AMD Ryzen 7 8700F vs Qualcomm Snapdragon X1E-80-100 Comparison

AMD
AMD

AMD Ryzen 7 8700F

CORE STATE Phoenix
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 4.1 Base / 5 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X1E-80-100

CORE STATE Oryon
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 3.4 Base / 4 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 35W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

3dmark_16_threads
7,883
N/A
3dmark_2_threads
1,989
N/A
3dmark_4_threads
3,839
N/A
3dmark_8_threads
6,559
N/A
3dmark_max_threads
7,861
N/A
3dmark_single_thread
1,008
N/A
cinebench_cinebench_r15_multicore
2,685
N/A
cinebench_cinebench_r15_singlecore
378
N/A
cinebench_cinebench_r20_multicore
11,191
N/A
cinebench_cinebench_r20_singlecore
1,579
N/A
cinebench_cinebench_r23_multicore
26,646
N/A
cinebench_cinebench_r23_singlecore
3,761
N/A
geekbench_multicore
13,523
N/A
geekbench_singlecore
2,290
N/A
passmark_data_compression
378,160
N/A
passmark_data_encryption
22,117
N/A
passmark_extended_instructions
28,474
N/A
passmark_find_prime_numbers
98
N/A
passmark_floating_point_math
62,629
N/A
passmark_integer_math
100,371
N/A
passmark_multithread
30,893
N/A
passmark_physics
1,553
N/A
passmark_random_string_sorting
45,425
N/A
passmark_single_thread
3,872
N/A
passmark_singlethread
3,872
N/A

Analysis: AMD Ryzen 7 8700F vs Qualcomm Snapdragon X1E-80-100

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark comparisons between the AMD Ryzen 7 8700F and the Qualcomm Snapdragon X1E-80-100. The recorded data for the AMD part is extensive, covering 3DMark, Cinebench, Geekbench, and PassMark suites. The Qualcomm part has no benchmark scores recorded at all. This absence of direct measurements means the comparison must rely on the available scores for the AMD processor and its percentile position, while the Qualcomm side is evaluated from its architectural specifications alone.

The AMD Ryzen 7 8700F delivers a 3DMark single-thread score of 1008, a 2-thread score of 1989, a 4-thread score of 3839, an 8-thread score of 6559, a 16-thread score of 7883, and a max-thread score of 7861. These results show strong scaling from 2 to 4 threads, with a 93% increase, and from 4 to 8 threads, with a 71% increase. The jump from 8 to 16 threads is smaller at 20%, which reflects the architecture's efficiency in managing additional threads beyond eight. The max-thread score of 7861 sits just below the 16-thread score of 7883, indicating that the processor's 16 threads are fully utilized and additional workload scaling is minimal.

In Cinebench, the R15 multicore score is 2685 with a single-core score of 378. The R20 multicore score reaches 11191 with a single-core score of 1579. The R23 multicore score is 26646 with a single-core score of 3761. The ratio of multicore to single-core performance in R23 is roughly 7.1 to 1, which demonstrates strong multi-threaded capability for an 8-core, 16-thread processor. The Geekbench multicore score is 13523 with a single-core score of 2290, giving a multicore-to-single-core ratio of about 5.9 to 1.

PassMark results for the AMD part show integer math at 100371, floating point math at 62629, extended instructions at 28474, data compression at 378160, data encryption at 22117, find prime numbers at 98, random string sorting at 45425, physics at 1553, multithread at 30893, and single-thread at 3872. The integer math score is notably higher than floating point, with a 60% advantage, which indicates the processor handles integer-heavy workloads more efficiently. The physics score of 1553 is relatively low compared to the multithread score of 30893, suggesting the physics test is more sensitive to single-thread performance. The data compression score of 378160 is the highest single PassMark result, while find prime numbers at 98 is the lowest, reflecting the test's sensitivity to integer throughput and memory latency respectively.

The AMD Ryzen 7 8700F holds a percentile rank of 82 among all CPUs in the database, and its average benchmark score is 30746. Its nearest rivals include the AMD Ryzen 5 PRO 8645HS with an average score of 30879 and a delta of -0.4%, the Intel Core i5-13600H at 30548 with a delta of 0.6%, the Intel Core Ultra 5 225T at 30468 with a delta of 0.9%, and the Intel Core i7-13700TE at 31028 with a delta of -0.9%. These deltas are all within 1% of the 8700F's average score, placing the processor in a tightly contested performance tier. The Qualcomm Snapdragon X1E-80-100 has a percentile rank of 50 and an average benchmark score of 0, with no nearest rivals recorded, which reflects the absence of benchmark data for that part.

