CPU Comparison

A

AMD

AMD

AMD EPYC Embedded 8224P

CORE STATE Siena

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.55 Base / 3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 160W

ARCHITECTURE Zen 4c

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,187

4,456

cinebench_cinebench_r15_singlecore

590

629

cinebench_cinebench_r20_multicore

17,447

18,569

cinebench_cinebench_r20_singlecore

2,462

2,621

cinebench_cinebench_r23_multicore

41,542

44,213

cinebench_cinebench_r23_singlecore

5,864

6,241

passmark_data_compression

681,754

641,407

passmark_data_encryption

43,619

33,060

passmark_extended_instructions

46,091

52,214

passmark_find_prime_numbers

286

285

passmark_floating_point_math

120,066

120,557

passmark_integer_math

193,256

191,369

passmark_multithread

48,873

52,005

passmark_physics

4,110

3,311

passmark_random_string_sorting

85,505

71,439

passmark_single_thread

2,357

4,132

passmark_singlethread

2,357

4,132

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC Embedded 8224P

AI Max+ PRO 395

Core Specs

Cores

24

16 -33.3%

Threads

48

32 -33.3%

Base Clock (GHz)

2.55

3 +17.6%

Boost Clock (GHz)

3

5.1 +70.0%

Frequency (GHz)

2.55

3 +17.6%

Turbo Clock (GHz)

3

5.1 +70.0%

Multiplier

25.5

30 +17.6%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

64 MB (shared)

Power

TDP (W)

160

55 -65.6%

Configurable TDP

155-225 W

45-120 W

Architecture

Architecture

Zen 4c

Zen 5

Codename

Siena

Strix Halo

Generation

EPYC (Zen 4c (Siena))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

17,750 million

—

Die Size

2x 73 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Six-channel

Quad-channel

Memory Bandwidth

230.4 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP6

AMD Socket FP11

PCIe

Gen 5, 96 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Part Number

100-000001418

100-000001243

Package

FC-LGA4844

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

View EPYC Embedded 8224P Details View Ryzen AI Max+ PRO 395 Details