

4.3

5.1 +18.6%

Multiplier

30

20 -33.3%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

8 MB (shared)

16 MB

Power

TDP (W)

28

28 0.0%

Configurable TDP

—

15-54 W

Architecture

Architecture

Zen 3+

Zen 5

Codename

Rembrandt-R

Strix Point

Generation

Ryzen 3 (Zen 3+ (Rembrandt))

Ryzen AI (Zen 5)

Process Size

6 nm

4 nm

Die Size

208 mm²

233 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5, LPDDR5X

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

76.8 GB/s

89.6 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FP7

AMD Socket FP8

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

4 + 8

E-Core Frequency

—

1400 MHz up to 3.3 GHz

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 660M

Radeon 890M

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000000537(FP7)100-000000549(FP7r2)

100-000000994

Package

FP7, FP7r2

FP8

Tj Max

95°C

100°C

View Ryzen 3 7335U Details View Ryzen AI 9 HX 370 Details