CPU Comparison

AMD
AMD

AMD EPYC Embedded 8224P

CORE STATE Siena
CORE SPECS 24 Cores / 48 Threads
CLOCK SPEED 2.55 Base / 3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 160W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen Embedded V2546

CORE STATE Renoir
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 3 Base / 3.95 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 35W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,187
827
cinebench_cinebench_r15_singlecore
590
116
cinebench_cinebench_r20_multicore
17,447
3,446
cinebench_cinebench_r20_singlecore
2,462
486
cinebench_cinebench_r23_multicore
41,542
8,207
cinebench_cinebench_r23_singlecore
5,864
1,158
passmark_data_compression
681,754
136,097
passmark_data_encryption
43,619
8,046
passmark_extended_instructions
46,091
8,799
passmark_find_prime_numbers
286
22
passmark_floating_point_math
120,066
18,534
passmark_integer_math
193,256
30,739
passmark_multithread
48,873
9,656
passmark_physics
4,110
441
passmark_random_string_sorting
85,505
13,926
passmark_single_thread
2,357
1,609
passmark_singlethread
2,357
1,609

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC Embedded 8224P
Embedded V2546
Core Specs
Cores
24
6 -75.0%
Threads
48
12 -75.0%
Base Clock (GHz)
2.55
3 +17.6%
Boost Clock (GHz)
3
3.95 +31.7%
Frequency (GHz)
2.55
3 +17.6%
Turbo Clock (GHz)
3
3.95 +31.7%
Multiplier
25.5
30 +17.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
8 MB (shared)
Power
TDP (W)
160
35 -78.1%
Configurable TDP
155-225 W
54 W
Architecture
Architecture
Zen 4c
Zen 2
Codename
Siena
Renoir
Generation
EPYC (Zen 4c (Siena))
Ryzen Embedded (Zen 2 (Renoir))
Process Size
5 nm
7 nm
Transistors
17,750 million
9,800 million
Die Size
2x 73 mm²
156 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
51.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP6
AMD Socket FP6
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 3, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Graphics 384SP
Other
Market
Server/Workstation
Desktop
Production Status
Active
Active
Part Number
100-000001418
100-000000246
Package
FC-LGA4844
FP6
Tj Max
105°C
Bundled Cooler
None
View EPYC Embedded 8224P Details View Ryzen Embedded V2546 Details