AMD Ryzen Embedded V2516

The AMD Ryzen Embedded V2516 is a 6-core, 12-thread desktop processor from AMD’s Ryzen Embedded line, built on Zen 2 (Renoir) and manufactured by TSMC on a 7 nm process. It runs at a 2.10 GHz base clock and a 3.95 GHz boost clock, with a 10 W TDP, a 56th-percentile aggregate score of 3277, and a production status of Active. The part also includes Radeon Graphics with 384 shader processors, dual-channel DDR4 memory support with ECC, and PCIe Gen 3 with 20 lanes from the CPU.

Benchmark Performance

The Cinebench results in the FACT PACK give a clear picture of a processor whose multi-threaded output is substantially stronger than its single-threaded output. In Cinebench R15, the V2516 scores 1141 multicore and 161 singlecore. In R20, the multicore score is 4758 and the singlecore score is 671. In R23, the multicore score reaches 11329, with a singlecore score of 1599. These three generations of Cinebench all point to the same trait: the multi-core result is the more compelling number, while the single-core result is modest.

The aggregate benchmark score is 3277, and the 56th percentile among all CPUs puts this part above the median of the database but not near the top. The nearestRivals cluster reinforces that interpretation. The Intel Xeon E5-2650 v4 has an average score of 3276 with a deltaPct of 0, placing it in a statistical tie with the V2516. The Intel Xeon E-2136 scores 3274, a 0.1% difference. The AMD Ryzen 3 3300X scores 3272, a 0.2% advantage for the V2516. The Intel Xeon D-1587 scores 3282, which places the V2516 0.2% behind the only rival with a higher average score.

The margins between the V2516 and its nearest rivals are narrow in all directions. Benchmark results indicate a CPU sitting inside a dense performance band rather than one with a clear aggregate advantage over its closest competitors. The R23 multicore score of 11329 is the strongest absolute result in the dataset, and the R23 singlecore score of 1599 is the correspondingly lower figure. The average benchmark score of 3277 remains the central database metric for comparing this chip to the wider field.

Who Should Consider It

For multi-threaded creation workloads, the V2516’s Cinebench R23 multicore score of 11329 is the relevant data point. With 6 cores and 12 threads, 8 MB of shared L3 cache, 512 KB of L2 cache per core, and 64 KB of L1 cache per core, the part has enough parallel execution resources for threaded rendering or encoding tasks. The R20 multicore score of 4758 and the R15 multicore score of 1141 corroborate that it scales with core count, even though the 10 W TDP keeps the overall envelope low.

For office and general desktop use, single-threaded performance is more important. The R15 singlecore score of 161, the R20 singlecore score of 671, and the R23 singlecore score of 1599 indicate a moderate level of single-thread throughput. The presence of Radeon Graphics with 384 shader processors means a discrete GPU is not required for basic display output, although the FACT PACK provides no gaming-specific performance data. For gaming conclusions, the data is insufficient: no game benchmark appears, and the integrated graphics specification alone does not quantify frame rates.

For embedded or compact desktop platforms, the 10 W TDP, Socket FP6, and Active production status make this a practical part for constrained system designs. The dual-channel DDR4 memory bus with 51.2 GB/s bandwidth and ECC support adds the sort of memory integrity that is useful in always-on or reliability-oriented systems. The 20 PCIe Gen 3 lanes from the CPU give the platform room for standard expansion devices, though the exact number of usable lanes depends on system integration and is not detailed in the FACT PACK.

How It Compares

Against the Intel Xeon E5-2650 v4, the V2516 is effectively tied. The V2516’s average score of 3277 compares with 3276 for the Xeon, and the deltaPct is 0. The aggregate difference is negligible, so the two CPUs occupy the same performance tier.

Against the Intel Xeon E-2136, the V2516 holds a 0.1% lead. The average scores are 3277 and 3274, respectively. This is a narrow advantage, but it is a positive one in the database comparison.

Against the AMD Ryzen 3 3300X, the V2516 is 0.2% ahead, with 3277 versus 3272. This is the largest positive deltaPct in the nearestRivals group, yet it remains a small margin in absolute aggregate score.

Against the Intel Xeon D-1587, the V2516 is 0.2% behind, with 3277 versus 3282. The Xeon D-1587 is the only rival in the nearestRivals list with a higher average score, and its margin is small.

FAQ

Q: Does the AMD Ryzen Embedded V2516 support ECC memory?

A: Yes. The FACT PACK lists ECC memory support as true, with dual-channel DDR4 memory support and 51.2 GB/s memory bandwidth.

Q: What are the base and boost clocks?

A: The base clock is 2.10 GHz and the boost clock is 3.95 GHz.

Q: Does the processor include integrated graphics?

A: Yes, it includes Radeon Graphics with 384 shader processors, listed as "Radeon Graphics 384SP."

Q: What socket and platform connections does it use?

A: It uses AMD Socket FP6, has PCIe Gen 3 with 20 lanes from the CPU, and supports dual-channel DDR4 memory.

Q: How does it compare to the Intel Xeon E-2136?

A: In aggregate benchmark score, the V2516 scores 3277 versus 3274 for the Xeon E-2136, a 0.1% advantage.

Q: Is the multiplier unlocked?

A: No. The multiplierUnlocked field is false.

Power and Thermals

The only power specification in the FACT PACK is a 10 W TDP. For a 6-core, 12-thread Zen 2 desktop part, this is a very low thermal envelope and is the central factor in cooling design. The 7 nm TSMC process, with 9,800 million transistors on a 156 mm² die, is the physical context that explains how this core count can fit into that TDP class. The integrated Radeon Graphics with 384 shader processors is present on the part, but no separate graphics power figure is listed.

The implied cooling tier is a low-power one. A 10 W TDP does not demand the cooling solution associated with a high-power desktop CPU. The Socket FP6 platform and Active production status mean current designs can be built around this thermal budget. The multiplier is not unlocked, so the cooling solution does not need to account for user overclocking. The data shows a part whose thermal behavior is defined by a small package envelope and a modest power class, rather than by high-current or extreme boost requirements.