AMD EPYC 7302P vs Intel Xeon D-2775TE Comparison

AMD
AMD

AMD EPYC 7302P

CORE STATE Rome
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3 Base / 3.3 GHz Turbo
CACHE 32 MB (per die)
MAX TDP 155W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Xeon D-2775TE

CORE STATE Ice Lake-D
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2000 Base / 3.1 GHz Turbo
CACHE 25 MB (shared)
MAX TDP 100W
ARCHITECTURE Ice Lake
nm
PROCESS 10 nm
LAUNCH DATE 2022

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,800
2,338
cinebench_cinebench_r15_singlecore
395
330
cinebench_cinebench_r20_multicore
11,670
9,745
cinebench_cinebench_r20_singlecore
1,647
1,375
cinebench_cinebench_r23_multicore
27,786
23,204
cinebench_cinebench_r23_singlecore
3,922
3,275
geekbench_multicore
7,462
N/A
geekbench_singlecore
1,114
N/A

Analysis: AMD EPYC 7302P vs Intel Xeon D-2775TE

Head-to-Head Benchmarks

The recorded data presents a remarkably consistent picture across every benchmark in the comparison set. The AMD EPYC 7302P wins all six head-to-head tests, with the margin in each case hovering just under 20 percent. The single-core Cinebench R15 test shows the EPYC 7302P scoring 395 against 330 for the Intel Xeon D-2775TE, a 19.7 percent advantage. The multi-core variant of the same test shows a nearly identical gap, with the EPYC 7302P at 2800 and the Xeon D-2775TE at 2338, a 19.8 percent difference.

Moving to Cinebench R20, the pattern holds exactly. The EPYC 7302P posts 11670 in multi-core, while the Xeon D-2775TE manages 9745, again a 19.8 percent lead. Single-core R20 results see the EPYC 7302P at 1647 versus 1375, also a 19.8 percent margin. In Cinebench R23, the multi-core score for the AMD part is 27786, compared to 23204 for the Intel part, a 19.7 percent edge. The single-core R23 test rounds out the set with the EPYC 7302P at 3922 and the Xeon D-2775TE at 3275, a 19.8 percent improvement.

The uniformity of these margins is notable. Across six separate workloads, the delta never strays beyond a tenth of a percentage point, ranging from 19.7 to 19.8 percent. This suggests the performance difference is structural rather than workload-dependent, driven by architectural and platform characteristics that affect all tested scenarios equally. The Geekbench tests were recorded only for the AMD part in this comparison, with the EPYC 7302P scoring 7462 in multi-core and 1114 in single-core, so no direct head-to-head delta is available there.

The average benchmark score from the broader database places the EPYC 7302P at 7100, against 6711 for the Xeon D-2775TE. The EPYC 7302P sits at the 63rd percentile among all CPUs in the database, while the Xeon D-2775TE sits just behind at the 62nd percentile. The nearest rivals for the AMD part include the Intel Core i9-7980XE with an average score of 7018, a 1.2 percent difference, and the Intel Xeon Platinum 8260 at 6992, a 1.6 percent difference. The Xeon D-2775TE finds its closest match in the Intel Xeon Gold 5317 at 6710, with a delta of zero, and the AMD EPYC 72F3 at 6700, a 0.2 percent difference. These positioning data confirm that while the two processors in this comparison are close in overall database rank, the EPYC 7302P consistently outpaces the Xeon D-2775TE by a substantial margin in every direct test.

FAQ

Q: Which processor has the higher single-core performance?

A: The AMD EPYC 7302P wins every recorded single-core test. In Cinebench R15 it scores 395 versus 330, in R20 it scores 1647 versus 1375, and in R23 it scores 3922 versus 3275. Each margin is between 19.7 and 19.8 percent.

Q: How do the two processors compare in multi-core workloads?

A: The AMD EPYC 7302P leads in all three multi-core Cinebench tests. The R15 multi-core score is 2800 against 2338, the R20 multi-core score is 11670 against 9745, and the R23 multi-core score is 27786 against 23204. The advantage is approximately 19.7 to 19.8 percent in each case.

Q: What is the difference in TDP between the two chips?

A: The Intel Xeon D-2775TE has a TDP of 100 watts, while the AMD EPYC 7302P has a TDP of 155 watts. The Intel part draws 55 watts less according to the recorded specifications.

Q: Which processor has more cache?

A: The AMD EPYC 7302P has a total L3 cache of 128 MB, distributed as 32 MB per die across four dies. The Intel Xeon D-2775TE has a shared 25 MB L3 cache. The AMD part also uses 64 KB of L1 per core and 512 KB of L2 per core, while the Intel part uses 80 KB of L1 per core and 1.25 MB of L2 per core.

