CPU Comparison

AMD
AMD

AMD EPYC 9845

CORE STATE Turin
CORE SPECS 160 Cores / 320 Threads
CLOCK SPEED 2.1 Base / 3.7 GHz Turbo
CACHE 320 MB (shared)
MAX TDP 390W
ARCHITECTURE Zen 5
nm
PROCESS 3 nm
LAUNCH DATE 2024
VS
AMD
AMD

Ryzen AI Max 385

CORE STATE Strix Halo
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
13,107
1,579
cinebench_cinebench_r15_singlecore
1,850
222
cinebench_cinebench_r20_multicore
54,615
6,583
cinebench_cinebench_r20_singlecore
7,710
929
cinebench_cinebench_r23_multicore
130,037
15,674
cinebench_cinebench_r23_singlecore
18,358
2,212
passmark_data_compression
4,680,013
224,838
passmark_data_encryption
296,808
10,491
passmark_extended_instructions
314,798
19,254
passmark_find_prime_numbers
1,255
100
passmark_floating_point_math
978,377
37,490
passmark_integer_math
1,687,531
54,901
passmark_multithread
152,985
18,441
passmark_physics
19,631
1,429
passmark_random_string_sorting
538,060
23,526
passmark_single_thread
3,144
2,056
passmark_singlethread
3,144
2,056

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 9845
AI Max 385
Core Specs
Cores
160
8 -95.0%
Threads
320
16 -95.0%
Base Clock (GHz)
2.1
3.6 +71.4%
Boost Clock (GHz)
3.7
5 +35.1%
Frequency (GHz)
2.1
3.6 +71.4%
Turbo Clock (GHz)
3.7
5 +35.1%
Multiplier
21
36 +71.4%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
320 MB (shared)
32 MB (shared)
Power
TDP (W)
390
55 -85.9%
Configurable TDP
320-400 W
45-120 W
Architecture
Architecture
Zen 5
Zen 5
Codename
Turin
Strix Halo
Generation
EPYC (Zen 5c (Turin))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
3 nm
4 nm
Die Size
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Twelve-channel
Quad-channel
Memory Bandwidth
576.0 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP5
AMD Socket FP11
PCIe
Gen 5, 128 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Interconnect
CXL
Gen 2.0
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8050S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$13564
Part Number
100-000001458
100-000001424
Package
FC-LGA6096
FC-BGA
Tj Max
100°C
View EPYC 9845 Details View Ryzen AI Max 385 Details