INTEL

Intel Xeon W-1290TE

Intel processor specifications and benchmark scores

10
Cores
20
Threads
4.5
GHz Boost
35W
TDP
Integrated GPU ECC Memory

At a Glance

Intel
Cores / Threads 10C / 20T
Boost Clock 4.5 GHz
Base Clock 1800 GHz
L3 Cache 20 MB (shared)
TDP 35W
Architecture Comet Lake
Socket Intel Socket 1200
nm
Process 14 nm
Released May 2020

Intel Xeon W-1290TE Specifications

Xeon W-1290TE Core Configuration

Processing cores and threading

The Intel Xeon W-1290TE features 10 physical cores and 20 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
10
Threads
20
SMP CPUs
1

W-1290TE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon W-1290TE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon W-1290TE by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1800 GHz
Boost Clock
4.5 GHz
All-Core Turbo
up to 4.6 GHz
Multiplier
18x

Intel's Xeon W-1290TE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the W-1290TE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon W-1290TE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
20 MB (shared)

Comet Lake Architecture & Process

Manufacturing and design details

The Intel Xeon W-1290TE is built on Intel's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in W-1290TE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Comet Lake
Codename
Comet Lake
Process Node
14 nm
Foundry
Intel
Die Size
206 mm²
Generation
Xeon (Comet Lake)

Comet Lake Instruction Set Features

Supported CPU instructions and extensions

The Xeon W-1290TE by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AVX2
FMA3
AES-NI
F16C
BMI1
BMI2
Intel 64
VT-x
VT-d

W-1290TE Power & Thermal

TDP and power specifications

The Intel Xeon W-1290TE has a TDP (Thermal Design Power) of 35W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
35W
Tj Max
100°C

Intel Socket 1200 Platform & Socket

Compatibility information

The Xeon W-1290TE uses the Intel Socket 1200 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 1200
Chipsets
W480, W480E
PCIe
Gen 3, 16 Lanes(CPU only)
Package
FC-LGA14A
DDR5

Intel Socket 1200 Memory Support

RAM compatibility and speeds

Memory support specifications for the W-1290TE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon W-1290TE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
Memory Bus
Dual-channel
Memory Bandwidth
46.9 GB/s
ECC Memory
Supported

Intel's Xeon W-1290TE Integrated Graphics

Built-in GPU specifications

The Intel Xeon W-1290TE includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the W-1290TE provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Intel UHD Graphics P630
Graphics Model
Intel UHD Graphics P630

Xeon W-1290TE Product Information

Release and pricing details

The Intel Xeon W-1290TE is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon W-1290TE by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
May 2020
Launch Price
$552
Market
Server/Workstation
Status
Active
Part Number
SRJFH

Xeon W-1290TE Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Xeon W-1290TE performs in parallel rendering workloads.

cinebench_cinebench_r15_multicore #769 of 1945
1,230
8%
Max: 14,978

cinebench_cinebench_r15_singlecoreSource

Cinebench R15 single-core measures the speed of one CPU thread rendering 3D geometry. This score indicates how Intel Xeon W-1290TE handles tasks that can't be parallelized.

cinebench_cinebench_r15_singlecore #765 of 1351
173
8%
Max: 2,114

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Xeon W-1290TE. The more demanding workload provides better differentiation between current-generation processors. Content creators and 3D artists use this benchmark to estimate real-world render performance.

cinebench_cinebench_r20_multicore #767 of 1945
5,129
8%
Max: 62,412

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Xeon W-1290TE. The increased complexity provides more accurate performance differentiation between modern CPUs. Single-thread performance remains critical for gaming and applications with serial bottlenecks.

cinebench_cinebench_r20_singlecore #761 of 1935
724
8%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Xeon W-1290TE after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss. Professional users rely on R23 scores to predict real-world rendering performance under sustained workloads.

cinebench_cinebench_r23_multicore #767 of 1945
12,213
8%
Max: 148,601
Compare with other CPUs

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Xeon W-1290TE maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance. This score is particularly important for understanding real-world responsiveness beyond initial boost behavior.

cinebench_cinebench_r23_singlecore #755 of 1932
1,724
8%
Max: 20,979

About Intel Xeon W-1290TE

The Intel Xeon W-1290TE is a 10-core, 20-thread Comet Lake processor built on Intel's 14 nm process, aimed at the server and workstation segment. It is designed for sustained, multi-threaded workloads where reliability and efficiency are prioritized over raw gaming performance. With a 35 W TDP, it targets compact, thermally constrained systems that still require substantial computing throughput. The data shows its Cinebench R23 multicore score of 12329 places it in the 58th percentile of all CPUs, indicating a solid mid-to-upper tier performer for professional applications, though its single-core score of 1740 suggests it is not optimized for latency-sensitive tasks.

Who Should Consider It

The benchmark results indicate that the W-1290TE is best suited for professionals running heavily threaded creation and productivity workloads. Its Cinebench R20 multicore score of 5178 and R23 multicore score of 12329 demonstrate strong scaling across its 10 cores, making it a capable choice for video encoding, 3D rendering, and software compilation tasks. The 20 MB of shared L3 cache and dual-channel DDR4 memory support with a bandwidth of 46.9 GB/s provide adequate data throughput for these scenarios. Users working in environments where ECC memory is a requirement—such as data validation or financial modeling—will find the integrated ECC support particularly valuable.

For pure gaming workloads, this processor is less compelling. The Cinebench R23 single-core score of 1740 is modest by current standards, and the integrated Intel UHD Graphics P630 is not designed for high-frame-rate gaming. The data suggests that gamers should look at processors with higher single-thread performance. Office and general productivity users will find the processor more than adequate, as the multi-threaded headroom ensures smooth operation under simultaneous application loads, but the 35 W TDP is not a limitation for such tasks—it is a benefit for silent or compact office builds.

