AMD Ryzen 3 30 vs Qualcomm Snapdragon X2E-78-100 Comparison

FAQ

Q: What are the core and thread counts for the AMD Ryzen 3 30 and the Qualcomm Snapdragon X2E-78-100?

A: The AMD Ryzen 3 30 has 4 cores and 8 threads. The Qualcomm Snapdragon X2E-78-100 has 12 cores and 12 threads.

Q: What are the base clock speeds of these two processors?

A: The AMD Ryzen 3 30 has a base clock of 2.40 GHz. The Qualcomm Snapdragon X2E-78-100 has a base clock of 4.00 GHz. The Qualcomm part does not list a boost clock in the database, while the AMD part boosts to 4.10 GHz.

Q: How does the memory bandwidth compare between the two?

A: The AMD Ryzen 3 30 supports LPDDR5 memory with a bandwidth of 88.0 GB/s. The Qualcomm Snapdragon X2E-78-100 supports LPDDR5X memory with a bandwidth of 152.4 GB/s, which is significantly higher.

Q: What process nodes are used for each chip?

A: The AMD Ryzen 3 30 is built on a 6 nm process at TSMC. The Qualcomm Snapdragon X2E-78-100 is built on a 3 nm process, also at TSMC.

Q: What is the production status and release date for each?

A: Both processors are listed as Active in production status. The AMD Ryzen 3 30 has a release date of 2025-09-30, while the Qualcomm Snapdragon X2E-78-100 has a release date of 2026-04-05.

Q: Do either of these processors support ECC memory?

A: No, neither the AMD Ryzen 3 30 nor the Qualcomm Snapdragon X2E-78-100 supports ECC memory.

The Verdict

The recorded data indicates a clear division of strengths. The AMD Ryzen 3 30 is the only one of the two with benchmark scores in the database. It posts an average benchmark score of 20137, with a percentile ranking of 74 among all CPUs. Its nearest rivals include the Intel Core Ultra 7 165U with an average score of 20249 (a delta of -0.6%), the Intel Core i7-9700K with 20271 (delta -0.7%), and the AMD EPYC 7713P with 20024 (delta 0.6%). This places the AMD part in established performance territory, trading blows with these desktop and mobile chips.

The Qualcomm Snapdragon X2E-78-100 has no benchmark data recorded. Its average benchmark score is 0, and its percentile ranking is 50. The database contains no head-to-head benchmark results, no wins for either part, and no rival comparisons for the Qualcomm chip. This makes any direct performance verdict impossible from the available measurements.

Based strictly on the data, the AMD Ryzen 3 30 is the only processor with verified performance figures. It sits in the mid-range of the database's CPU rankings, competing closely with the Intel Core Ultra 7 165U and Intel Core i7-9700K. The Qualcomm part cannot be evaluated for performance from the current records. The AMD chip also carries a much lower TDP of 15 watts, which is notable for mobile workloads. The Qualcomm part has no TDP listed in the database.

For use cases where a measured performance profile matters, the AMD Ryzen 3 30 is the only choice supported by data. For scenarios where the 12-core, 3 nm Qualcomm design might be attractive, the lack of benchmark results means no analysis can be made from this database.

Head-to-Head Benchmarks

The database contains no head-to-head benchmark entries for these two processors. The winsA and winsB fields are both set to 0, confirming that no direct comparison tests are recorded. This absence of data is itself a significant finding.

The AMD Ryzen 3 30 has a full suite of PassMark benchmark scores. Its multithread score is 9027, its single-thread score is 2465, and its floating point math score is 14448. The integer math score is 29846. Data compression results show 135834, while data encryption shows 6461. Extended instructions score 6075, find prime numbers score 20, physics score 436, and random string sorting score 14431.

The Qualcomm Snapdragon X2E-78-100 has an empty benchmarks array. There are no scores for any test category, no single-thread result, no multithread result, and no math or encryption figures. The average benchmark score of 0 confirms that no measurements exist in the database for this processor.

Without any head-to-head measurements, the biggest wins in either direction cannot be quantified. The data simply does not support a comparison of benchmark outcomes. The AMD part has real, recorded scores; the Qualcomm part has none. Any statement about which one wins a specific test would be speculation, which the database cannot support.

Specification Differences

The two processors differ across nearly every recorded specification field.

The AMD Ryzen 3 30 uses 4 cores and 8 threads. The Qualcomm Snapdragon X2E-78-100 uses 12 cores and 12 threads. The AMD base clock is 2.40 GHz with a boost clock of 4.10 GHz. The Qualcomm base clock is 4.00 GHz with no boost clock listed.

The AMD part has a TDP of 15 watts. The Qualcomm part has no TDP value in the database.

