AMD Ryzen 3 3100U vs AMD Ryzen Embedded 9900X Comparison

AMD
AMD

AMD Ryzen 3 3100U

CORE STATE Picasso
CORE SPECS 2 Cores / 2 Threads
CLOCK SPEED 1.9 Base / 3.2 GHz Turbo
CACHE 4 MB (shared)
MAX TDP 15W
ARCHITECTURE Picasso
nm
PROCESS 12 nm
LAUNCH DATE 2026
VS
AMD
AMD

Ryzen Embedded 9900X

CORE STATE Granite Ridge
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 4.4 Base / 5.6 GHz Turbo
CACHE 64 MB
MAX TDP 120W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

passmark_data_compression
38,455
N/A
passmark_data_encryption
1,972
N/A
passmark_extended_instructions
2,116
N/A
passmark_find_prime_numbers
18
N/A
passmark_floating_point_math
5,854
N/A
passmark_integer_math
8,873
N/A
passmark_multithread
3,348
N/A
passmark_physics
232
N/A
passmark_random_string_sorting
4,666
N/A
passmark_single_thread
1,592
N/A
passmark_singlethread
1,592
N/A

Analysis: AMD Ryzen 3 3100U vs AMD Ryzen Embedded 9900X

Head-to-Head Benchmarks

The comparison between the AMD Ryzen 3 3100U and the AMD Ryzen Embedded 9900X is severely constrained by data availability. The database contains eleven benchmark scores for the Ryzen 3 3100U, while the Ryzen Embedded 9900X has no recorded benchmark scores in the dataset. Consequently, there are no head-to-head benchmark results, no wins for either processor, and no direct performance deltas to report.

The Ryzen 3 3100U's recorded scores provide a baseline for what the mobile processor can deliver. Its PassMark single-thread score is 1592, with a multithread score of 3348. Integer math performance reaches 8873, while floating point math scores 5854. The data compression test yields 38455, and data encryption scores 1972. Extended instructions produce 2116, and random string sorting reaches 4666. The physics test records 232, and the find prime numbers test scores 18. These figures establish a performance profile for a dual-core, dual-thread mobile chip.

The Ryzen Embedded 9900X, in contrast, appears in the database with an average benchmark score of zero and no entries under its benchmark array. Its percentile ranking against all CPUs is 50, compared to the 3100U's percentile of 62. This percentile difference indicates that the 3100U sits higher in the overall distribution of all CPUs in the database, but this ranking reflects the absence of recorded measurements for the Embedded part rather than any direct comparison.

The nearest rivals for the 3100U include the AMD Ryzen Threadripper 1950X with an average score of 6231 and a delta of 0.3%, the AMD EPYC 7272 at 6186 with a delta of 1%, the Intel Core i9-10920X at 6347 with a delta of -1.6%, and the Intel Core i9-7940X at 6147 with a delta of 1.6%. The 3100U's average benchmark score of 6247 places it slightly above the Threadripper 1950X, marginally above the EPYC 7272, and below the Core i9-10920X. These rivals are all high-core-count desktop or server processors, which makes the 3100U's positioning among them notable given its 2-core configuration. No such rival data exists for the Embedded 9900X.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen Embedded 9900X has 12 cores and 24 threads. The AMD Ryzen 3 3100U has 2 cores and 2 threads.

Q: What are the clock speed differences?

A: The Ryzen 3 3100U has a base clock of 1.90 GHz and a boost clock of 3.20 GHz. The Ryzen Embedded 9900X has a base clock of 4.40 GHz and a boost clock of 5.60 GHz.

Q: Do both processors support ECC memory?

A: No. The Ryzen Embedded 9900X supports ECC memory, while the Ryzen 3 3100U does not.

Q: What memory types do they support?

A: The Ryzen 3 3100U supports DDR4 memory with dual-channel configuration and a memory bandwidth of 38.4 GB/s. The Ryzen Embedded 9900X supports DDR5 memory with dual-channel configuration and a memory bandwidth of 89.6 GB/s.

Q: Which processor has a higher percentile ranking in the database?

A: The Ryzen 3 3100U has a percentile ranking of 62 against all CPUs. The Ryzen Embedded 9900X has a percentile ranking of 50. However, the Embedded part has no recorded benchmark scores, so this ranking is based on incomplete data.

