CPU Comparison
AMD
AMD EPYC Embedded 3451
CORE STATE
Zen
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
2.15 Base / 3 GHz Turbo
CACHE
32 MB (shared)
MAX TDP
100W
ARCHITECTURE
Zen
PROCESS
14 nm
LAUNCH DATE
2018
VS
INTEL
Core i7-8809G
CORE STATE
Kaby Lake G
CORE SPECS
4 Cores / 8 Threads
CLOCK SPEED
3.1 Base / 4.2 GHz Turbo
CACHE
8 MB (shared)
MAX TDP
65W
ARCHITECTURE
Kaby Lake
PROCESS
14 nm
LAUNCH DATE
2018
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC Embedded 3451
i7-8809G
Core Specs
Cores
16
4
-75.0%
Threads
32
8
-75.0%
Base Clock (GHz)
2.15
3.1
+44.2%
Boost Clock (GHz)
3
4.2
+40.0%
Frequency (GHz)
2.15
3.1
+44.2%
Turbo Clock (GHz)
3
4.2
+40.0%
Multiplier
21.5
31
+44.2%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
32 MB (shared)
8 MB (shared)
Power
TDP (W)
100
65
-35.0%
Configurable TDP
80-100 W
—
Architecture
Architecture
Zen
Kaby Lake
Codename
Zen
Kaby Lake G
Generation
EPYC Embedded
(Zen (Snowy Owl))
Core i7
(Kaby Lake-G)
Process Size
14 nm
14 nm
Transistors
4,800 million
—
Die Size
2x 213 mm²
—
Foundry
GlobalFoundries
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
—
Memory Bandwidth
42.7 GB/s
—
ECC Memory
Yes
No
Platform
Socket
AMD BGA SP4r2
Intel BGA 2270
PCIe
Gen 3, 64 Lanes(CPU only)
—
Graphics
Integrated Graphics
On certain motherboards (Chipset feature)
Radeon RX Vega M GH
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
PE3451BMQGAAF
—
Package
SP4
FC-BGA2270
Tj Max
105°C
—
Bundled Cooler
None
—