AMD

AMD EPYC Embedded 3451

AMD processor specifications and benchmark scores

16
Cores
32
Threads
3
GHz Boost
100W
TDP
Integrated GPU ECC Memory

At a Glance

AMD
Cores / Threads 16C / 32T
Boost Clock 3 GHz
Base Clock 2.15 GHz
L3 Cache 32 MB (shared)
TDP 100W
Architecture Zen
Socket AMD BGA SP4r2
nm
Process 14 nm
Released Feb 2018

AMD EPYC Embedded 3451 Specifications

EPYC Embedded 3451 Core Configuration

Processing cores and threading

The AMD EPYC Embedded 3451 features 16 physical cores and 32 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
16
Threads
32
SMP CPUs
1

EPYC Embedded 3451 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in EPYC Embedded 3451 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The EPYC Embedded 3451 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.15 GHz
Boost Clock
3 GHz
All-Core Turbo
2.45 GHz
Multiplier
21.5x

AMD's EPYC Embedded 3451 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the EPYC Embedded 3451 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The EPYC Embedded 3451's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
96 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
32 MB (shared)

Zen Architecture & Process

Manufacturing and design details

The AMD EPYC Embedded 3451 is built on AMD's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in EPYC Embedded 3451 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen
Codename
Zen
Process Node
14 nm
Foundry
GlobalFoundries
Transistors
4,800 million
Die Size
2x 213 mm²
Generation
EPYC Embedded (Zen (Snowy Owl))

Zen Instruction Set Features

Supported CPU instructions and extensions

The EPYC Embedded 3451 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
XFR

EPYC Embedded 3451 Power & Thermal

TDP and power specifications

The AMD EPYC Embedded 3451 has a TDP (Thermal Design Power) of 100W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
100W
Tj Max
105°C
Configurable TDP
80-100 W

AMD BGA SP4r2 Platform & Socket

Compatibility information

The EPYC Embedded 3451 uses the AMD BGA SP4r2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD BGA SP4r2
PCIe
Gen 3, 64 Lanes(CPU only)
Package
SP4
DDR5

AMD BGA SP4r2 Memory Support

RAM compatibility and speeds

Memory support specifications for the EPYC Embedded 3451 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the EPYC Embedded 3451 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
Memory Bus
Dual-channel
Memory Bandwidth
42.7 GB/s
ECC Memory
Supported

AMD's EPYC Embedded 3451 Integrated Graphics

Built-in GPU specifications

The AMD EPYC Embedded 3451 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the EPYC Embedded 3451 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

EPYC Embedded 3451 Product Information

Release and pricing details

The AMD EPYC Embedded 3451 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the EPYC Embedded 3451 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Feb 2018
Market
Server/Workstation
Status
Active
Part Number
PE3451BMQGAAF
Bundled Cooler
None

EPYC Embedded 3451 Benchmark Scores

No benchmark data available for this CPU.

About AMD EPYC Embedded 3451

Platform and Compatibility

The AMD EPYC Embedded 3451 is built on the Zen architecture (codename Snowy Owl) and belongs to the EPYC 3001 series. It uses a 14 nm process node from GlobalFoundries, with a transistor count of 4,800 million spread across a dual-die design measuring 2x 213 mm². The processor is physically mounted via the AMD BGA SP4r2 socket, which is a ball-grid-array package designed for embedded and edge-server applications rather than traditional socketed desktop platforms.

Memory support is limited to DDR4, operating through a dual-channel memory bus. The theoretical memory bandwidth is rated at 42.7 GB/s. ECC memory is supported, making this platform suitable for error-sensitive workloads such as data integrity tasks in storage servers or network appliances. The memory controller is integrated, and the platform does not appear to support higher-capacity or higher-bandwidth memory standards beyond what the dual-channel DDR4 configuration provides.

For expansion, the EPYC Embedded 3451 provides PCI-Express Gen 3 connectivity with 64 lanes available from the CPU itself. This is a substantial lane count for an embedded processor, allowing multiple high-throughput devices such as network interface cards, NVMe storage controllers, or accelerators to be connected directly without a separate chipset. The integrated graphics capability is described as "on certain motherboards," indicating that the GPU functionality is a chipset feature rather than a core-level component. This means the platform can support display output in specific board designs, but it is not a guaranteed feature across all implementations.

The production status is listed as Active, with a release date of February 20, 2018. The processor is not multiplier-unlocked, so overclocking is not an intended use case. The part number is PE3451BMQGAAF. For upgrade paths, the BGA socket implies a soldered or fixed mounting, meaning the CPU itself is not user-replaceable. Any upgrade would require a full motherboard change, and the platform is tied to the EPYC 3001 series, so the practical upgrade path is limited to selecting a different processor within that same embedded family at the time of system design.

Who Should Consider It

The EPYC Embedded 3451 is a 16-core, 32-thread processor with a base clock of 2.15 GHz and a boost clock of 3.00 GHz. Its thermal design power is 100 W. Given the core count and thread count, the processor is clearly oriented toward multi-threaded server and workstation workloads. The benchmark data shows a percentile rank of 50 among all CPUs, placing it at the median of the overall performance distribution. This suggests it is neither a top-tier performer nor a low-end part, but rather a solid mid-range offering within the broader CPU landscape.

For gaming, this processor is not an ideal choice. The base clock of 2.15 GHz is modest, and while the boost clock reaches 3.00 GHz, modern gaming workloads typically favor higher single-thread frequencies over high core counts. The lack of integrated graphics on the CPU itself (relying on motherboard chipset features) means a discrete GPU is mandatory, which is typical for server platforms. The data does not indicate any gaming-specific optimizations, and the market segment is listed as Server/Workstation. Therefore, gamers would likely find more suitable options elsewhere.