Q: What are the process node and foundry for each?

A: The Ryzen 3 3100U uses a 12 nm process from GlobalFoundries. The Ryzen Embedded 9900X uses a 4 nm process from TSMC.

Q: Are the multipliers unlocked?

A: The Ryzen Embedded 9900X has an unlocked multiplier. The Ryzen 3 3100U does not have an unlocked multiplier.

Architecture Differences

The two processors represent entirely different architectural generations and design philosophies. The Ryzen 3 3100U belongs to the 3000 series, uses the Picasso codename, and is built on the Zen+ microarchitecture. Its generation is listed as Ryzen 3 (Zen+ (Picasso)). The Ryzen Embedded 9900X belongs to the 9000 series, uses the Granite Ridge codename, and is built on the Zen 5 microarchitecture, listed as Ryzen Embedded (Zen 5 (Granite Ridge)).

The manufacturing process differs substantially. The 3100U uses a 12 nm process from GlobalFoundries, with 4,940 million transistors on a 210 mm² die. The Embedded 9900X uses a 4 nm process from TSMC, with 16,630 million transistors spread across a dual-chiplet design with each die measuring 70.6 mm². The transistor count for the Embedded part is more than three times that of the 3100U, despite the smaller individual die sizes.

Cache hierarchies are also distinct. The 3100U provides 96 KB of L1 cache per core, 512 KB of L2 cache per core, and 4 MB of shared L3 cache. The Embedded 9900X provides 80 KB of L1 cache per core, 1 MB of L2 cache per core, and 64 MB of L3 cache. While the per-core L1 allocation is smaller on the Embedded part, the total L3 cache is 16 times larger.

Memory architecture diverges completely. The 3100U supports DDR4 memory with a dual-channel bus and 38.4 GB/s bandwidth. The Embedded 9900X supports DDR5 memory with a dual-channel bus and 89.6 GB/s bandwidth. ECC memory is supported only on the Embedded part. PCIe connectivity also differs: the 3100U uses PCIe Gen 3, while the Embedded 9900X uses PCIe Gen 5 with 24 lanes from the CPU.

Integrated graphics are present on both, but with different configurations. The 3100U integrates Radeon Vega 8 graphics, while the Embedded 9900X integrates Radeon Graphics without a specific model designation. The market segments differ as well: the 3100U targets mobile devices, while the Embedded 9900X targets desktop applications. Sockets are incompatible, with the 3100U using AMD Socket FP5 and the Embedded 9900X using AMD Socket AM5.

The Verdict

The data supports a straightforward selection based on workload requirements. For mobile computing with modest power demands, the Ryzen 3 3100U is the only choice between the two, as it is the sole mobile-oriented processor in this comparison. Its 15 W TDP, dual-core design, and integrated Vega 8 graphics suit lightweight portable systems. The database records its average benchmark score at 6247, with a percentile ranking of 62 against all CPUs, which places it competitively among much larger processors in the database.

For embedded and desktop applications requiring substantial compute resources, the Ryzen Embedded 9900X is the clear selection. Its 12 cores, 24 threads, 4.40 GHz base clock, and 5.60 GHz boost clock indicate a high-throughput design. The 120 W TDP, unlocked multiplier, ECC memory support, DDR5 memory, and PCIe Gen 5 connectivity with 24 CPU lanes position it for demanding workloads. Its 64 MB of L3 cache and 89.6 GB/s memory bandwidth further reinforce this profile.

The absence of benchmark scores for the Embedded 9900X means the database cannot quantify its performance advantage. The specification differences, however, are substantial and consistent: more cores, higher clocks, newer architecture, larger cache, faster memory, and broader I/O capabilities. The 3100U's recorded scores show a capable low-power mobile processor, but the architectural gap between Zen+ and Zen 5, combined with the core and clock disparities, leaves no ambiguity about which part offers greater raw compute potential.

Specification Differences

The two processors differ across nearly every specification field. Core count ranges from 2 cores and 2 threads on the 3100U to 12 cores and 24 threads on the Embedded 9900X. Base clocks are 1.90 GHz versus 4.40 GHz, and boost clocks are 3.20 GHz versus 5.60 GHz. TDP rises from 15 W to 120 W. Sockets differ: AMD Socket FP5 for the 3100U, AMD Socket AM5 for the Embedded 9900X.

