AMD Radeon R3 Mobile Graphics

The AMD Radeon R3 Mobile Graphics is an integrated graphics processor (IGP) built on the GCN 3.0 architecture, specifically the Stoney chip. Fabricated on a 28 nm process at GlobalFoundries, it contains 1,200 million transistors on a 125 mm² die, yielding a transistor density of 9.6M per mm². The part is marked as End-of-life, with a release date of 2016-05-31. It functions as a system-shared memory GPU, with its bandwidth explicitly listed as System Dependent, and it occupies an IGP slot width with no dedicated power connectors. The base clock is 200 MHz, boosting to 655 MHz. The generation is listed as GCN 3.0 IGP (Stoney Ridge-M).

How It Compares

The nearestRivals field for this entry is empty, so the comparative analysis relies on the overall database percentile. The AMD Radeon R3 Mobile Graphics sits at the 50th percentile among all tracked GPUs, meaning it outperforms exactly half of the database entries and trails the other half. This median placement is notable given the modest raw compute figures: the FP32 throughput is 167.7 GFLOPS, and the pixel rate is 2.620 GPixel/s. The texture rate stands at 5.240 GTexel/s. These numbers indicate a part that is neither a performance outlier nor a bottom-tier offering, but rather a representative midpoint in the distribution. Without specific rival names or deltaPct values in the data, the percentile serves as the primary positional reference. The predecessor is the GCN 2.0 IGP, and the successor is the Vega IGP, placing this part in a clear generational line. The 50th percentile placement suggests that in the context of the database's historical GPU landscape, this IGP holds a median standing, though its absolute performance is constrained by its integrated nature and low clock speeds. The 200 MHz base clock and 655 MHz boost clock are modest, yet they contribute to the part's position at the exact middle of the database's performance distribution.

Ray Tracing and Feature Set

The AMD Radeon R3 Mobile Graphics does not include dedicated ray tracing cores or tensor cores, as both fields are null in the specification. This absence means that any ray tracing or AI-accelerated workloads would rely entirely on the general-purpose shading units. The GPU features 128 shading units, 8 texture mapping units, and 4 render output units. These resources produce a pixel rate of 2.620 GPixel/s and a texture rate of 5.240 GTexel/s. On the API front, the part supports DirectX 12 with a feature level of 12_0, OpenGL 4.6, and Vulkan 1.2.170. The DirectX 12 (12_0) support indicates a baseline feature set suitable for contemporary titles at the time of release, though the lack of dedicated RT hardware limits advanced visual effects. The GCN 3.0 architecture provides the underlying compute foundation, and the FP32 and FP16 performance are identical at 167.7 GFLOPS, indicating a 1:1 ratio for half-precision operations. This 1:1 ratio means that there is no performance penalty or advantage when using half-precision data, which is typical for this architecture generation. The display outputs are listed as Portable Device Dependent, meaning the exact ports are determined by the host system.

Who Should Consider It

Given the system-shared memory configuration, where the memory size, type, and bus width are all listed as System Shared, the actual bandwidth is System Dependent. This means the GPU's performance scales with the host system's memory subsystem. The low pixel rate of 2.620 GPixel/s and texture rate of 5.240 GTexel/s suggest that this IGP is best suited for low-resolution, modest-settings gaming or basic 2D and productivity workloads. Users running legacy titles or light 3D applications may find it adequate, but demanding modern games at high settings will likely exceed its capabilities. The 128 shading units provide a baseline compute capacity, but the 167.7 GFLOPS FP32 throughput is a limiting factor for complex shaders. For users who require only integrated graphics for everyday tasks, web browsing, and video playback, this part is a reasonable fit. The absence of a dedicated memory bus means that performance is heavily influenced by the system RAM, so configurations with faster memory will yield better results. The 4 ROPs limit the fill rate, further capping performance at higher resolutions. The boost clock of 655 MHz is relatively low, which directly impacts the achievable frame rates in 3D applications. The 50th percentile placement suggests that while it is not a high-performance part, it is not the lowest tier either, making it suitable for basic computing needs.

Power and Cooling

The AMD Radeon R3 Mobile Graphics has a thermal design power (TDP) of 15 W, which is a low figure for a GPU. This low TDP is consistent with its integrated nature, as it draws power from the system rather than a dedicated supply. The power connectors field is listed as None, indicating that no external power connectors are required. The suggested PSU field is null, meaning the database does not specify a particular power supply unit for this part. The slot width is IGP, confirming it is not a discrete add-in card. The 28 nm process node from GlobalFoundries is a mature manufacturing technology, contributing to the modest power envelope. The die size is 125 mm², and the transistor density is 9.6M per mm², which reflects the process generation. Cooling solutions for this IGP would be integrated into the host system's thermal design, as there are no dedicated cooling requirements listed. The 15 W TDP is well within the capability of standard laptop or small-form-factor cooling systems. The base clock of 200 MHz and boost clock of 655 MHz operate within this power envelope, ensuring that the IGP does not generate excessive heat.

FAQ

Q: Does the AMD Radeon R3 Mobile Graphics support DirectX 12?

A: Yes, it supports DirectX 12 with a feature level of 12_0, along with OpenGL 4.6 and Vulkan 1.2.170.

Q: What is the thermal design power of this GPU?

A: The TDP is 15 W, and it requires no power connectors.

Q: Does it have dedicated ray tracing or tensor cores?

A: No, the rtCores and tensorCores fields are null, indicating no dedicated hardware for those functions.

Q: What is the memory configuration?

A: The memory size, type, and bus width are all listed as System Shared, with bandwidth being System Dependent.

Q: Is this GPU still in production?

A: No, the production status is listed as End-of-life, with a release date of 2016-05-31.

Q: What is the process node and die size?

A: It is fabricated on a 28 nm process at GlobalFoundries, with a die size of 125 mm² and 1,200 million transistors.