CPU Comparison
AMD
AMD EPYC 8324P
CORE STATE
Siena
CORE SPECS
32 Cores / 64 Threads
CLOCK SPEED
2.65 Base / 3 GHz Turbo
CACHE
128 MB (shared)
MAX TDP
180W
ARCHITECTURE
Zen 4c
PROCESS
5 nm
LAUNCH DATE
2023
VS
INTEL
Core i7-14650HX
CORE STATE
Raptor Lake-HX
CORE SPECS
16 Cores / 24 Threads
CLOCK SPEED
2.2 Base / 5.2 GHz Turbo
CACHE
30 MB (shared)
MAX TDP
55W
ARCHITECTURE
Raptor Lake
PROCESS
10 nm
LAUNCH DATE
2024
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 8324P
i7-14650HX
Core Specs
Cores
32
16
-50.0%
Threads
64
24
-62.5%
Base Clock (GHz)
2.65
2.2
-17.0%
Boost Clock (GHz)
3
5.2
+73.3%
Frequency (GHz)
2.65
2.2
-17.0%
Turbo Clock (GHz)
3
5.2
+73.3%
Multiplier
26.5
22
-17.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
128 MB (shared)
30 MB (shared)
Power
TDP (W)
180
55
-69.4%
PL1
—
55 W
PL2
—
157 W
Configurable TDP
155-225 W
—
Architecture
Architecture
Zen 4c
Raptor Lake
Codename
Siena
Raptor Lake-HX
Generation
EPYC
(Zen 4c (Siena))
Core i7
(Raptor Lake-HX Refresh)
Process Size
5 nm
10 nm
Transistors
35,500 million
—
Die Size
4x 73 mm²
257 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
—
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
DDR5 Speed
—
5600 MT/s
Platform
Socket
AMD Socket SP6
Intel BGA 1964
Chipsets
—
WM790, HM770
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
P-Cores: 8
E-Cores: 8
E-Core Frequency
—
1600 MHz
up to 3.7 GHz
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
—
UHD Graphics 710
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$1895
—
Part Number
100-000001133
SRMXH
Package
FC-LGA4844
FC-BGA16F
Tj Max
—
100°C
Bundled Cooler
None
—