CPU Comparison

AMD
AMD

AMD EPYC 7713P

CORE STATE Milan
CORE SPECS 64 Cores / 128 Threads
CLOCK SPEED 2000 Base / 3.68 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 225W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2021
VS
AMD
AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3 Base / 5.1 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
6,978
4,456
cinebench_cinebench_r15_singlecore
984
629
cinebench_cinebench_r20_multicore
29,076
18,569
cinebench_cinebench_r20_singlecore
4,104
2,621
cinebench_cinebench_r23_multicore
69,229
44,213
cinebench_cinebench_r23_singlecore
9,773
6,241
passmark_data_compression
N/A
641,407
passmark_data_encryption
N/A
33,060
passmark_extended_instructions
N/A
52,214
passmark_find_prime_numbers
N/A
285
passmark_floating_point_math
N/A
120,557
passmark_integer_math
N/A
191,369
passmark_multithread
N/A
52,005
passmark_physics
N/A
3,311
passmark_random_string_sorting
N/A
71,439
passmark_single_thread
N/A
4,132
passmark_singlethread
N/A
4,132

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7713P
AI Max+ PRO 395
Core Specs
Cores
64
16 -75.0%
Threads
128
32 -75.0%
Base Clock (GHz)
2,000
3 -99.9%
Boost Clock (GHz)
3.68
5.1 +38.6%
Frequency (GHz)
2,000
3 -99.9%
Turbo Clock (GHz)
3.68
5.1 +38.6%
Multiplier
20
30 +50.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
256 MB (shared)
64 MB (shared)
Power
TDP (W)
225
55 -75.6%
Configurable TDP
240 W
45-120 W
Architecture
Architecture
Zen 3
Zen 5
Codename
Milan
Strix Halo
Generation
EPYC (Zen 3 (Milan))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
7 nm
4 nm
Transistors
33,200 million
Die Size
8x 81 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
LPDDR5X
Memory Bus
Eight-channel
Quad-channel
Memory Bandwidth
204.8 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP3
AMD Socket FP11
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
CCDs
8
Cores per CCD
8
IO Process Size
12 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8060S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$5010
Part Number
100-000000337100-000000337WOF
100-000001243
Package
FCLGA-4094
FC-BGA
Tj Max
100°C
View EPYC 7713P Details View Ryzen AI Max+ PRO 395 Details