INTEL

Intel Xeon L5335

Intel processor specifications and benchmark scores

4
Cores
4
Threads
GHz Boost
50W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 4C / 4T
Base Clock 2000 GHz
TDP 50W
Architecture Core 2
Socket Intel Socket 771
nm
Process 65 nm
Released Aug 2007

Intel Xeon L5335 Specifications

Xeon L5335 Core Configuration

Processing cores and threading

The Intel Xeon L5335 features 4 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
4
SMP CPUs
2

L5335 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon L5335 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon L5335 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2000 GHz
Boost Clock
N/A
Multiplier
6x

Intel's Xeon L5335 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the L5335 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon L5335's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
4 MB (per die)

Core 2 Architecture & Process

Manufacturing and design details

The Intel Xeon L5335 is built on Intel's 65 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in L5335 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Core 2
Codename
Clovertown
Process Node
65 nm
Transistors
582 million
Die Size
2x 143 mm²
Generation
Xeon (Clovertown)

Core 2 Instruction Set Features

Supported CPU instructions and extensions

The Xeon L5335 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
Intel 64
VT-x

Power & Thermal

TDP and power specifications

The Intel Xeon L5335 has a TDP (Thermal Design Power) of 50W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
50W

Intel Socket 771 Platform & Socket

Compatibility information

The Xeon L5335 uses the Intel Socket 771 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 771
Package
FC-LGA771
DDR5

Intel Socket 771 Memory Support

RAM compatibility and speeds

Memory support specifications for the L5335 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon L5335 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2, DDR3 Depends on motherboard
Memory Bus
Dual-channel
ECC Memory
Supported

Product Information

Release and pricing details

The Intel Xeon L5335 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon L5335 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Aug 2007
Launch Price
$380
Market
Server/Workstation
Status
End-of-life
Part Number
SLAEN
Bundled Cooler
Yes

About Intel Xeon L5335

The Intel Xeon L5335 is a 4-core, 4-thread server processor from Intel’s Clovertown generation, built on the Core 2 architecture and a 65 nm process node. Released in August 2007, this end-of-life part targets the Server/Workstation segment, featuring a 50 W TDP, dual-die design with a 2x 143 mm² die size, and 582 million transistors. Its benchmark profile places it in the lower percentile of all CPUs (9th percentile), with an average benchmark score of 508, indicating it remains a modest performer by modern standards.

Benchmark Performance

The L5335’s benchmark results show a processor firmly anchored in the entry-level tier of its era, with multi-core scores that reveal its age. In Cinebench R15 multi-core, it scores 148 points; in Cinebench R20 multi-core, it reaches 619 points; and in Cinebench R23 multi-core, it produces 1,476 points. Single-core results are similarly modest: 87 points in Cinebench R20 single-core and 208 points in Cinebench R23 single-core. These numbers place the chip at the 9th percentile among all CPUs, meaning roughly 91% of tested processors outperform it.

Relative to its nearest rivals, the L5335 sits in a tight cluster. Its average benchmark score of 508 is 0.6% higher than the Intel Core i5-2557M (average score 505) and 0.7% higher than the AMD Phenom II X4 900e (average score 505). Conversely, it trails the Intel Core i7-720QM by 0.7% (that CPU averages 512) and the Intel Xeon E5405 by 0.9% (average 513). These deltas are minuscule — within a single percentage point — indicating that the L5335 is effectively performance-equivalent to these four competitors, with no meaningful advantage or disadvantage in aggregate workloads.

The multi-core scaling is worth noting. The jump from Cinebench R15 (148) to R20 (619) and R23 (1,476) reflects different workload intensities rather than a change in the chip’s capability, but the ratios are consistent with a 4-thread processor. For instance, the R23 multi-core score of 1,476 is roughly 7.1 times the single-core score of 208, which aligns with the expected scaling from 4 threads on this architecture — though real-world scaling varies by application. Against the Xeon E5405, which is just 0.9% faster on average, the L5335 shows no substantial gap in either direction, making it a lateral move for systems already on Socket 771.

Power and Thermals

The L5335 carries a TDP of 50 W, a figure that places it in the low-power category for server processors of its generation. This 50 W rating is notably modest for a quad-core Xeon, making it suitable for dense or thermally constrained chassis where heat dissipation is a priority. The low TDP implies that a capable air cooler — such as a standard 1U or 2U server heatsink — is sufficient to manage thermals under sustained load, without requiring exotic liquid cooling or oversized heatsinks.

Given the 65 nm process node and the dual-die layout (2x 143 mm²), the 50 W TDP is achieved through conservative clocking — the base clock is 2,000.00 MHz with no boost clock available. This suggests the processor prioritizes efficiency over peak performance, a trade-off that aligns with its server/workstation positioning. The lack of an unlocked multiplier reinforces that this is a fixed-clock part, so users cannot push it beyond its stock 2.0 GHz frequency. In practice, the thermal headroom from 50 W means that system integrators can populate multi-socket boards with several of these chips without exceeding typical power budgets, though the absolute performance ceiling remains low.

