INTEL

Intel Xeon D-2775TE

Intel processor specifications and benchmark scores

16
Cores
32
Threads
3.1
GHz Boost
100W
TDP
🛡️ECC Memory

Intel Xeon D-2775TE Specifications

⚙️

Xeon D-2775TE Core Configuration

Processing cores and threading

The Intel Xeon D-2775TE features 16 physical cores and 32 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
16
Threads
32
SMP CPUs
1
⏱️

D-2775TE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon D-2775TE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon D-2775TE by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2000 GHz
Boost Clock
3.1 GHz
Multiplier
20x
💾

Intel's Xeon D-2775TE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the D-2775TE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon D-2775TE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
80 KB (per core)
L2 Cache
1.25 MB (per core)
L3 Cache
25 MB (shared)
🏗️

Ice Lake Architecture & Process

Manufacturing and design details

The Intel Xeon D-2775TE is built on Intel's 10 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in D-2775TE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Ice Lake
Codename
Ice Lake-D
Process Node
10 nm
Foundry
Intel
Generation
Xeon D (Ice Lake-D)
🔢

Ice Lake Instruction Set Features

Supported CPU instructions and extensions

The Xeon D-2775TE by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
AVX-512
FMA3
SHA
AES-NI
F16C
BMI1
BMI2
Intel 64
VT-x
VT-d
🔌

D-2775TE Power & Thermal

TDP and power specifications

The Intel Xeon D-2775TE has a TDP (Thermal Design Power) of 100W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
100W
🔧

Intel BGA 2579 Platform & Socket

Compatibility information

The Xeon D-2775TE uses the Intel BGA 2579 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel BGA 2579
PCIe
Gen 4, 32 Lanes(CPU only)
Package
FC-BGA16B
DDR5

Intel BGA 2579 Memory Support

RAM compatibility and speeds

Memory support specifications for the D-2775TE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon D-2775TE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
Memory Bus
Quad-channel
Memory Bandwidth
93.9 GB/s
ECC Memory
Supported
📦

Xeon D-2775TE Product Information

Release and pricing details

The Intel Xeon D-2775TE is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon D-2775TE by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Feb 2022
Launch Price
$1751
Market
Server/Workstation
Status
Active
Part Number
SRM26SRLCM

Xeon D-2775TE Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Xeon D-2775TE performs in parallel rendering workloads like video production and 3D animation. The R15 version remains useful for comparing against older hardware benchmarks. Higher scores directly correlate with faster render times in Cinema 4D and similar 3D applications.

cinebench_cinebench_r15_multicore #330 of 1788
2,338
16%
Max: 14,978
Compare with other CPUs

cinebench_cinebench_r15_singlecoreSource

Cinebench R15 single-core measures the speed of one CPU thread rendering 3D geometry. This score indicates how Intel Xeon D-2775TE handles tasks that can't be parallelized across multiple cores. Games and many desktop applications still rely heavily on single-thread performance. A higher single-core score means snappier system responsiveness in everyday use.

cinebench_cinebench_r15_singlecore #330 of 1245
330
16%
Max: 2,114

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Xeon D-2775TE. The more demanding workload provides better differentiation between current-generation processors.

cinebench_cinebench_r20_multicore #330 of 1788
9,745
16%
Max: 62,412
Compare with other CPUs

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Xeon D-2775TE. The increased complexity provides more accurate performance differentiation between modern CPUs.

cinebench_cinebench_r20_singlecore #330 of 1784
1,375
16%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Xeon D-2775TE after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss.

cinebench_cinebench_r23_multicore #330 of 1788
23,204
16%
Max: 148,601
Compare with other CPUs

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Xeon D-2775TE maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance.

cinebench_cinebench_r23_singlecore #330 of 1788
3,275
16%
Max: 20,979
Compare with other CPUs

About Intel Xeon D-2775TE

The Intel Xeon D-2775TE is a 16-core, 32-thread server processor built on the 10 nm Ice Lake-D architecture, operating at a 2.0 GHz base and 3.1 GHz turbo with a 100W TDP. Its 25 MB shared L3 cache and BGA 2579 socket indicate an embedded design intended for dense, always-on infrastructure. In multicore synthetic performance, this Xeon D part posts a Cinebench R23 score of 23,204 points, Cinebench R20 at 9,745 points, and Cinebench R15 at 2,338 points. Single-core results show healthy per-thread throughput with Cinebench R23 at 3,275 points and Cinebench R20 at 1,375 points. These figures suggest capable compilation, virtualization, and container orchestration throughput, while the 100W envelope keeps cooling requirements manageable. For networking and storage appliances, the balanced multicore and single-core results translate to predictable latency under mixed workloads. The 10 nm process and 25 MB cache help sustain performance during cache-sensitive tasks, reducing stalls in database and analytics operations. Overall, the D-2775TE is positioned for edge servers and microcloud nodes where sustained throughput matters more than peak burst clocks. From a productivity standpoint, the multicore Cinebench R23 score of 23,204 points indicates strong rendering and encoding throughput, while single-core R23 at 3,275 points keeps UI responsiveness snappy in interactive tasks. The R20 multicore result of 9,745 points and single-core of 1,375 points, plus R15 multicore at 2,338 points, provide a cross-check that performance scales well across different benchmark engines. At a launch price of $1751, the value proposition depends on workload density; per-core value improves when you can fully utilize 32 threads within the 100W budget. Compared with lower-tier embedded parts, the D-2775TE trades raw efficiency for higher sustained multicore output, which is often the deciding factor in server consolidations. For teams targeting predictable performance, the combination of 10 nm process and a 25 MB shared L3 cache reduces variance in long-running batch jobs. When evaluating price-to-performance, consider total platform cost, including cooling and memory, rather than CPU price alone. Motherboard support is limited to embedded designs using the BGA 2579 socket, so selection focuses on server vendors offering Ice Lake-D boards with appropriate I/O. Key selection points include: - Socket: BGA 2579 (soldered, embedded) - Generation: Xeon D (Ice Lake-D), 10 nm process - Memory: Eight-channel DDR4 support (verify vendor specs) - PCIe: PCIe Gen 4 lanes for networking and storage expansion - Networking/IPMI: Server-grade NICs and remote management options Plan deployment around the 100W TDP and ensure chassis airflow or passive cooling solutions meet vendor guidelines for the D-2775TE.

The AMD Equivalent of Xeon D-2775TE

Looking for a similar processor from AMD? The AMD Ryzen 5 5500 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 5500

AMD • 6 Cores

View Specs Compare

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