INTEL

Intel Xeon W5590

Intel processor specifications and benchmark scores

4
Cores
8
Threads
3.6
GHz Boost
130W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 4C / 8T
Boost Clock 3.6 GHz
Base Clock 3.33 GHz
L3 Cache 8 MB (shared)
TDP 130W
Architecture Nehalem
Socket Intel Socket 1366
nm
Process 45 nm
Released Aug 2009

Intel Xeon W5590 Specifications

Xeon W5590 Core Configuration

Processing cores and threading

The Intel Xeon W5590 features 4 physical cores and 8 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
8
SMP CPUs
2

W5590 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon W5590 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon W5590 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
3.33 GHz
Boost Clock
3.6 GHz
Multiplier
25x

Intel's Xeon W5590 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the W5590 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon W5590's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
8 MB (shared)

Nehalem Architecture & Process

Manufacturing and design details

The Intel Xeon W5590 is built on Intel's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in W5590 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Nehalem
Codename
Gainestown
Process Node
45 nm
Foundry
Intel
Transistors
731 million
Die Size
263 mm²
Generation
Xeon (Gainestown)

Nehalem Instruction Set Features

Supported CPU instructions and extensions

The Xeon W5590 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
Intel 64
VT-x
VT-d

W5590 Power & Thermal

TDP and power specifications

The Intel Xeon W5590 has a TDP (Thermal Design Power) of 130W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
130W

Intel Socket 1366 Platform & Socket

Compatibility information

The Xeon W5590 uses the Intel Socket 1366 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 1366
Chipsets
Intel 5500, 5520, X58
PCIe
Gen 2
Package
FC-LGA8
DDR5

Intel Socket 1366 Memory Support

RAM compatibility and speeds

Memory support specifications for the W5590 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon W5590 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Triple-channel
Memory Bandwidth
32.0 GB/s
ECC Memory
Supported

Xeon W5590 Product Information

Release and pricing details

The Intel Xeon W5590 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon W5590 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Aug 2009
Launch Price
$1600
Market
Server/Workstation
Status
End-of-life
Part Number
SLBGE

Xeon W5590 Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Xeon W5590 performs in parallel rendering workloads like video production and 3D animation. Higher scores mean faster render times in professional applications.

cinebench_cinebench_r15_multicore #1456 of 1945
288
2%
Max: 14,978

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Xeon W5590.

cinebench_cinebench_r20_multicore #1456 of 1945
1,204
2%
Max: 62,412
Compare with other CPUs

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Xeon W5590.

cinebench_cinebench_r20_singlecore #1451 of 1935
169
2%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Xeon W5590 after thermal limits kick in.

cinebench_cinebench_r23_multicore #1456 of 1945
2,867
2%
Max: 148,601
Compare with other CPUs

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Xeon W5590 maintains boost clocks under continuous load.

cinebench_cinebench_r23_singlecore #1443 of 1932
404
2%
Max: 20,979

About Intel Xeon W5590

The Intel Xeon W5590 is a 4-core, 8-thread server and workstation processor from the Nehalem generation, built on Intel's 45nm Gainestown architecture. Launched in August 2009 for the Intel Socket 1366 platform, this end-of-life chip offers a base clock of 3.33 GHz and a boost clock of 3.60 GHz, with a 130W TDP. Its benchmark profile places it in the 26th percentile of all CPUs, with an average benchmark score of 977, positioning it as a legacy part whose performance is now comparable to entry-level desktop processors from several generations ago.

Benchmark Performance

The W5590's average benchmark score of 977 places it in a tight cluster with several much newer, lower-power desktop chips. The data shows it is effectively tied with the Intel Core i5-5257U (deltaPct 0), the AMD Athlon X4 840 (deltaPct 0.2), the AMD A10-7870K (deltaPct 0.2), and the Intel Core i3-4130 (deltaPct 0.3). This is a striking result: a high-end workstation Xeon from 2009 matches the aggregate performance of a 2014 dual-core Core i3 and a 2015 quad-core AMD APU. The differences among these parts are negligible, with a maximum spread of only 0.3 percent. In practical terms, the W5590 delivers roughly the same overall compute throughput as these mainstream rivals, but it does so with an older architecture, higher power draw, and a platform that lacks modern features.

