CPU Comparison

A

AMD

AMD

AMD EPYC 7663

CORE STATE Milan

CORE SPECS 56 Cores / 112 Threads

CLOCK SPEED 2000 Base / 3.5 GHz Turbo

CACHE 256 MB (shared)

MAX TDP 240W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

A

AMD

AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

7,032

4,456

cinebench_cinebench_r15_singlecore

992

629

cinebench_cinebench_r20_multicore

29,304

18,569

cinebench_cinebench_r20_singlecore

4,137

2,621

cinebench_cinebench_r23_multicore

69,773

44,213

cinebench_cinebench_r23_singlecore

9,850

6,241

passmark_data_compression

1,447,020

641,407

passmark_data_encryption

111,725

33,060

passmark_extended_instructions

73,719

52,214

passmark_find_prime_numbers

676

285

passmark_floating_point_math

251,535

120,557

passmark_integer_math

468,096

191,369

passmark_multithread

82,087

52,005

passmark_physics

8,020

3,311

passmark_random_string_sorting

184,367

71,439

passmark_single_thread

2,606

4,132

passmark_singlethread

2,606

4,132

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 7663

AI Max+ PRO 395

Core Specs

Cores

56

16 -71.4%

Threads

112

32 -71.4%

Base Clock (GHz)

2,000

3 -99.9%

Boost Clock (GHz)

3.5

5.1 +45.7%

Frequency (GHz)

2,000

3 -99.9%

Turbo Clock (GHz)

3.5

5.1 +45.7%

Multiplier

20

30 +50.0%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

256 MB (shared)

64 MB (shared)

Power

TDP (W)

240

55 -77.1%

Configurable TDP

225 W

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Milan

Strix Halo

Generation

EPYC (Zen 3 (Milan))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

33,200 million

—

Die Size

8x 81 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Eight-channel

Quad-channel

Memory Bandwidth

204.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP3

AMD Socket FP11

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

CCDs

8

—

Cores per CCD

7

—

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$6366

—

Part Number

100-000000318100-100000318WOF

100-000001243

Package

FCLGA-4094

FC-BGA

Tj Max

—

100°C

View EPYC 7663 Details View Ryzen AI Max+ PRO 395 Details