AMD EPYC Embedded 3151

The AMD EPYC Embedded 3151 is a 4-core, 8-thread processor in the EPYC 3001 series, built on the 14 nm GlobalFoundries process with 4,800 million transistors on a 213 mm² die. It uses the Zen architecture and belongs to the EPYC Embedded (Zen (Snowy Owl)) generation. The chip targets the server/workstation market segment, fits the AMD BGA SP4r2 socket, and runs at a base clock of 2.70 with a boost clock of 2.90. Its TDP is 45, it was released on 2018-02-20, and it remains in active production. The supplied data has an empty benchmark array, an avgBenchmarkScore of 0, and an empty nearestRivals list. The only ranking signal is percentileVsAllCpus, which is 50.

Who Should Consider It

Because no scored benchmarks are included, workload guidance must come from the listed feature set rather than measured performance. The 4-core, 8-thread configuration, the 2.70 base clock, and the 2.90 boost clock define a moderate parallel processor. The dual-channel DDR4 memory interface supports ECC memory and provides 42.7 GB/s of bandwidth, which matters for server and workstation environments where data integrity is important. The PCIe interface is Gen 3 with 32 lanes from the CPU only, so expansion and storage devices can use a substantial number of lanes without depending on platform additions.

Server deployments that can spread work across 8 threads are a natural fit. The 45 W TDP keeps the thermal envelope low for embedded infrastructure, and the server/workstation market segment confirms the intended use. Workstation nodes that need ECC memory, a dual-channel memory bus, and a moderate thread count can use this processor in a compact platform. Lightly threaded server tasks will be limited by the 2.90 boost clock, but the 8-thread count gives parallel workloads room to move.

For gaming, the integrated graphics field is listed as a chipset feature on certain motherboards, not as a guaranteed CPU feature. That means a separate graphics solution is required for any gaming workload, and no gaming score is present in the data. Content-creation workloads that scale across 8 threads can use the full thread pool, the shared 16 MB L3, and the 42.7 GB/s dual-channel memory bandwidth. Heavily parallel rendering or export tasks are better aligned with the processor than lightly threaded creation tools, which will depend on the 2.90 boost ceiling. Office-style workloads are not benchmarked here, but the 4 cores and 8 threads can handle concurrent productivity processes; the platform orientation is embedded server/workstation hardware rather than a standard desktop office part.

How It Compares

The nearestRivals list is empty, so there are no named competitor processors, no rival scores, and no deltaPct values to cite. The only positional fact is percentileVsAllCpus = 50, which places the EPYC Embedded 3151 at the midpoint of the aggregate CPU ranking in the database. In the absence of nearest-rival entries, the data supports neither an “ahead” nor “behind” claim against any specific processor. The comparison picture is therefore a median position with no directionality: the 50th percentile shows an even split in the overall CPU distribution, but the magnitude and direction of any gap to a particular rival are unknown.

Power and Thermals

The TDP of 45 places this part in a low-power class for the server/workstation segment. The 14 nm GlobalFoundries process, the 213 mm² die, and the 4,800 million transistor count are the physical details behind that envelope. The socket is AMD BGA SP4r2, a BGA platform, which means the thermal solution is board-level and tied to the embedded system design. The data does not specify a cooler size or thermal solution rating, so the 45 W TDP is the only thermal specification available. That TDP suggests a modest cooling requirement, with the exact tier dependent on the chassis and motherboard layout. The multiplier is locked, so user overclocking is not an available thermal variable.

FAQ

Q: How many cores and threads does the EPYC Embedded 3151 have?

A: It has 4 cores and 8 threads.

Q: What memory, cache, and PCIe support does it have?

A: It supports DDR4 memory on a dual-channel bus with 42.7 GB/s of bandwidth and ECC memory. Cache is 96 KB L1 per core, 512 KB L2 per core, and 16 MB shared L3. PCIe is Gen 3 with 32 lanes from the CPU only.

Q: What socket does it use?

A: It uses the AMD BGA SP4r2 socket.

Q: Does it have integrated graphics?

A: Integrated graphics are listed as a chipset feature available on certain motherboards, not as a guaranteed CPU feature.

Q: Is the multiplier unlocked?

A: No, multiplierUnlocked is false.

Q: When was it released?

A: It was released on 2018-02-20.

Single-Thread vs Multi-Thread Behavior

Single-thread behavior is anchored by the base clock of 2.70 and the boost clock of 2.90. Because the two clock values are close, the processor has a narrow boost window for lightly threaded work. The locked multiplier means that boost window cannot be extended by user configuration. For workloads that rely on a single thread, the 2.90 boost clock is the practical maximum, while the 2.70 base clock is the sustained lower point.

Multi-thread behavior is anchored by 8 threads over 4 cores and the shared 16 MB L3 cache. Workloads that use all threads can draw on the full thread pool, and the dual-channel DDR4 bus supplies 42.7 GB/s for concurrent memory traffic. The L1 and L2 caches are per-core, so each core has dedicated fast storage, while the L3 is shared across the processor. With an aggregate percentile of 50 and no separate single-thread or multi-thread scores, the exact split between those two behaviors is not measured in the data. What the data does show is a processor with a thread count double its core count, a shared L3 cache, and a modest boost ceiling. That combination points to workloads that can distribute work across all 8 threads, rather than workloads that need a large single-core burst above the 2.90 boost clock.