For content creation and professional workloads, the 16 cores and 32 threads are a strong asset. Tasks such as video rendering, 3D modeling, software compilation, and scientific simulations that scale across multiple threads would benefit from the high core count. The ECC memory support adds reliability for long-running render jobs or data processing tasks where memory errors could corrupt output. The dual-channel memory bandwidth of 42.7 GB/s is adequate for many creation tasks, though it may be a bottleneck for memory-bandwidth-intensive workloads that prefer quad-channel configurations.

For office and general productivity, the processor is overkill in core count but adequate in clock speed. Single-threaded office applications would see moderate performance from the 3.00 GHz boost clock, but the platform costs and embedded nature make it impractical for typical office desktops. The target use case is clearly embedded servers, network appliances, storage arrays, and edge computing devices where the 64 PCIe Gen 3 lanes and ECC support are more valuable than raw single-thread speed.

Single-Thread vs Multi-Thread Behavior

The EPYC Embedded 3451 presents a clear trade-off between single-thread and multi-thread performance. With a base clock of 2.15 GHz and a boost clock of 3.00 GHz, the single-thread performance is modest by modern standards. The Zen architecture, while efficient for its time, does not reach the high clock speeds typical of later architectures. This means single-threaded workloads, such as legacy database queries, certain scripting workloads, or lightly threaded applications, will not see exceptional performance. The percentile rank of 50 suggests that in mixed workloads, the processor sits at the median, but this is largely due to its multi-thread capabilities pulling the overall score up.

Multi-thread performance is where this processor excels. With 16 physical cores and 32 threads via simultaneous multithreading, the EPYC Embedded 3451 can handle heavily parallel workloads with ease. The 32 MB shared L3 cache is distributed across the two dies, providing a substantial pool for frequently accessed data. The dual-die design (2x 213 mm²) means that cross-die communication may introduce some latency, but for workloads that are well-partitioned, the scaling should be near-linear. The 100 W TDP is reasonable for a 16-core part, indicating that the chip is not thermally constrained in most embedded chassis designs.

For real-world workloads, the split means that users should prioritize multi-threaded applications. A web server handling many concurrent requests, a virtualization host running multiple VMs, or a network packet processing appliance would all benefit from the thread count. Conversely, a single-threaded application like an older CAD tool that cannot utilize multiple cores would run at roughly 3.00 GHz, which is acceptable but not competitive with high-clock desktop parts. The 42.7 GB/s memory bandwidth is shared across all cores, so memory-hungry multi-threaded workloads may see diminishing returns beyond a certain point, but for typical embedded server tasks, the balance is reasonable.

The cache hierarchy, 96 KB L1 per core, 512 KB L2 per core, and 32 MB shared L3, provides a solid foundation for both single- and multi-threaded operations. The per-core L1 and L2 caches are generous, reducing memory latency for frequently used data. The shared L3 is relatively large for the era, helping with inter-core data sharing in multi-threaded workloads. However, the dual-die design means that the L3 is not fully shared across all 16 cores; each die has its own portion, and cross-die access is slower. This is a subtle but important detail for workloads that require heavy inter-thread communication.

FAQ

Q: What socket does the AMD EPYC Embedded 3451 use?

A: The processor uses the AMD BGA SP4r2 socket, which is a ball-grid-array design meant for embedded applications.

Q: Does the EPYC Embedded 3451 support ECC memory?

A: Yes, ECC memory is supported, which is critical for data integrity in server and workstation environments.

Q: How many PCIe lanes does the processor provide?

A: The CPU provides 64 PCI-Express Gen 3 lanes, enabling direct connection of many high-bandwidth devices.

Q: What is the memory configuration for this processor?

A: It supports DDR4 memory through a dual-channel bus, with a theoretical bandwidth of 42.7 GB/s.

Q: Is the EPYC Embedded 3451 overclockable?

A: No, the multiplier is locked, and the processor is not designed for overclocking.

Q: Does the processor have integrated graphics?

A: Integrated graphics are available only on certain motherboards as a chipset feature, not as an on-chip component.

Q: What is the manufacturing process for this chip?

A: It is fabricated on a 14 nm process at GlobalFoundries, with 4,800 million transistors across two dies.

Q: When was this processor released?

A: The release date was February 20, 2018, and the production status is currently Active.

How It Compares

The FACT PACK does not provide any nearest rival entries for the EPYC Embedded 3451. The nearestRivals field is empty, and the benchmarks array is also empty, with an average benchmark score of 0. The percentile rank of 50 indicates that the processor sits at the exact median of all CPUs in the database, but without specific rival data, a direct comparison to other embedded or server processors is not possible from the given information.

Given the lack of direct comparison data, the analysis must rely on the processor's own specifications. The 16 cores and 32 threads place it in a segment where competing parts would likely offer similar core counts. The 100 W TDP is a distinguishing factor, many 16-core server parts consume more power, so this chip may be more efficient per watt, though no efficiency figures are provided. The 64 PCIe Gen 3 lanes are a notable feature, as many embedded processors offer fewer lanes. The dual-channel memory bus is a limitation compared to quad-channel server platforms, which would offer higher aggregate bandwidth.

The absence of benchmark scores means that the percentile rank of 50 is the only performance indicator. This rank suggests that the EPYC Embedded 3451 is neither a standout performer nor a laggard. For users comparing this chip to alternatives, the key differentiators would be the embedded socket (BGA SP4r2), the ECC support, the high PCIe lane count, and the relatively low TDP for a 16-core part. Without rival data, the recommendation is to evaluate the processor based on its fit for specific embedded workloads, particularly those needing many threads, high I/O connectivity, and reliable memory, rather than on raw performance comparisons.

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