CPU Comparison

A

AMD

AMD

AMD EPYC 8324P

CORE STATE Siena

CORE SPECS 32 Cores / 64 Threads

CLOCK SPEED 2.65 Base / 3 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 180W

ARCHITECTURE Zen 4c

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,894

2,865

cinebench_cinebench_r15_singlecore

690

404

cinebench_cinebench_r20_multicore

20,393

11,938

cinebench_cinebench_r20_singlecore

2,879

1,685

cinebench_cinebench_r23_multicore

48,557

28,424

cinebench_cinebench_r23_singlecore

6,855

4,012

passmark_data_compression

980,907

399,839

passmark_data_encryption

63,195

19,947

passmark_extended_instructions

60,304

33,915

passmark_find_prime_numbers

347

169

passmark_floating_point_math

139,022

72,648

passmark_integer_math

248,447

108,717

passmark_multithread

57,127

33,441

passmark_physics

4,637

1,772

passmark_random_string_sorting

113,610

41,537

passmark_single_thread

2,367

4,052

passmark_singlethread

2,367

4,052

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 8324P

AI Max PRO 385

Core Specs

Cores

32

8 -75.0%

Threads

64

16 -75.0%

Base Clock (GHz)

2.65

3.6 +35.8%

Boost Clock (GHz)

3

5 +66.7%

Frequency (GHz)

2.65

3.6 +35.8%

Turbo Clock (GHz)

3

5 +66.7%

Multiplier

26.5

36 +35.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

128 MB (shared)

32 MB (shared)

Power

TDP (W)

180

55 -69.4%

Configurable TDP

155-225 W

45-120 W

Architecture

Architecture

Zen 4c

Zen 5

Codename

Siena

Strix Halo

Generation

EPYC (Zen 4c (Siena))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

35,500 million

—

Die Size

4x 73 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Six-channel

Quad-channel

Memory Bandwidth

230.4 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP6

AMD Socket FP11

PCIe

Gen 5, 96 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$1895

—

Part Number

100-000001133

100-000001422

Package

FC-LGA4844

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

View EPYC 8324P Details View Ryzen AI Max PRO 385 Details