Platform and Compatibility

The L5335 uses Intel Socket 771, a server socket that supports dual-processor configurations on compatible motherboards. Memory support is dual-channel DDR2 or DDR3, but the fact pack specifies that this "depends on motherboard" — meaning the chip itself does not mandate a memory type, but the board’s memory controller determines which standard is used. ECC memory is supported, which is critical for server reliability, but the memory bus is dual-channel only, limiting memory bandwidth compared to later triple- or quad-channel platforms. PCIe support is not listed in the data, so no specific lane count or version can be stated; however, the platform’s age suggests legacy PCIe generations are typical.

The processor is part of the Clovertown generation, which is a dual-die design — each die has 4 MB of L2 cache, for a total of 8 MB across the package, with 64 KB of L1 per core. The L3 cache is not present, as indicated by null values. The upgrade path is effectively non-existent: the production status is "end-of-life," and the Socket 771 platform has been obsolete for years. Users on this socket are limited to other Clovertown or later Harpertown Xeons, but the L5335’s low TDP and 2.0 GHz clock make it a specific choice for low-power servers rather than a stepping stone to higher performance. The launch MSRP was $380, which reflected its mid-range server positioning at the time, though current market pricing is not relevant to its technical profile.

FAQ

Q: What is the L5335’s core and thread count?

A: It has 4 cores and 4 threads, with no hyper-threading, so it processes one thread per core.

Q: Does the L5335 support ECC memory?

A: Yes, ECC memory is supported, which is essential for error-correcting workloads in server environments.

Q: What is the TDP and what cooling does it require?

A: The TDP is 50 W, which is low for a quad-core server chip; a standard air cooler for a 1U or 2U server chassis is sufficient.

Q: Can the L5335 be overclocked?

A: No, the multiplier is locked, and the base clock is fixed at 2,000.00 MHz with no boost clock available.

Q: What memory types does it work with?

A: It supports DDR2 or DDR3, but the specific type depends on the motherboard’s memory controller, not the CPU itself.

Q: How does the L5335 compare to the Intel Xeon E5405?

A: The L5335’s average benchmark score of 508 is 0.9% lower than the E5405’s 513, making them nearly identical in performance.

How It Compares

Intel Core i5-2557M: The L5335 edges out this mobile dual-core processor by 0.6% in average benchmark score (508 vs. 505). Despite being a server chip, the L5335’s 4 cores and 4 threads give it a slight aggregate edge over the i5-2557M, which is a low-voltage laptop part. The performance difference is negligible, though the L5335’s server-specific features like ECC support and Socket 771 set it apart in purpose.

AMD Phenom II X4 900e: The L5335 is 0.7% faster than this AMD quad-core (508 vs. 505). Both are 4-core, 4-thread parts from the late 2000s, and their benchmark scores are effectively tied. The Phenom II X4 900e targets desktops, while the L5335 is for servers, but in raw compute, they are interchangeable within measurement error.

Intel Core i7-720QM: The L5335 trails this mobile quad-core by 0.7% (508 vs. 512). The i7-720QM benefits from hyper-threading (4 cores, 8 threads) but runs at a lower base clock; the L5335’s higher 2.0 GHz clock partially compensates. Still, the i7-720QM holds a slight aggregate lead, making it a marginally better performer in mixed workloads.

Intel Xeon E5405: The L5335 is 0.9% slower than this fellow Xeon (508 vs. 513). Both are Socket 771 server parts, but the E5405 is a later Harpertown chip with a higher average score. The delta is small enough that for most server tasks, the two are interchangeable, though the E5405 offers a tiny performance edge that may matter in tightly benchmarked environments.

Detailed benchmark scores and charts for the Intel Xeon L5335 are below.

Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Xeon L5335 performs in parallel rendering workloads like video production and 3D animation. The R15 version remains useful for comparing against older hardware benchmarks. Higher scores directly correlate with faster render times in Cinema 4D and similar 3D applications.

cinebench_cinebench_r15_multicore #1796 of 1967
148
1%
Max: 14,978

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Xeon L5335. The more demanding workload provides better differentiation between current-generation processors.

cinebench_cinebench_r20_multicore #1615 of 1786
619
1%
Max: 62,412

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Xeon L5335. The increased complexity provides more accurate performance differentiation between modern CPUs.

cinebench_cinebench_r20_singlecore #1611 of 1776
87
1%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Xeon L5335 after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss.

cinebench_cinebench_r23_multicore #1764 of 1938
1,476
1%
Max: 148,601
Compare with other CPUs

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Xeon L5335 maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance.

cinebench_cinebench_r23_singlecore #1752 of 1923
208
1%
Max: 20,979

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