CPU Comparison

A

AMD

AMD

AMD EPYC 9754

CORE STATE Bergamo

CORE SPECS 128 Cores / 256 Threads

CLOCK SPEED 2.25 Base / 3.1 GHz Turbo

CACHE 256 MB (shared)

MAX TDP 360W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI 9 HX 370

CORE STATE Strix Point

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 2000 Base / 5.1 GHz Turbo

CACHE 16 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE —

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

8,460

3,010

cinebench_cinebench_r15_singlecore

1,194

425

cinebench_cinebench_r20_multicore

35,254

12,545

cinebench_cinebench_r20_singlecore

4,977

1,771

cinebench_cinebench_r23_multicore

83,939

29,870

cinebench_cinebench_r23_singlecore

11,850

4,217

passmark_data_compression

3,558,043

445,719

passmark_data_encryption

231,891

22,252

passmark_extended_instructions

224,322

31,653

passmark_find_prime_numbers

604

126

passmark_floating_point_math

588,187

76,892

passmark_integer_math

1,026,896

122,933

passmark_multithread

98,752

35,148

passmark_physics

8,793

1,881

passmark_random_string_sorting

306,481

48,723

passmark_single_thread

2,328

3,973

passmark_singlethread

2,328

3,973

3dmark_16_threads

N/A

9,365

3dmark_2_threads

N/A

2,179

3dmark_4_threads

N/A

3,970

3dmark_8_threads

N/A

6,992

3dmark_max_threads

N/A

9,725

3dmark_single_thread

N/A

1,153

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 9754

AI 9 HX 370

Core Specs

Cores

128

12 -90.6%

Threads

256

24 -90.6%

Base Clock (GHz)

2.25

2,000 +88788.9%

Boost Clock (GHz)

3.1

5.1 +64.5%

Frequency (GHz)

2.25

2,000 +88788.9%

Turbo Clock (GHz)

3.1

5.1 +64.5%

Multiplier

22.5

20 -11.1%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

256 MB (shared)

16 MB

Power

TDP (W)

360

28 -92.2%

Configurable TDP

320-400 W

15-54 W

Architecture

Architecture

Zen 4

Zen 5

Codename

Bergamo

Strix Point

Generation

EPYC (Zen 4c (Bergamo))

Ryzen AI (Zen 5)

Process Size

5 nm

4 nm

Transistors

71,000 million

—

Die Size

8x 73 mm²

233 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5, LPDDR5X

Memory Bus

Twelve-channel

Dual-channel

Memory Bandwidth

460.8 GB/s

89.6 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket SP5

AMD Socket FP8

PCIe

Gen 5, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

4 + 8

E-Core Frequency

—

1400 MHz up to 3.3 GHz

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 890M

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$11900

—

Part Number

100-000001234

100-000000994

Package

FC-LGA6096

FP8

Tj Max

—

100°C

Bundled Cooler

None

—

View EPYC 9754 Details View Ryzen AI 9 HX 370 Details