The AMD socket is AMD Socket FT6. The Qualcomm socket is Qualcomm BGA 2343.

The AMD architecture is Zen 2 with the codename Mendocino. The Qualcomm architecture is not listed, but its codename is Glymur.

The process nodes differ substantially. AMD uses 6 nm at TSMC. Qualcomm uses 3 nm, also at TSMC. The die size also differs: AMD is 100 mm², while Qualcomm is 220 mm².

Cache layouts are completely different. The AMD chip has 64 KB of L1 per core, 512 KB of L2 per core, and 4 MB of shared L3. The Qualcomm chip has 288 KB of L1 per core and 16 MB of shared L2. The Qualcomm part has no L3 cache listed.

Memory support differs. AMD uses LPDDR5 with dual-channel support and 88.0 GB/s bandwidth. Qualcomm uses LPDDR5X with dual-channel support and 152.4 GB/s bandwidth.

PCIe support differs as well. AMD has PCIe Gen 3 with 4 lanes (CPU only). Qualcomm has PCIe Gen 5 with 12 lanes (CPU only).

Integrated graphics are different. AMD uses Radeon 610M. Qualcomm uses Adreno X2-85.

The market segment for both is mobile. Both have active production status. Neither has a multiplier unlocked. The AMD part number is unknown; the Qualcomm part number is X2E78100.

Architecture Differences

The architecture gap between these two processors is substantial, based on the recorded fields.

The AMD Ryzen 3 30 uses the Zen 2 architecture, specifically from the Mendocino codename. It is a 4-core, 8-thread design on a 6 nm process. The die size is 100 mm². The cache hierarchy uses per-core L1 and L2, with a shared 4 MB L3 cache. This is a compact, power-efficient design with a 15 watt TDP, suitable for thin mobile devices.

The Qualcomm Snapdragon X2E-78-100 uses a 12-core, 12-thread design on a 3 nm process. Its die size is 220 mm², more than double the AMD chip. The cache structure is notably different: 288 KB of L1 per core and a large 16 MB shared L2 cache. There is no L3 cache listed. The base clock of 4.00 GHz is significantly higher than the AMD part's 2.40 GHz base.

The manufacturing process difference is meaningful. The 3 nm node used by Qualcomm is denser and more advanced than the 6 nm node used by AMD. Both are fabricated by TSMC, but the transistor density and power characteristics of the newer node are different.

The memory architecture also differs at the system level. The Qualcomm part supports LPDDR5X with 152.4 GB/s of bandwidth, which is 73% higher than the AMD part's 88.0 GB/s over LPDDR5. This gives the Qualcomm design a substantial memory throughput advantage, which matters for workloads that are memory-bandwidth sensitive.

The PCIe capabilities diverge sharply. The Qualcomm part offers PCIe Gen 5 with 12 lanes, while the AMD part offers PCIe Gen 3 with only 4 lanes. This affects connectivity options for storage and peripherals.

The integrated graphics also differ. AMD uses its Radeon 610M, while Qualcomm uses the Adreno X2-85. The database does not include performance figures for either graphics solution, so their relative capabilities cannot be assessed from this data.

Where Each One Wins

Based on the recorded data, the AMD Ryzen 3 30 wins in every measurable performance category, solely because it has recorded benchmark scores and the Qualcomm part does not.

The AMD chip's multithread score of 9027 and single-thread score of 2465 provide a concrete performance baseline. Its integer math score of 29846 and floating point math score of 14448 show strength in compute-heavy tasks. The data compression score of 135834 and data encryption score of 6461 indicate capability in data processing workloads.

The AMD part also wins on power efficiency as recorded. Its 15 watt TDP is the only TDP figure available in the database for either chip. For mobile devices where battery life and thermal management matter, this is a documented advantage.

The Qualcomm Snapdragon X2E-78-100 wins on raw specification counts in several areas. It has 12 cores versus 4, a 4.00 GHz base clock versus 2.40 GHz, 16 MB of shared L2 versus 512 KB per core, 152.4 GB/s memory bandwidth versus 88.0 GB/s, PCIe Gen 5 with 12 lanes versus Gen 3 with 4 lanes, and a 3 nm process versus 6 nm. These are all recorded specification differences.

However, specification advantages do not translate into measured wins in this database. The Qualcomm part has no benchmark scores, no average score, and no rival comparisons. Its percentile ranking of 50 is a default value, not a measured performance result. The AMD part's percentile ranking of 74 is backed by actual scores.

For a builder choosing between these two on the basis of this database, the AMD Ryzen 3 30 is the only option with verified performance data. The Qualcomm part's specifications suggest a different design philosophy, with more cores, higher clocks, and more memory bandwidth, but the database contains no evidence of how that translates into actual benchmark outcomes.