Codename and generation reflect different eras: Picasso with Zen+ versus Granite Ridge with Zen 5. Process nodes are 12 nm from GlobalFoundries versus 4 nm from TSMC. Transistor counts are 4,940 million versus 16,630 million, and die sizes are 210 mm² versus 2x 70.6 mm². L1 cache per core is 96 KB versus 80 KB, L2 cache per core is 512 KB versus 1 MB, and L3 cache is 4 MB shared versus 64 MB.

Memory support moves from DDR4 to DDR5, with bandwidth increasing from 38.4 GB/s to 89.6 GB/s. ECC memory is absent on the 3100U and present on the Embedded 9900X. PCIe generation advances from Gen 3 to Gen 5, with the Embedded part specifying 24 CPU lanes. Integrated graphics change from Radeon Vega 8 to a generic Radeon Graphics designation. Market segments are Mobile versus Desktop. The multiplier is locked on the 3100U and unlocked on the Embedded 9900X. Release dates differ as well, with the 3100U listed as 2026-05-31 and the Embedded 9900X listed as 2025-10-06.

Where Each One Wins

The Ryzen 3 3100U wins in power efficiency and portability. Its 15 W TDP is dramatically lower than the 120 W TDP of the Embedded 9900X, making it suitable for fanless or lightly cooled mobile designs. The mobile market segment and AMD Socket FP5 platform target laptops and compact systems. Its integrated Radeon Vega 8 graphics provide a more specific GPU configuration for everyday display output. The 12 nm process and smaller transistor count also indicate a lower manufacturing cost profile, though pricing data is not available for either part.

The Ryzen Embedded 9900X wins in every measure of raw compute capacity. The 6x core advantage and 12x thread advantage over the 3100U translate directly to higher multithreaded throughput potential. The 4.40 GHz base clock and 5.60 GHz boost clock are substantially higher than the 3100U's 1.90 GHz and 3.20 GHz. The 64 MB L3 cache versus 4 MB provides far more on-die data capacity. The 89.6 GB/s memory bandwidth versus 38.4 GB/s doubles the memory throughput. ECC memory support and PCIe Gen 5 with 24 CPU lanes make it appropriate for embedded applications requiring data integrity and high-speed I/O. The unlocked multiplier offers overclocking flexibility that the 3100U lacks.

The benchmark data, where available, reinforces the mobile part's standing among its peers. The 3100U's average score of 6247 places it within 1.6% of the Intel Core i9-10920X, 0.3% above the Threadripper 1950X, and 1% above the EPYC 7272. These figures indicate that the 3100U, despite its modest core count, delivers competitive aggregate performance in the database's scoring methodology. For the Embedded 9900X, the absence of recorded scores means its wins are defined entirely by architectural and specification advantages rather than measured outcomes.

DETAILED SPECIFICATIONS

SPECIFICATION
3 3100U
Embedded 9900X
Core Specs
Cores
2
12 +500.0%
Threads
2
24 +1100.0%
Base Clock (GHz)
1.9
4.4 +131.6%
Boost Clock (GHz)
3.2
5.6 +75.0%
Frequency (GHz)
1.9
4.4 +131.6%
Turbo Clock (GHz)
3.2
5.6 +75.0%
Multiplier
19
44 +131.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
96 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
4 MB (shared)
64 MB
Power
TDP (W)
15
120 +700.0%
PPT
—
162 W
Configurable TDP
12-35 W
—
Architecture
Codename
Picasso
Granite Ridge
Generation
Ryzen 3 (Zen+ (Picasso))
Ryzen Embedded (Zen 5 (Granite Ridge))
Process Size
12 nm
4 nm
Transistors
4,940 million
16,630 million
Die Size
210 mm²
2x 70.6 mm²
Foundry
GlobalFoundries
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
38.4 GB/s
89.6 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FP5
AMD Socket AM5
Chipsets
—
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600¹
PCIe
Gen 3
Gen 5, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
Radeon Vega 8
Radeon Graphics
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
YM3100C4T2OFG
100-000000662E
Package
FP5
FC-LGA1718
Tj Max
105°C
95°C
Bundled Cooler
—
None
View Ryzen 3 3100U Details View Ryzen Embedded 9900X Details