Looking at specific multi-threaded workloads, the W5590 scores 286 points in Cinebench R15 multi-core, 1192 in Cinebench R20 multi-core, and 2840 in Cinebench R23 multi-core. These numbers reflect a chip that can handle modest parallel workloads but is far from competitive by modern standards. The R23 score, for instance, is well below what any current mainstream desktop processor achieves, which is consistent with its 26th percentile ranking. The W5590's 4 cores and 8 threads are simply outmatched by modern 6-core and 8-core designs that also benefit from significantly higher IPC and clock speeds. For legacy software that was optimized for the Nehalem era, the processor remains functional, but benchmark results indicate it will be a bottleneck in any modern multi-threaded application that scales beyond eight threads.

Single-Thread vs Multi-Thread Behavior

The W5590's single-core scores are 168 in Cinebench R20 and 401 in Cinebench R23. These results reveal a significant weakness: the chip's single-thread performance is poor by contemporary standards. The 3.60 GHz boost clock cannot compensate for the low instructions-per-clock of the 45nm Nehalem architecture. In single-threaded workloads, the W5590 will feel sluggish, particularly in applications that rely on a single fast core, such as older games, spreadsheet calculations, or lightly-threaded productivity tools. The delta between its single-core and multi-core scores shows that the chip scales reasonably well when all four cores are engaged, but the absolute performance level is low in both cases.

For real workloads, this split means the W5590 is best suited to tasks that are explicitly parallelized and can use all 8 threads. Multi-threaded rendering, video encoding, and batch processing will see a modest benefit from the extra threads, but the per-core performance will still limit the overall result. Conversely, any task that is latency-sensitive or single-thread-bound will perform poorly. The benchmark data indicates that the W5590's multi-thread performance is about 7 times its single-thread performance in Cinebench R23 (2840 vs 401), which is a healthy scaling ratio, but the starting point is too low to make the chip useful for modern single-threaded applications. Users should expect a balanced but dated experience: adequate for parallel batch jobs, underwhelming for interactive use.

Power and Thermals

The W5590 carries a TDP of 130W, which is substantial for a 4-core processor. This figure places it in the power envelope of high-end desktop parts from its era, but it is notably higher than the thermal requirements of the rival chips it matches in performance. The Intel Core i5-5257U, for instance, is a 28W part, and the AMD A10-7870K is a 95W part. The W5590 draws significantly more power to achieve the same level of performance, a clear indication of its older 45nm process node and less efficient architecture. The 130W TDP means that any cooling solution must be rated for that heat output; a capable air cooler with a 120mm fan or a basic liquid cooler will be necessary to maintain reasonable temperatures under load. The chip's 263 mm² die size, housing 731 million transistors, generates heat across a relatively large surface, but the 130W envelope is manageable with a mid-range tower cooler. Users building a system with this processor should not attempt to cool it with a stock low-profile cooler, as sustained multi-threaded loads will likely cause thermal throttling. The 45nm process node is inherently less efficient than modern nodes, so expect the system to run warmer and draw more power from the wall than a comparable modern build.