Q: What memory bandwidth does each platform support?

A: The AMD EPYC 7302P supports eight-channel DDR4 memory with a bandwidth of 204.8 GB/s. The Intel Xeon D-2775TE supports quad-channel DDR4 memory with a bandwidth of 93.9 GB/s. The AMD platform offers more than double the memory bandwidth.

Q: How do the release dates differ?

A: The AMD EPYC 7302P was released on 2019-08-06, while the Intel Xeon D-2775TE was released on 2022-02-23. The Intel part is the newer design by roughly two and a half years, yet it still trails in every recorded benchmark.

Architecture Differences

The two processors come from different architectural lineages. The AMD EPYC 7302P belongs to the EPYC 7002 series, built on the Zen 2 architecture with the codename Rome. It uses a 7 nm process node from TSMC and integrates 15,200 million transistors across a die size of 4x 74 mm². The Intel Xeon D-2775TE uses the Ice Lake architecture with the codename Ice Lake-D, built on a 10 nm process node at Intel. The Intel part has no recorded transistor count or die size in the database.

The core layouts differ substantially. The AMD part has 16 cores and 32 threads, as does the Intel part, but the cache hierarchy is organized differently. The EPYC 7302P has 64 KB of L1 per core, 512 KB of L2 per core, and 32 MB of L3 per die, totaling 128 MB across its four dies. The Xeon D-2775TE has 80 KB of L1 per core, a larger 1.25 MB of L2 per core, but only 25 MB of shared L3. This means the AMD part has significantly more total L3 cache, while the Intel part has more L2 per core.

Memory support is another clear divergence. The AMD EPYC 7302P uses an eight-channel DDR4 memory bus with 204.8 GB/s of bandwidth. The Intel Xeon D-2775TE uses a quad-channel DDR4 bus with 93.9 GB/s. Both support ECC memory, which is a requirement for server and workstation use cases. The PCIe capabilities also differ sharply: the EPYC 7302P provides Gen 4 with 128 lanes from the CPU, while the Xeon D-2775TE provides Gen 4 with 32 lanes from the CPU.

The sockets are incompatible. The AMD part uses AMD Socket SP3, while the Intel part uses Intel BGA 2579, which is a ball-grid array package rather than a socketed design. The AMD part has a base clock of 3.00 GHz and a boost clock of 3.30 GHz, while the Intel part has a base clock recorded as 2000.00 MHz (2.00 GHz) and a boost clock of 3.10 GHz. The AMD part launches at a higher base and higher boost frequency. Neither processor has an unlocked multiplier, so overclocking is not a supported path for either.

The production status for both is listed as Active, and neither has integrated graphics. The launch MSRP for the AMD EPYC 7302P is $825, while the launch MSRP for the Intel Xeon D-2775TE is $1751. The AMD part has the part number 100-000000049, and the Intel part has the part number SRM26SRLCM.

The Verdict

The data points in one direction without ambiguity. The AMD EPYC 7302P wins every single benchmark recorded in the head-to-head comparison, with a consistent margin of approximately 19.7 to 19.8 percent across all six Cinebench tests. The average benchmark score of 7100 for the AMD part versus 6711 for the Intel part reflects this same ordering, as does the percentile ranking of 63 against 62. If the decision rests purely on measured performance, the EPYC 7302P is the stronger choice in every tested workload.

The Intel Xeon D-2775TE does hold advantages in other recorded dimensions. Its TDP of 100 watts is 55 watts lower than the AMD part's 155 watts, which matters for dense deployments where power and cooling are constrained. Its smaller physical footprint, suggested by the BGA 2579 socket, and its newer release date of 2022-02-23 compared to 2019-08-06, may also factor into platform decisions. But the benchmark data does not show any performance category where the Intel part takes the lead.

For workloads that depend on raw compute throughput, whether single-threaded or multi-threaded, the EPYC 7302P is the clear pick based on the recorded results. For deployments where the lower TDP and the newer platform generation are the priority, and where the 19.7 percent performance deficit is acceptable, the Xeon D-2775TE remains a viable option. The choice ultimately depends on whether performance or platform efficiency carries more weight in the target environment.

Specification Differences

The two processors share the same core count of 16 and thread count of 32, but nearly every other specification diverges. The AMD EPYC 7302P has a base clock of 3.00 GHz and a boost clock of 3.30 GHz, while the Intel Xeon D-2775TE has a base clock of 2000.00 MHz (2.00 GHz) and a boost clock of 3.10 GHz. TDP differs by 55 watts: the AMD part is rated at 155 watts, the Intel part at 100 watts.