The market segment is explicitly server and workstation, so the intended audience is system integrators and IT departments building small-scale servers, network-attached storage with compute capabilities, or dedicated render nodes. The active production status and launch MSRP of $552 position it as a mid-range professional part, but the benchmark data shows it trades blows with mobile and lower-tier desktop processors, so it should be chosen for platform features rather than sheer performance leadership.

Power and Thermals

The W-1290TE carries a 35 W TDP, which is exceptionally low for a 10-core, 20-thread processor. This is a defining characteristic of the part. The data implies that a capable air cooler—such as a low-profile or stock-style cooler—is sufficient to maintain operation under full load, given the thermal design point. The low TDP class makes it suitable for fanless or semi-passive cooling solutions in industrial or home-lab environments where acoustic noise is a concern.

The boost clock of 4.50 GHz is high for a 35 W part, but the base clock of 1800 MHz indicates that sustained all-core loads will drop significantly below the boost frequency to respect the power envelope. Benchmark results show that the multicore scores are respectable, but they do not rival higher-TDP desktop parts. Thermally, the processor is forgiving: it does not demand high-end liquid cooling or large tower coolers. The 14 nm process node is older, but at this TDP, heat density is manageable, and the 206 mm² die size helps spread heat across the integrated heat spreader.

How It Compares

The nearest rival data provides a clear picture of where the W-1290TE stands. Against the Intel Core i7-5960X, the W-1290TE has an average benchmark score of 3566 versus 3570, a negligible delta of -0.1%. This means the two processors are statistically identical in overall performance, despite the i7-5960X being a much older high-end desktop part with a different architecture. The W-1290TE matches it with far lower power consumption, but offers no performance advantage.

Against the AMD Ryzen 7 PRO 4750U, the W-1290TE leads by a 0.2% delta in average score (3566 vs 3558). The Ryzen 7 PRO 4750U is a mobile processor, so the comparison highlights that the Xeon's desktop-class core count and cache configuration are barely enough to edge out a low-power mobile chip. This is a warning sign for workload scaling: the Xeon's advantage is within the margin of error.

The comparison with the AMD Ryzen 5 PRO 5675U shows a 0.3% delta (3566 vs 3556), again a statistical tie. The Ryzen 5 PRO 5675U is a newer, more efficient architecture, and the Xeon's 14 nm Comet Lake design struggles to differentiate itself. Similarly, the AMD Ryzen 5 PRO 7530U also shows a 0.3% delta (3566 vs 3556), reinforcing that the W-1290TE's performance class is squarely in the range of mid-tier mobile and older desktop silicon.

In all four comparisons, the W-1290TE offers no meaningful performance lead. Its value proposition is not performance but platform reliability, ECC support, and the server-grade feature set. The data clearly indicates that buyers should not expect a performance advantage over these rivals; they should expect parity with additional professional features.

Platform and Compatibility

The W-1290TE uses the Intel Socket 1200 platform, which is based on the Comet Lake architecture. It supports DDR4 memory in a dual-channel configuration, with a maximum theoretical memory bandwidth of 46.9 GB/s. ECC memory is supported, which is a critical feature for workstation and server applications requiring error correction. The processor provides 16 PCIe Gen 3 lanes from the CPU, which limits expansion options compared to higher-end platforms; users should plan for a single GPU or a couple of NVMe drives without a chipset-based expansion.

The integrated graphics are Intel UHD Graphics P630, providing basic display output capabilities without needing a discrete GPU. This is useful for headless servers or diagnostic purposes but is not suitable for graphics-intensive tasks. The processor is locked (multiplier unlocked: false), so overclocking is not possible; performance is fixed to the factory specifications.

The upgrade path is limited to the Socket 1200 platform, which supports other Comet Lake processors, but the socket is not forward-compatible with newer generations. The release date of May 2020 indicates this is a mature platform. The production status is active, so availability continues, but the architecture is several generations old. The part number is SRJFH. The 16 lanes of PCIe Gen 3 is a notable constraint for multi-GPU or high-bandwidth storage arrays, so system builders must carefully allocate resources.

FAQ

Q: Is the Intel Xeon W-1290TE suitable for gaming?

A: The data shows a Cinebench R23 single-core score of 1740, which is modest. The integrated Intel UHD Graphics P630 is not designed for gaming. The processor is better suited for multi-threaded professional workloads.

Q: What is the performance difference between the W-1290TE and the AMD Ryzen 7 PRO 4750U?

A: The average benchmark score is 3566 for the Xeon and 3558 for the Ryzen, a delta of 0.2% in favor of the Xeon. This is a negligible difference, making them effectively equal in overall performance.

Q: Does the W-1290TE support ECC memory?

A: Yes, ECC memory support is listed as true. This is a key feature for reliability in workstation and server environments.

Q: What is the maximum memory bandwidth?

A: The memory bandwidth is 46.9 GB/s, delivered through a dual-channel DDR4 memory bus.

Q: Can the W-1290TE be overclocked?

A: No. The multiplier unlocked field is false, meaning the processor is locked to its factory clocks.

Q: How many PCIe lanes are available from the CPU?

A: The processor provides 16 PCIe Gen 3 lanes from the CPU only. This limits high-bandwidth expansion options.

Q: What is the thermal design power?

A: The TDP is 35 W, which is very low for a 10-core processor. This allows for compact, low-noise cooling solutions, but sustained all-core performance may be limited.

The AMD Equivalent of Xeon W-1290TE

Looking for a similar processor from AMD? The AMD Ryzen 5 PRO 4650U offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 PRO 4650U

AMD • 6 Cores

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