AMD Ryzen 3 5425U vs Intel Core i3-13100TE Comparison

AMD
AMD

AMD Ryzen 3 5425U

CORE STATE Barcelo
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.7 Base / 4.1 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 15W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
Intel
INTEL

Core i3-13100TE

CORE STATE Raptor Lake-S
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.4 Base / 4.1 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 35W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r23_multicore
5,954.5
10,054
cinebench_cinebench_r23_singlecore
1,332
1,419
geekbench_multicore
3,880
5,703
geekbench_singlecore
1,328
1,739
cinebench_cinebench_r15_multicore
N/A
1,013
cinebench_cinebench_r15_singlecore
N/A
142
cinebench_cinebench_r20_multicore
N/A
4,222
cinebench_cinebench_r20_singlecore
N/A
595

Analysis: AMD Ryzen 3 5425U vs Intel Core i3-13100TE

The AMD Ryzen 3 5425U and Intel Core i3-13100TE are both 4-core, 8-thread processors, but they are engineered for entirely different environments. The benchmark data shows a clear performance hierarchy, with the Intel part winning every shared benchmark decisively. However, the AMD chip’s identity is rooted in its mobile efficiency, not in raw output. The data indicates that the Intel Core i3-13100TE is the stronger performer in every measured test, while the AMD Ryzen 3 5425U competes on platform power and integration.

Where Each One Wins

The Intel Core i3-13100TE wins every single benchmark where both processors have results. In Cinebench R23 multi-core, the Intel part scores 10054 against the AMD’s 5954.5, a massive 40.8% advantage. This is not a marginal lead; it is a generational gap in sustained workload capability. The Geekbench multi-core test tells a similar story, with Intel scoring 5703 versus AMD’s 3880, a 32% lead. Even in single-core tests, where the AMD Zen 3 architecture is traditionally strong, the Intel part wins: 1419 versus 1332 in Cinebench R23 single-core (6.1% ahead) and 1739 versus 1328 in Geekbench single-core (23.6% ahead). The AMD Ryzen 3 5425U has zero benchmark wins in this head-to-head comparison.

The AMD’s only victories are contextual and architectural. It is a mobile part with a 15 TDP, compared to the Intel’s 35 TDP. This suggests the AMD chip is designed for thermally constrained environments like thin-and-light laptops, where the Intel part’s higher power draw would be prohibitive. The AMD also integrates Radeon Vega 6 graphics, while the Intel uses UHD Graphics 730; neither is benchmarked here, so the comparison rests on the CPU scores. In the absence of any CPU benchmark win, the AMD’s case is built on its lower power envelope and mobile platform positioning, not on performance.

The Verdict

Pick the Intel Core i3-13100TE if your priority is raw compute. The data is unambiguous: it outperforms the AMD Ryzen 3 5425U by 40.8% in Cinebench R23 multi-core and by 32% in Geekbench multi-core. This is the correct choice for desktop workloads where power draw is irrelevant and performance is king. The Intel part also leads in single-core, making it the better option for lightly-threaded tasks as well. There is no benchmark category where the AMD catches up.

Pick the AMD Ryzen 3 5425U only if the platform demands it. With a TDP of 15 versus 35, the AMD chip is designed for battery-powered or passively-cooled systems where the Intel part’s power requirements would be disqualifying. The AMD’s 7 nm process node (versus Intel’s 10 nm) and smaller 180 mm² die size indicate a focus on efficiency. The AMD also supports the AMD Socket FP6, a mobile socket, confirming its laptop-oriented design. If you need a processor for a mobile device, the AMD is the only viable option here; if you need performance, the Intel is the only rational choice.

Head-to-Head Benchmarks

The largest gap is in Cinebench R23 multi-core. The Intel Core i3-13100TE scores 10054, while the AMD Ryzen 3 5425U scores 5954.5. This 40.8% delta is the single biggest performance difference in the entire comparison. It reflects the Intel part’s superior sustained multi-threaded throughput, likely due to its larger 12 MB shared L3 cache and higher 35 W power budget, which allows it to maintain boost clocks longer under load.

Geekbench multi-core shows a similar but slightly smaller gap. Intel scores 5703, AMD scores 3880, a 32% difference. This test is more representative of mixed real-world workloads, and the Intel part still leads by nearly a third. The AMD’s 8 MB shared L3 cache and 51.2 GB/s memory bandwidth are not enough to overcome the Intel’s architectural lead in this metric.

Single-core results are closer but still favor Intel. In Cinebench R23 single-core, Intel scores 1419 versus AMD’s 1332, a 6.1% lead. This is a modest win, but it is consistent. In Geekbench single-core, the gap widens to 23.6%, with Intel at 1739 and AMD at 1328. The Intel part’s higher boost clock of 4.10 GHz (same as AMD’s 4.10 GHz) does not explain the Geekbench gap, suggesting a per-core IPC advantage in the Raptor Lake architecture for this test. The AMD’s only comparable result is its Cinebench R23 single-core score, which trails by just 87 points, showing that Zen 3 is competitive in lightly-threaded Cinebench workloads.

FAQ

Q: Which processor has a higher average benchmark score?

A: The AMD Ryzen 3 5425U has an average benchmark score of 3124, while the Intel Core i3-13100TE has an average of 3111. The AMD is 0.4% ahead of the Intel in this aggregate metric, despite losing every head-to-head test.

