Intel Xeon D-2775TE
Intel processor specifications and benchmark scores
At a Glance
IntelIntel Xeon D-2775TE Specifications
Xeon D-2775TE Core Configuration
Processing cores and threading
The Intel Xeon D-2775TE features 16 physical cores and 32 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.
D-2775TE Clock Speeds
Base and boost frequencies
Clock speed is a critical factor in Xeon D-2775TE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon D-2775TE by Intel can dynamically adjust its frequency based on workload and thermal headroom.
Intel's Xeon D-2775TE Cache Hierarchy
L1, L2, L3 cache sizes
Cache memory is ultra-fast storage built directly into the D-2775TE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon D-2775TE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.
Ice Lake Architecture & Process
Manufacturing and design details
The Intel Xeon D-2775TE is built on Intel's 10 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in D-2775TE incorporate advanced branch prediction and out-of-order execution for optimal performance.
Ice Lake Instruction Set Features
Supported CPU instructions and extensions
The Xeon D-2775TE by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.
D-2775TE Power & Thermal
TDP and power specifications
The Intel Xeon D-2775TE has a TDP (Thermal Design Power) of 100W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.
Intel BGA 2579 Platform & Socket
Compatibility information
The Xeon D-2775TE uses the Intel BGA 2579 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.
Intel BGA 2579 Memory Support
RAM compatibility and speeds
Memory support specifications for the D-2775TE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon D-2775TE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.
Xeon D-2775TE Product Information
Release and pricing details
The Intel Xeon D-2775TE is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon D-2775TE by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.
Xeon D-2775TE Benchmark Scores
cinebench_cinebench_r15_multicoreSource
Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Xeon D-2775TE performs in parallel rendering workloads like video production and 3D animation. The R15 version remains useful for comparing against older hardware benchmarks. Higher scores directly correlate with faster render times in Cinema 4D and similar 3D applications.
cinebench_cinebench_r15_singlecoreSource
Cinebench R15 single-core measures the speed of one CPU thread rendering 3D geometry. This score indicates how Intel Xeon D-2775TE handles tasks that can't be parallelized across multiple cores. Games and many desktop applications still rely heavily on single-thread performance. A higher single-core score means snappier system responsiveness in everyday use.
cinebench_cinebench_r20_multicoreSource
Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Xeon D-2775TE. The more demanding workload provides better differentiation between current-generation processors.
cinebench_cinebench_r20_singlecoreSource
Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Xeon D-2775TE. The increased complexity provides more accurate performance differentiation between modern CPUs.
cinebench_cinebench_r23_multicoreSource
Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Xeon D-2775TE after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss.
cinebench_cinebench_r23_singlecoreSource
Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Xeon D-2775TE maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance.
About Intel Xeon D-2775TE
The Intel Xeon D-2775TE is a 16-core, 32-thread Ice Lake-D processor built for the server and workstation segment. It operates with a base clock of 2000.00 MHz and a boost clock of 3.10 GHz, targeting dense, power-conscious deployments where consistent throughput matters more than peak burst performance. The data shows a processor that sits at the 66th percentile among all CPUs, with an average benchmark score of 6711, placing it in a competitive mid-to-high tier for its class.
Single-Thread vs Multi-Thread Behavior
The benchmark results reveal a pronounced split between single-thread and multi-thread capability. In Cinebench R23, the processor scores 3275 in single-core and 23204 in multi-core, yielding a multi-core to single-core ratio of roughly 7.1x. That ratio is high, indicating that the chip’s strength is overwhelmingly in parallel workloads rather than lightly threaded tasks. The single-core score of 3275 in R23 is modest for a modern chip; this is not a processor that will win latency-sensitive or single-threaded tasks against desktop-class rivals with higher boost clocks.
The multi-core figures tell a different story. The R23 multi-core score of 23204 demonstrates that all 16 cores scale effectively under sustained load, with the 3.10 GHz boost clock being maintained across the full core count in well-parallelized applications. The Cinebench R20 results reinforce this pattern: 1375 single-core and 9745 multi-core. The gap between the two metrics suggests that workloads which can utilize all threads, rendering, compilation, virtualization, database queries, will see near-linear scaling, while interactive or lightly threaded workflows will leave most of the silicon idle.
For real-world usage, this split means the Xeon D-2775TE is best suited to environments where thread count dominates. A web server handling many concurrent requests, a build server compiling large codebases, or a media encoder processing batches of files will all benefit from the multi-core throughput. Conversely, tasks like single-threaded scripting, certain CAD operations, or legacy applications that rely on one core will run at a pace dictated by the 3.10 GHz ceiling, which is unremarkable relative to modern desktop processors. The data indicates that users should not purchase this chip for snappy single-threaded responsiveness; its value is entirely in aggregate compute.
Power and Thermals
The Xeon D-2775TE carries a TDP class of 100 watts. This is a relatively low figure for a 16-core server processor, reflecting the Ice Lake-D design goal of high core density within a constrained thermal envelope. A 100W TDP means that a moderately sized air cooler with a decent heatpipe layout will suffice for most chassis, and it opens the door to passive cooling in well-ventilated server cases or small-form-factor appliances.
