CPU Comparison
AMD
AMD EPYC Embedded 3151
CORE STATE
Zen
CORE SPECS
4 Cores / 8 Threads
CLOCK SPEED
2.7 Base / 2.9 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
45W
ARCHITECTURE
Zen
PROCESS
14 nm
LAUNCH DATE
2018
VS
INTEL
Core i7-8706G
CORE STATE
Kaby Lake G
CORE SPECS
4 Cores / 8 Threads
CLOCK SPEED
3.1 Base / 4.1 GHz Turbo
CACHE
8 MB (shared)
MAX TDP
65W
ARCHITECTURE
Kaby Lake
PROCESS
14 nm
LAUNCH DATE
2018
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC Embedded 3151
i7-8706G
Core Specs
Cores
4
4
0.0%
Threads
8
8
0.0%
Base Clock (GHz)
2.7
3.1
+14.8%
Boost Clock (GHz)
2.9
4.1
+41.4%
Frequency (GHz)
2.7
3.1
+14.8%
Turbo Clock (GHz)
2.9
4.1
+41.4%
Multiplier
27
31
+14.8%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
16 MB (shared)
8 MB (shared)
Power
TDP (W)
45
65
+44.4%
Architecture
Architecture
Zen
Kaby Lake
Codename
Zen
Kaby Lake G
Generation
EPYC Embedded
(Zen (Snowy Owl))
Core i7
(Kaby Lake-G)
Process Size
14 nm
14 nm
Transistors
4,800 million
—
Die Size
213 mm²
—
Foundry
GlobalFoundries
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
—
Memory Bandwidth
42.7 GB/s
—
ECC Memory
Yes
No
Platform
Socket
AMD BGA SP4r2
Intel BGA 2270
PCIe
Gen 3, 32 Lanes(CPU only)
—
Graphics
Integrated Graphics
On certain motherboards (Chipset feature)
Radeon RX Vega M GL
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
PE3151BKR48AF
—
Package
SP4r2
FC-BGA2270
Tj Max
95°C
—
Bundled Cooler
None
—