Q: How do these processors compare to their nearest rivals?

A: The AMD Ryzen 3 5425U is 0.1% ahead of the AMD Ryzen 5 6600HS and 0.9% ahead of the AMD Ryzen 5 5625U. The Intel Core i3-13100TE is 0.3% behind the AMD Ryzen 5 6600HS and 0.5% ahead of the AMD Ryzen 5 5625U.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen 3 5425U and the Intel Core i3-13100TE have ECC memory support enabled.

Q: What is the memory bandwidth of each processor?

A: The AMD Ryzen 3 5425U has a memory bandwidth of 51.2 GB/s. The Intel Core i3-13100TE does not have a memory bandwidth figure listed in the data.

Q: Which processor has a larger L3 cache?

A: The Intel Core i3-13100TE has 12 MB of shared L3 cache. The AMD Ryzen 3 5425U has 8 MB of shared L3 cache. The Intel part has 50% more L3 cache.

Q: What are the release dates for these two chips?

A: The AMD Ryzen 3 5425U was released on 2022-01-05. The Intel Core i3-13100TE was released on 2023-01-03.

Architecture Differences

The AMD Ryzen 3 5425U is built on the Zen 3 architecture, codenamed Barcelo, and is part of the 5000 series. It uses a 7 nm process node fabricated by TSMC, with 10,700 million transistors on a 180 mm² die. The Intel Core i3-13100TE uses the Raptor Lake architecture, codenamed Raptor Lake-S, part of the Core 13th Gen. It is built on a 10 nm process node by Intel, with a die size of 163 mm². The AMD uses AMD Socket FP6, while the Intel uses Intel Socket 1700. The AMD integrates Radeon Vega 6 graphics, while the Intel integrates UHD Graphics 730. The AMD supports DDR4 memory only, while the Intel supports both DDR4 and DDR5. The AMD’s PCIe is Gen 3 with 16 lanes (CPU only), while the Intel’s PCIe is Gen 5 with 16 lanes (CPU only). The AMD’s L1 cache is 64 KB per core, while the Intel’s is 80 KB per core. The AMD’s L2 cache is 512 KB per core, while the Intel’s is 1.25 MB per core.

Specification Differences

The two processors differ in several key specifications. The AMD Ryzen 3 5425U has a base clock of 2.70 GHz, while the Intel Core i3-13100TE has a base clock of 2.40 GHz. Both boost to 4.10 GHz. The AMD has a TDP of 15, while the Intel has a TDP of 35. The AMD’s transistor count is 10,700 million, while the Intel’s is not listed. The AMD’s die size is 180 mm², while the Intel’s is 163 mm². The AMD’s memory bandwidth is 51.2 GB/s, while the Intel’s is not listed. The AMD supports DDR4 memory; the Intel supports DDR4 and DDR5. The AMD’s PCIe is Gen 3 with 16 lanes; the Intel’s is Gen 5 with 16 lanes. The AMD’s market segment is Mobile; the Intel’s is Desktop. The AMD’s release date is 2022-01-05; the Intel’s is 2023-01-03. The AMD’s part number is 100-000000586; the Intel’s is SRMFT. The AMD’s integrated graphics are Radeon Vega 6; the Intel’s are UHD Graphics 730. The AMD’s L1 cache is 64 KB per core; the Intel’s is 80 KB per core. The AMD’s L2 cache is 512 KB per core; the Intel’s is 1.25 MB per core. The AMD’s L3 cache is 8 MB shared; the Intel’s is 12 MB shared. The AMD’s process node is 7 nm; the Intel’s is 10 nm. The AMD’s foundry is TSMC; the Intel’s is Intel. The AMD’s generation is Ryzen 3 (Zen 3 (Cezanne)); the Intel’s is Core i3 (Raptor Lake).

DETAILED SPECIFICATIONS

SPECIFICATION
3 5425U
i3-13100TE
Core Specs
Cores
4
4 0.0%
Threads
8
8 0.0%
Base Clock (GHz)
2.7
2.4 -11.1%
Boost Clock (GHz)
4.1
4.1 0.0%
Frequency (GHz)
2.7
2.4 -11.1%
Turbo Clock (GHz)
4.1
4.1 0.0%
Multiplier
27
24 -11.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1.25 MB (per core)
L3 Cache
8 MB (shared)
12 MB (shared)
Power
TDP (W)
15
35 +133.3%
PL1
—
35 W
PL2
—
69 W
Configurable TDP
25W
—
Architecture
Architecture
Zen 3
Raptor Lake
Codename
Barcelo
Raptor Lake-S
Generation
Ryzen 3 (Zen 3 (Cezanne))
Core i3 (Raptor Lake)
Process Size
7 nm
10 nm
Transistors
10,700 million
—
Die Size
180 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
—
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
DDR5 Speed
—
4800 MT/s
Platform
Socket
AMD Socket FP6
Intel Socket 1700
Chipsets
—
H610, H610E, Q670, Q670E, R680E, W680
PCIe
Gen 3, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon Vega 6
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
100-000000586
SRMFT
Package
FC-BGA1140
FC-LGA16A
Tj Max
95°C
100°C
View Ryzen 3 5425U Details View Core i3-13100TE Details