The socket types are entirely different, with the AMD part using AMD Socket SP3 and the Intel part using Intel BGA 2579. The process nodes differ as well, with the AMD part at 7 nm from TSMC and the Intel part at 10 nm from Intel. The AMD part has a recorded transistor count of 15,200 million and a die size of 4x 74 mm²; the Intel part has no transistor count or die size recorded.

Cache configurations are not interchangeable. The AMD part has 64 KB of L1 per core, 512 KB of L2 per core, and 128 MB of total L3 (32 MB per die). The Intel part has 80 KB of L1 per core, 1.25 MB of L2 per core, and 25 MB of shared L3. The memory bus width differs, with the AMD part running eight-channel DDR4 and the Intel part running quad-channel DDR4. Memory bandwidth is 204.8 GB/s for the AMD part versus 93.9 GB/s for the Intel part. PCIe lane counts also differ: the AMD part has Gen 4 with 128 lanes, while the Intel part has Gen 4 with 32 lanes.

Release dates are roughly two and a half years apart, with the AMD part launching on 2019-08-06 and the Intel part on 2022-02-23. The launch MSRP for the AMD part is $825, and for the Intel part it is $1751. Neither processor has integrated graphics, neither has an unlocked multiplier, and both support ECC memory. The AMD part has a part number of 100-000000049, while the Intel part uses SRM26SRLCM.

Where Each One Wins

The AMD EPYC 7302P wins in every benchmark category recorded in the head-to-head comparison. It leads in single-core Cinebench R15, R20, and R23 with scores of 395, 1647, and 3922 respectively. It also leads in multi-core Cinebench R15, R20, and R23 with scores of 2800, 11670, and 27786 respectively. The margin is consistent at roughly 19.7 to 19.8 percent across all six tests. The AMD part also dominates in memory bandwidth with 204.8 GB/s against 93.9 GB/s, and in total L3 cache with 128 MB against 25 MB. It offers more PCIe lanes at 128 versus 32, and it has a higher base and boost clock.

The Intel Xeon D-2775TE wins in power efficiency, with a TDP of 100 watts compared to 155 watts for the AMD part. It also has a more recent release date, launching on 2022-02-23 versus 2019-08-06 for the AMD part. The Intel part has a larger L2 cache per core at 1.25 MB versus 512 KB, and it uses a BGA 2579 socket, which is a soldered form factor that may suit certain embedded or edge deployments. Its lower launch MSRP is not the relevant comparison here, as the Intel part actually carries a higher launch MSRP of $1751 against $825 for the AMD part.

For users prioritizing compute performance, the recorded data consistently favors the AMD EPYC 7302P across single-threaded and multi-threaded workloads. For users prioritizing lower power draw and a newer platform generation, the Intel Xeon D-2775TE offers a 55-watt TDP advantage and a 2022 release date, while accepting a performance deficit of nearly 20 percent in every tested benchmark.

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7302P
D-2775TE
Core Specs
Cores
16
16 0.0%
Threads
32
32 0.0%
Base Clock (GHz)
3
2,000 +66566.7%
Boost Clock (GHz)
3.3
3.1 -6.1%
Frequency (GHz)
3
2,000 +66566.7%
Turbo Clock (GHz)
3.3
3.1 -6.1%
Multiplier
30
20 -33.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1.25 MB (per core)
L3 Cache
32 MB (per die)
25 MB (shared)
Total L3
128 MB
—
Power
TDP (W)
155
100 -35.5%
Configurable TDP
180 W
—
Architecture
Architecture
Zen 2
Ice Lake
Codename
Rome
Ice Lake-D
Generation
EPYC (Zen 2 (Rome))
Xeon D (Ice Lake-D)
Process Size
7 nm
10 nm
Transistors
15,200 million
—
Die Size
4x 74 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Eight-channel
Quad-channel
Memory Bandwidth
204.8 GB/s
93.9 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP3
Intel BGA 2579
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 4, 32 Lanes(CPU only)
AMD Multi-Die
CCDs
4
—
Cores per CCD
4
—
IO Process Size
14 nm
—
Other
Market
Server/Workstation
Server/Workstation
Production Status
Active
Active
Launch Price
$825
$1751
Part Number
100-000000049
SRM26SRLCM
Package
FCLGA-4094
FC-BGA16B
View EPYC 7302P Details View Xeon D-2775TE Details