AMD Ryzen 3 7330U vs AMD Ryzen Embedded V2718 Comparison

AMD
AMD

AMD Ryzen 3 7330U

CORE STATE Barcelo-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.3 Base / 4.3 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 15W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen Embedded V2718

CORE STATE Renoir
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 1700 Base / 4.15 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 10W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r23_multicore
6,230
13,396
geekbench_multicore
4,131
N/A
geekbench_singlecore
1,514
N/A
cinebench_cinebench_r15_multicore
N/A
1,350
cinebench_cinebench_r15_singlecore
N/A
190
cinebench_cinebench_r20_multicore
N/A
5,626
cinebench_cinebench_r20_singlecore
N/A
794
cinebench_cinebench_r23_singlecore
N/A
1,891

Analysis: AMD Ryzen 3 7330U vs AMD Ryzen Embedded V2718

The AMD Ryzen Embedded V2718 and AMD Ryzen 3 7330U are both 7nm TSMC parts on the AMD Socket FP6, but they target fundamentally different roles. The V2718 is an 8-core Zen 2 processor aimed at embedded systems, while the 7330U is a 4-core Zen 3 mobile chip. Benchmark data shows a stark contrast: in the single shared test, Cinebench R23 multi-core, the V2718 scores 13,396 against the 7330U’s 6,230, a 115% advantage. However, the 7330U holds a higher average benchmark score (3,958 vs 3,875) and a slightly better percentile ranking (57th vs 56th), driven by its newer architecture and higher clock speeds in other workloads. This creates a split personality: raw multi-threaded throughput favors the embedded part, while efficiency and per-core performance favor the mobile chip.

FAQ

Q: Which CPU has more cores?

A: The AMD Ryzen Embedded V2718 has 8 cores and 16 threads, while the AMD Ryzen 3 7330U has 4 cores and 8 threads. This core count difference is the primary driver of the V2718’s dominant multi-core benchmark result.

Q: How do their clock speeds compare?

A: The Ryzen 3 7330U has a higher base clock of 2.30 GHz and a higher boost clock of 4.30 GHz, compared to the V2718’s 1.70 GHz base and 4.15 GHz boost. The 7330U’s higher clocks partially offset its lower core count in lightly threaded tasks.

Q: What is the difference in process node and architecture?

A: Both CPUs use a 7 nm TSMC process, but the V2718 is based on Zen 2 (Renoir), while the 7330U is based on Zen 3 (Barcelo-R). The 7330U’s newer Zen 3 architecture delivers better instructions-per-clock, which helps it win in single-core scenarios.

Q: Do they support the same memory and expansion?

A: Both support dual-channel DDR4 with 51.2 GB/s bandwidth and ECC memory. However, the V2718 provides 20 PCIe Gen 3 lanes (CPU only), while the 7330U provides 16 PCIe Gen 3 lanes (CPU only), making the V2718 more expandable for embedded I/O.

Q: Which chip has a higher average benchmark score?

A: The Ryzen 3 7330U has a higher average benchmark score of 3,958, compared to the V2718’s 3,875. Despite the V2718’s massive win in Cinebench R23 multi-core, the 7330U’s performance in Geekbench tests lifts its overall average.

Q: How do their release dates and market segments differ?

A: The V2718 was released on November 9, 2020, as a Desktop segment part, while the 7330U launched on January 3, 2023, as a Mobile segment part. Both are currently listed as Active in production.

Where Each One Wins

The AMD Ryzen Embedded V2718 is the clear winner for multi-threaded, sustained workloads. Its 8-core/16-thread configuration delivers a 115% lead over the 7330U in Cinebench R23 multi-core, making it the better choice for embedded applications that demand parallel processing, such as industrial control, digital signage rendering, or virtualization hosts. The V2718 also offers 20 PCIe Gen 3 lanes, four more than the 7330U, which supports more storage or I/O devices in a fixed embedded chassis.

The AMD Ryzen 3 7330U wins in scenarios where per-core performance and power efficiency matter more than raw core counts. Its Zen 3 architecture and higher boost clock (4.30 GHz vs 4.15 GHz) give it an edge in single-threaded responsiveness, which directly benefits everyday mobile tasks like web browsing, office productivity, and light content creation. The 7330U also posts a higher average benchmark score (3,958 vs 3,875) and a better percentile rank (57th vs 56th), suggesting it is more balanced across a wider range of workloads tested by the database.

For a mobile laptop, the 7330U’s 15W TDP and 4-core design make it easier to cool and more battery-friendly than the V2718’s 10W TDP—although the V2718’s lower TDP is counterintuitive given its higher core count. The V2718’s 8-core advantage is best exploited in fan-cooled embedded systems where sustained multi-core performance is the primary goal.

Architecture Differences

The two processors share a 7 nm TSMC process node and both use 64 KB of L1 and 512 KB of L2 cache per core, with 8 MB of shared L3 cache. However, the underlying architectures diverge significantly. The V2718 is built on Zen 2, codenamed Renoir, while the 7330U uses Zen 3, codenamed Barcelo-R. Zen 3 offers a notable IPC improvement over Zen 2, which is why the 7330U can achieve competitive single-core scores despite having half the cores.