Who Should Consider It

Given its benchmark profile, the W5590 is not a sensible choice for modern gaming. The single-thread scores of 401 in Cinebench R23 and 168 in R20 are far too low for contemporary game engines, which typically rely on one or two high-speed cores. The chip will bottleneck any modern graphics card, resulting in low frame rates and stuttering even at 1080p. The multi-thread scores do not compensate, as games rarely scale well to 8 threads on an architecture with such low IPC. For content creation, the W5590 is only viable for legacy software that was compiled for the Nehalem instruction set and does not require modern AVX2 or AVX-512 extensions. Simple batch operations like transcoding older video formats or running CPU-based rendering in older applications will work, but the 2840 Cinebench R23 score means any modern renderer will take far longer than on a current entry-level chip. Office productivity is a mixed bag: basic word processing, spreadsheets, and web browsing will run, but the poor single-thread performance will make the system feel less responsive than a modern budget laptop. The W5590 is best suited to a hobbyist or collector who wants to build a period-correct Windows 7 or early Windows 10 workstation, or who needs a cheap, reliable server for light file serving or a dedicated legacy application that does not require high per-core performance. For any other purpose, the data clearly shows that the four rival chips listed — all of which match its average score — are more modern and efficient alternatives.

Platform and Compatibility

The W5590 uses the Intel Socket 1366 platform, which was Intel's high-end desktop and server socket from 2008 to 2011. The processor supports DDR3 memory in a triple-channel configuration, providing a memory bandwidth of 32.0 GB/s. This is a significant limitation today, as DDR3 is end-of-life and triple-channel kits are scarce and expensive. The platform also supports ECC memory, which is a plus for server use, but it requires a compatible motherboard that supports registered or unbuffered ECC DIMMs. The chip provides PCIe Gen 2 connectivity, which is two generations behind current standards; this means modern graphics cards and NVMe SSDs will run at reduced bandwidth, though for a 4-core CPU from this era, the PCIe limitation is rarely the primary bottleneck. The socket 1366 platform offers an upgrade path to other Nehalem and Westmere Xeon processors, including 6-core models that would increase thread count, but the motherboard must support those chips via a BIOS update. The W5590's multiplier is locked, so overclocking is not possible through the CPU multiplier; users must rely on base clock adjustments, which are limited by the platform's stability. The processor has no integrated graphics, so a discrete GPU is mandatory. The launch MSRP is $1600, which was typical for a high-end Xeon at the time, but the end-of-life production status means the chip is only available on the used market, often at a fraction of that price. Users should verify that any used motherboard has the correct BIOS revision to support the W5590 (part number SLBGE) before purchase.

FAQ

Q: How does the Intel Xeon W5590 compare to the Intel Core i3-4130?

A: The W5590 has an average benchmark score of 977, which is effectively identical to the Core i3-4130's 974, a delta of 0.3 percent. In multi-threaded Cinebench R20, the W5590 scores 1192, but its single-thread score of 168 is significantly lower than what the i3-4130 achieves, making the i3 the better choice for single-threaded tasks.

Q: What memory type and configuration does the W5590 require?

A: The W5590 supports DDR3 memory in a triple-channel configuration, yielding a memory bandwidth of 32.0 GB/s. It also supports ECC memory, which is important for error-correcting workloads in a server environment.

Q: Can the W5590 be overclocked?

A: No, the multiplier is locked, so the CPU multiplier cannot be adjusted. Overclocking would have to be done via the base clock, which is limited by the platform's stability and is not recommended for reliable operation.

Q: Is the W5590 suitable for a modern gaming PC?

A: No. The single-thread score of 401 in Cinebench R23 is far too low for modern game engines. The chip's 26th percentile ranking and poor per-core performance will bottleneck any contemporary graphics card, leading to low frame rates.

Q: What is the thermal design power of the W5590, and what cooling does it need?

A: The TDP is 130W, which requires a cooling solution rated for that heat output. A capable air cooler or a basic liquid cooler is necessary; a low-profile stock cooler will not suffice under sustained load.

Q: What socket does the W5590 use, and is there an upgrade path?

A: The W5590 uses Intel Socket 1366. The platform supports other Nehalem and Westmere Xeon processors, including 6-core models, but a BIOS update on the motherboard is required to support newer chips in the same socket family.

The AMD Equivalent of Xeon W5590

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD • 4 Cores

View Specs Compare

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