The implication of this TDP is that the processor is not designed for aggressive overclocking or sustained all-core turbo beyond its rated boost. The 3.10 GHz boost is achievable, but under heavy multi-threaded loads, the power limit will cap frequency to stay within the 100W budget. This is a deliberate trade-off: the chip trades peak frequency for power efficiency, making it suitable for dense rack deployments where cooling and electricity costs are primary concerns. For a workstation user, this means the cooling solution does not need to be exotic, a standard tower cooler with a 120mm fan will handle the thermal load comfortably, and even low-profile coolers in 1U servers are viable.
The quad-channel DDR4 memory support and 93.9 GB/s memory bandwidth also influence thermal behavior, as the memory controllers draw additional power. However, the overall package remains well within the reach of typical server cooling infrastructure. The processor’s production status is active, and the 10 nm process node from Intel contributes to the manageable thermal profile. In short, the data points to a chip that is thermally cooperative, not demanding, and that is a key differentiator in its market segment.
Benchmark Performance
The average benchmark score of 6711 positions the Xeon D-2775TE in a tight cluster of competitors. The nearest rival is the Intel Core i9-12900E, with an average score of 6701, a delta of just 0.2% in favor of the Xeon. This is essentially a statistical tie, meaning that in aggregate multi-threaded workloads, the two processors are interchangeable within measurement noise. The AMD EPYC 72F3 also scores 6700, again a 0.2% delta, reinforcing that the Xeon D-2775TE sits exactly at parity with these two alternatives.
Against the Intel Core i9-9940X, the Xeon D-2775TE holds a 0.5% lead, with scores of 6675 for the older desktop HEDT chip. This is a marginal advantage, but it is notable because the i9-9940X is a larger, higher-TDP part from a previous generation, suggesting that the Xeon D-2775TE achieves comparable throughput with better power efficiency. The only rival that beats it is the Intel Xeon Gold 5317, which scores 6748, representing a -0.5% delta from the Xeon D-2775TE’s perspective. That deficit is small enough to be negligible in practice, though the Xeon Gold 5317 likely offers additional platform features.
Looking at the Cinebench scores individually, the R15 multi-core result of 2338 and R20 multi-core of 9745 both align with the chip’s 16-core/32-thread configuration. The R23 multi-core score of 23204 is the most modern indicator, and it shows that the processor scales well with current rendering workloads. The single-core scores, 330 in R15, 1375 in R20, 3275 in R23, are consistently in the range of a mid-tier desktop CPU from a few generations ago, which is expected given the 3.10 GHz boost ceiling. The data does not show any anomalous throttling or core-to-core variation; the scores are stable and consistent with a well-binned server part.
Who Should Consider It
This processor is for users who prioritize parallel throughput over single-thread speed. In content creation, the R23 multi-core score of 23204 means video encoding, 3D rendering, and batch image processing will complete at a rate comparable to the nearest rivals, but with a lower power draw. For office productivity, the single-core performance is adequate for typical document and spreadsheet work, but there is no headroom for demanding interactive tasks; the processor will feel competent, not snappy.
For server and workstation deployments, the Xeon D-2775TE is a strong fit. The quad-channel DDR4 support and 93.9 GB/s memory bandwidth provide ample data throughput for virtualized environments or in-memory databases. The 32 threads handle concurrent containerized workloads efficiently, and the 100W TDP makes it viable for dense, high-core-count systems where thermal density is a constraint. The 25 MB shared L3 cache, combined with 1.25 MB of L2 per core, gives each core a substantial working set, which benefits multi-threaded workloads with shared data structures.
Gaming is not a primary use case for this chip. The single-core scores are too low for high-refresh-rate gaming, and the server-oriented platform lacks the raw clock speed that gaming workloads favor. However, for a gaming server that hosts multiple instances or a streaming workstation that encodes video while running other tasks, the multi-core capability is sufficient. The memory bandwidth of 93.9 GB/s is also a plus for scenarios where large data sets are streamed through the system.
How It Compares
Intel Core i9-12900E: The Xeon D-2775TE and the i9-12900E are effectively tied, with a 0.2% delta in the Xeon’s favor. The i9-12900E likely has better single-thread performance due to its hybrid architecture, but the aggregate benchmark score shows parity. The Xeon D-2775TE offers ECC memory support and a server-grade platform, which may be decisive for reliability-focused users.
AMD EPYC 72F3: Again a 0.2% delta in favor of the Xeon D-2775TE, making this a near-exact match in average performance. The EPYC 72F3 is a server part as well, so the choice between them hinges on platform preferences, memory channels, and PCIe lane configuration rather than raw compute, which is statistically indistinguishable.
Intel Core i9-9940X: The Xeon D-2775TE leads by 0.5%, a modest but consistent advantage. The i9-9940X is an older desktop HEDT chip with a higher TDP, so the Xeon D-2775TE achieves a slight performance win while likely consuming less power. This comparison highlights the efficiency gains of the newer Ice Lake-D architecture.
Intel Xeon Gold 5317: The Xeon D-2775TE trails by 0.5%, the only rival in the nearest group to post a higher score. The difference is small, but it does establish that the Xeon Gold 5317 holds a slight edge in aggregate throughput. For users who need that extra margin, the Gold 5317 is the better choice; otherwise, the D-2775TE’s lower TDP and similar performance make it a compelling alternative.
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