AMD Ryzen 3 30 vs Qualcomm Snapdragon X2E-94-100 Comparison
AMD Ryzen 3 30
Snapdragon X2E-94-100
PERFORMANCE BENCHMARKS
Analysis: AMD Ryzen 3 30 vs Qualcomm Snapdragon X2E-94-100
The AMD Ryzen 3 30 and Qualcomm Snapdragon X2E-94-100 occupy different corners of the mobile processor market. The Ryzen 3 30 is a 4-core, 8-thread part built on a 6 nm process, while the Snapdragon X2E-94-100 is an 18-core, 18-thread chip on a 3 nm node. The database contains no shared benchmark results for these two processors, so direct head-to-head comparisons are impossible from recorded data. Instead, the analysis relies on the available specifications, individual benchmark scores for the AMD chip, and the broader performance context provided by the database’s nearest rival entries.
Head-to-Head Benchmarks
The database lists no head-to-head benchmark entries for the AMD Ryzen 3 30 versus the Qualcomm Snapdragon X2E-94-100. This means there are no direct measurements where both processors ran the same test under the same conditions. The AMD chip has a full set of PassMark results, while the Qualcomm part has no recorded benchmark scores at all, with an average benchmark score of 0 and a percentile ranking of 50 among all CPUs.
For the AMD Ryzen 3 30, the recorded scores show a clear pattern. In multi-threaded workloads, the chip scores 9027 in PassMark multithread, 29846 in integer math, and 14448 in floating point math. Single-thread performance is recorded at 2465 in both the PassMark single-thread and singlethread tests. Data compression reaches 135834, data encryption scores 6461, extended instructions hit 6075, physics scores 436, and random string sorting reaches 14431. Prime number finding is the weakest result at 20.
These numbers place the Ryzen 3 30 at the 74th percentile among all CPUs in the database, with an average benchmark score of 20137. The nearest rivals in the database provide context. The Intel Core Ultra 7 165U has an average score of 20249, which is 0.6% higher than the AMD chip. The Intel Core i7-9700K scores 20271, 0.7% higher. The AMD EPYC 7713P scores 20024, 0.6% lower, and the Intel Core i7-11800H scores 19998, 0.7% lower. The Ryzen 3 30 sits within a narrow band of roughly 1% of these four competing processors.
Without any recorded scores for the Snapdragon X2E-94-100, no direct wins or losses can be established. The database shows zero wins for either processor in head-to-head comparisons, and the Qualcomm chip’s average benchmark score of 0 indicates no measured performance data exists. The only meaningful comparison comes from specification differences, which show the Snapdragon has more cores, a higher clock range, a newer process node, and faster memory support.
Architecture Differences
The architectural gap between these two processors is substantial. The AMD Ryzen 3 30 uses Zen 2 architecture under the Mendocino codename, fabricated on a 6 nm process at TSMC. The die size measures 100 mm². The Qualcomm Snapdragon X2E-94-100 uses the Glymur codename under the Snapdragon X2 Elite generation, fabricated on a 3 nm process, also at TSMC. Its die size is 220 mm², more than double the AMD chip’s.
Core counts differ sharply. The Ryzen 3 30 has 4 cores and 8 threads, indicating simultaneous multithreading. The Snapdragon X2E-94-100 has 18 cores and 18 threads, with no multithreading support. Base clocks are 2.40 GHz for the AMD part and 4.45 GHz for the Qualcomm part. Boost clocks are 4.10 GHz and 4.70 GHz, respectively.
Cache hierarchies also diverge. The AMD chip provides 64 KB of L1 cache per core, 512 KB of L2 per core, and 4 MB of shared L3 cache. The Qualcomm part offers 288 KB of L1 per core, 16 MB of L2 per module, and 9 MB of shared L3 cache. The L2 allocation is particularly different: the AMD design uses per-core L2, while the Qualcomm design uses per-module L2, reflecting a different core clustering strategy.
Memory support and bandwidth show a clear performance gap. The Ryzen 3 30 supports LPDDR5 memory on a dual-channel bus with 88.0 GB/s of bandwidth. The Snapdragon X2E-94-100 supports LPDDR5X on a triple-channel bus with 228.6 GB/s, nearly 2.6 times the bandwidth. Neither chip supports ECC memory.
PCIe connectivity also differs. The AMD part uses PCIe Gen 3 with 4 lanes (CPU only), while the Qualcomm part uses PCIe Gen 5 with 12 lanes (CPU only). Integrated graphics are present on both: Radeon 610M on the AMD chip and Adreno X2-90 on the Qualcomm chip.
The power envelope is recorded only for the AMD part, which has a TDP of 15 watts. The Snapdragon X2E-94-100 has no TDP listed in the database. Socket types are different as well: AMD Socket FT6 for the Ryzen 3 30 and Qualcomm BGA 2343 for the Snapdragon. Neither processor has an unlocked multiplier.
Release dates place the AMD chip at 2025-09-30 and the Qualcomm chip at 2026-04-05, a gap of roughly six months. Both are listed as Active in production status. The Qualcomm part has a known part number, X2E94100, while the AMD part’s part number is listed as unknown.
The Verdict
The data supports a clear split. The AMD Ryzen 3 30 is the only processor with recorded benchmark results. Its scores place it at the 74th percentile among all CPUs, with an average benchmark score of 20137. The nearest rivals, all within 0.7% of its average score, indicate that this chip performs in line with mid-range desktop and mobile processors from Intel and AMD. The single-thread score of 2465 and multi-thread score of 9027 suggest balanced performance for typical mobile workloads.