The V2718 has a larger die size (156 mm²) and fewer transistors (9,800 million), while the 7330U has a larger die (180 mm²) and more transistors (10,700 million). This is notable because the 7330U packs more transistors into a physically larger die despite having fewer cores, reflecting the denser logic and cache improvements of the Zen 3 design. Both chips integrate Radeon graphics, but with different configurations: the V2718 has 448 SPs, while the 7330U has a Vega 4-class iGPU (4 compute units). Neither chip supports 3D V-Cache.

The V2718 is part of the Ryzen Embedded 2000 series, while the 7330U belongs to the Ryzen 3 7000 series. This positioning affects their intended use: the V2718’s 20 PCIe Gen 3 lanes and embedded market segment suggest a focus on long-life, always-on systems, whereas the 7330U’s 16 lanes and mobile segment target thin-and-light laptops with lower I/O demands.

Specification Differences

The most obvious difference is core count: the V2718 has 8 cores and 16 threads, while the 7330U has 4 cores and 8 threads. Clock speeds also differ, with the 7330U running at 2.30 GHz base and 4.30 GHz boost, versus the V2718’s 1.70 GHz base and 4.15 GHz boost. TDP numbers are surprising: the V2718 is rated at 10W, while the 7330U is rated at 15W, meaning the embedded chip draws less power despite having twice the cores.

Memory support is identical in type (DDR4), channel count (dual-channel), and bandwidth (51.2 GB/s), and both support ECC memory. PCIe lanes differ: the V2718 offers 20 Gen 3 lanes, the 7330U offers 16 Gen 3 lanes. Integrated graphics are present on both, but the V2718’s Radeon Graphics has 448 SPs, while the 7330U’s Radeon Graphics is listed as “Vega 4” (4 compute units). Both use the AMD Socket FP6 and are built by TSMC, but the V2718 has a smaller die (156 mm²) and fewer transistors (9,800 million) than the 7330U (180 mm² and 10,700 million). Neither has an unlocked multiplier. The V2718 was released on November 9, 2020, while the 7330U came later on January 3, 2023. Both have no launch MSRP listed and are currently Active in production.

Head-to-Head Benchmarks

The only directly comparable benchmark in the data is Cinebench R23 multi-core, where the AMD Ryzen Embedded V2718 scores 13,396 against the AMD Ryzen 3 7330U’s 6,230. This is a 115% delta, meaning the V2718 more than doubles the 7330U’s multi-threaded score. This result aligns perfectly with the core count disparity: the V2718’s 8 cores and 16 threads provide massive scaling in this rendering workload, while the 7330U’s 4 cores and 8 threads are a limiting factor.

However, the overall benchmark picture is more nuanced. The 7330U has additional benchmark data that the V2718 lacks, including Geekbench multi-core (4,131) and single-core (1,514) scores. These results, combined with its Cinebench R23 single-core performance (not listed for the V2718), contribute to its higher average benchmark score of 3,958, versus the V2718’s 3,875. The 7330U also edges out the V2718 in percentile ranking, sitting at 57th among all CPUs compared to the V2718’s 56th.

Looking at nearest rivals, the V2718 sits within 1.4% of the Intel Xeon E-2286M and within 1.3% of the AMD Ryzen 9 5900HS, indicating its average score is competitive with those higher-tier parts. The 7330U, meanwhile, is statistically tied with the Intel Xeon E5-2669 v3 (0% delta) and within 0.5% of the AMD Ryzen 5 PRO 4650G. This suggests that while the V2718 wins the multi-core head-to-head decisively, the 7330U holds its own in overall average performance, likely due to stronger single-core results from its Zen 3 architecture.

In practical terms, the head-to-head data shows a clear trade-off: choose the V2718 for sustained, multi-threaded embedded workloads where the 115% Cinebench R23 lead is decisive, or choose the 7330U for mobile use where its higher clocks and newer architecture deliver better per-core responsiveness and a marginally higher overall average score. The 7330U’s 4.30 GHz boost clock is 0.15 GHz higher than the V2718’s, and its base clock is 0.60 GHz higher, which likely drives its single-core advantages in unlisted tests.

DETAILED SPECIFICATIONS

SPECIFICATION
3 7330U
Embedded V2718
Core Specs
Cores
4
8 +100.0%
Threads
8
16 +100.0%
Base Clock (GHz)
2.3
1,700 +73813.0%
Boost Clock (GHz)
4.3
4.15 -3.5%
Frequency (GHz)
2.3
1,700 +73813.0%
Turbo Clock (GHz)
4.3
4.15 -3.5%
Multiplier
23
17 -26.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
8 MB (shared)
8 MB (shared)
Power
TDP (W)
15
10 -33.3%
Configurable TDP
—
25 W
Architecture
Architecture
Zen 3
Zen 2
Codename
Barcelo-R
Renoir
Generation
Ryzen 3 (Zen 3 (Cezanne))
Ryzen Embedded (Zen 2 (Renoir))
Process Size
7 nm
7 nm
Transistors
10,700 million
9,800 million
Die Size
180 mm²
156 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
51.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP6
AMD Socket FP6
PCIe
Gen 3, 16 Lanes(CPU only)
Gen 3, 20 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon Graphics (Vega 4)
Radeon Graphics 448SP
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
100-000000944
100-000000242
Package
FP6
FP6
Tj Max
95°C
105°C
View Ryzen 3 7330U Details View Ryzen Embedded V2718 Details