The Qualcomm Snapdragon X2E-94-100 has no benchmark data in the database. Its average score is 0, and it has no nearest rivals listed. This absence of measurements means no performance verdict can be drawn from recorded results. The specifications, however, indicate a much larger and more capable design on paper: 18 cores, higher clocks, a smaller 3 nm process, and triple-channel LPDDR5X memory with 228.6 GB/s of bandwidth.
For a user selecting strictly from the data, the AMD Ryzen 3 30 is the only option with proven benchmark performance. The Snapdragon X2E-94-100 cannot be recommended based on measured results, because none exist. Its specifications suggest it may outperform the AMD chip in multi-threaded and memory-heavy workloads, but the database does not confirm this. The absence of a TDP for the Qualcomm part also leaves power consumption unknown, while the AMD chip’s 15-watt TDP is recorded.
FAQ
Q: Does the Qualcomm Snapdragon X2E-94-100 have any benchmark scores in the database?
A: No. The database lists no benchmark entries for the Snapdragon X2E-94-100, and its average benchmark score is 0.
Q: How does the AMD Ryzen 3 30 compare to its nearest rivals in the database?
A: The Ryzen 3 30 has an average benchmark score of 20137. The Intel Core Ultra 7 165U scores 20249 (0.6% higher), the Intel Core i7-9700K scores 20271 (0.7% higher), the AMD EPYC 7713P scores 20024 (0.6% lower), and the Intel Core i7-11800H scores 19998 (0.7% lower).
Q: What is the core and thread count difference between the two processors?
A: The AMD Ryzen 3 30 has 4 cores and 8 threads. The Qualcomm Snapdragon X2E-94-100 has 18 cores and 18 threads.
Q: Which processor has higher memory bandwidth according to the database?
A: The Qualcomm Snapdragon X2E-94-100 has a memory bandwidth of 228.6 GB/s on a triple-channel LPDDR5X bus. The AMD Ryzen 3 30 has 88.0 GB/s on a dual-channel LPDDR5 bus.
Q: What is the recorded power consumption for each chip?
A: The AMD Ryzen 3 30 has a TDP of 15 watts. The Qualcomm Snapdragon X2E-94-100 has no TDP listed in the database.
Q: What process nodes are used by these processors?
A: The AMD Ryzen 3 30 uses a 6 nm process from TSMC. The Qualcomm Snapdragon X2E-94-100 uses a 3 nm process, also from TSMC.
Where Each One Wins
The AMD Ryzen 3 30 wins in the only category where measured performance exists: benchmark results. Its recorded scores cover a range of workloads, from integer math (29846) to floating point math (14448) to data compression (135834). The single-thread score of 2465 and multithread score of 9027 give it a concrete performance profile. The 74th percentile ranking and an average benchmark score of 20137 place it above half the CPUs in the database. The 15-watt TDP also provides a known power draw, which is useful for mobile system design.
The Qualcomm Snapdragon X2E-94-100 wins on specification advantages. It has 18 cores versus 4, a base clock of 4.45 GHz versus 2.40 GHz, and a boost clock of 4.70 GHz versus 4.10 GHz. The 3 nm process node is smaller than the 6 nm node, which typically enables higher efficiency. The 220 mm² die size, 228.6 GB/s memory bandwidth, PCIe Gen 5 with 12 lanes, and 9 MB of shared L3 cache all exceed the AMD chip’s corresponding figures. The L2 cache of 16 MB per module is also larger than the 512 KB per core on the AMD part.
In terms of use cases, the recorded data indicates the AMD Ryzen 3 30 handles standard mobile tasks with balanced single and multi-thread performance. The Qualcomm Snapdragon X2E-94-100, based on specifications alone, is positioned for workloads that scale across many cores, such as heavy parallel processing, and for memory-intensive applications that benefit from triple-channel LPDDR5X bandwidth. The lack of benchmark data for the Qualcomm chip means these advantages are theoretical rather than measured.
Specification Differences
The following fields differ between the two processors, based solely on the database entries:
| Specification | AMD Ryzen 3 30 | Qualcomm Snapdragon X2E-94-100 |
|----------------|----------------|-------------------------------|
| Cores | 4 | 18 |
| Threads | 8 | 18 |
| Base Clock | 2.40 GHz | 4.45 GHz |
| Boost Clock | 4.10 GHz | 4.70 GHz |
| TDP | 15 W | Not listed |
| Socket | AMD Socket FT6 | Qualcomm BGA 2343 |
| Architecture | Zen 2 | Not listed |
| Codename | Mendocino | Glymur |
| Generation | Ryzen 3 (Zen 2 (Mendocino)) | Snapdragon X2 (Elite) |
| Process Node | 6 nm | 3 nm |
| Die Size | 100 mm² | 220 mm² |
| L1 Cache | 64 KB (per core) | 288 KB (per core) |
| L2 Cache | 512 KB (per core) | 16 MB (per module) |
| L3 Cache | 4 MB (shared) | 9 MB (shared) |
| Memory Support | LPDDR5 | LPDDR5X |
| Memory Bus | Dual-channel | Triple-channel |
| Memory Bandwidth | 88.0 GB/s | 228.6 GB/s |
| PCIe | Gen 3, 4 Lanes (CPU only) | Gen 5, 12 Lanes (CPU only) |
| Integrated Graphics | Radeon 610M | Adreno X2-90 |
| Release Date | 2025-09-30 | 2026-04-05 |
| Part Number | unknown | X2E94100 |
Both processors share the same foundry (TSMC), lack ECC memory support, have no unlocked multiplier, and are listed as Active in production. Neither has a launch MSRP in the database. The AMD chip has a recorded percentile of 74 and an average benchmark score of 20137, while the Qualcomm chip has a percentile of 50 and an average score of 0.