Architecture Differences

The AMD Ryzen 7 8700F uses the Zen 4 architecture under the codename Phoenix, fabricated on a TSMC 4 nm process node. It has 8 cores and 16 threads, with a base clock of 4.10 GHz and a boost clock of 5.00 GHz. The processor contains 25,000 million transistors on a die size of 178 mm². Its cache hierarchy includes 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm Snapdragon X1E-80-100 uses the Oryon codename under the Snapdragon X (Elite) generation, also fabricated on a TSMC 4 nm process node. It has 12 cores and 12 threads, with a base clock of 3.40 GHz and a boost clock of 4.00 GHz. Its cache includes 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3 cache. The transistor count and die size for the Qualcomm part are not recorded in the database.

The AMD processor supports DDR5 memory on a dual-channel bus with a bandwidth of 83.2 GB/s. The Qualcomm processor supports LPDDR5X memory on a dual-channel bus with a bandwidth of 135.2 GB/s, which is 62.5% higher than the AMD part. The AMD processor uses AMD Socket AM5 and has 20 PCIe Gen 4 lanes from the CPU, while the Qualcomm part uses Qualcomm BGA 2073 and has 12 PCIe Gen 4 lanes. The AMD chip has no integrated graphics, while the Qualcomm chip includes Adreno X1-85 graphics. The AMD processor has an unlocked multiplier, whereas the Qualcomm multiplier is locked. The AMD part is classified as a desktop processor with the market segment Desktop, while the Qualcomm part is classified as Mobile. The AMD processor was released on 2024-03-31, and the Qualcomm part was released on 2024-04-23.

The power envelope differs substantially: the AMD processor has a TDP of 65 watts, while the Qualcomm part is rated at 35 watts. The Qualcomm part's lower TDP, combined with its higher memory bandwidth, suggests a design optimized for mobile efficiency rather than raw throughput. The AMD processor's higher base and boost clocks (4.10 GHz and 5.00 GHz versus 3.40 GHz and 4.00 GHz) indicate a focus on single-thread responsiveness, while the Qualcomm part's 12 cores versus 8 cores aim at parallel workload handling, though its 12 threads match its 12 cores, meaning no simultaneous multithreading.

The Verdict

The recorded data shows the AMD Ryzen 7 8700F with an average benchmark score of 30746 and a percentile rank of 82, placing it in the upper tier of all CPUs in the database. Its nearest rivals, all within 1% in average score, confirm it sits among strong competitors. The Qualcomm Snapdragon X1E-80-100 has no benchmark scores and a percentile rank of 50, which is the median position, but this rank is based on no recorded measurements. The absence of data for the Qualcomm part means no performance comparison can be made directly.

For users selecting based on the available benchmark results, the AMD Ryzen 7 8700F is the only part with measurable performance data in this comparison. Its Cinebench R23 multicore score of 26646 and single-core score of 3761 demonstrate capability across both multi-threaded and single-threaded workloads. The PassMark multithread score of 30893 and single-thread score of 3872 further support this. The Qualcomm part's specifications, including 12 cores and a 35-watt TDP, indicate a mobile-focused design, but without benchmark scores, its practical performance cannot be assessed from the database.

The AMD processor's unlocked multiplier allows overclocking, which is supported by its boost clock of 5.00 GHz. The Qualcomm part's locked multiplier and mobile market segment suggest it is intended for fixed configurations in laptops. The AMD part's desktop segment and AM5 socket align with a build-your-own desktop use case, while the Qualcomm part's BGA 2073 socket is a soldered mobile solution. The data does not support a performance verdict for the Qualcomm part; it only allows a specification-based description.

Specification Differences

The two processors differ in core count: the AMD Ryzen 7 8700F has 8 cores and 16 threads, while the Qualcomm Snapdragon X1E-80-100 has 12 cores and 12 threads. The AMD part has a higher base clock at 4.10 GHz versus 3.40 GHz, and a higher boost clock at 5.00 GHz versus 4.00 GHz. The TDP differs: AMD at 65 watts, Qualcomm at 35 watts. The socket is AMD Socket AM5 for the AMD part and Qualcomm BGA 2073 for the Qualcomm part. The architecture for AMD is Zen 4 with codename Phoenix, while the Qualcomm part has no architecture field recorded but a codename of Oryon. The process node is the same at 4 nm from TSMC for both, but the transistor count and die size are only recorded for AMD at 25,000 million transistors and 178 mm².

The cache configuration differs: AMD uses 64 KB L1 per core, 1 MB L2 per core, and 16 MB shared L3. Qualcomm uses 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3. Memory support differs: AMD uses DDR5 with 83.2 GB/s bandwidth, Qualcomm uses LPDDR5X with 135.2 GB/s bandwidth. Both support dual-channel memory. PCIe lanes differ: AMD has 20 Gen 4 lanes, Qualcomm has 12 Gen 4 lanes. Integrated graphics are absent on AMD but present as Adreno X1-85 on Qualcomm. The market segment is Desktop for AMD and Mobile for Qualcomm. The AMD processor has an unlocked multiplier; the Qualcomm multiplier is locked. The release dates are 2024-03-31 for AMD and 2024-04-23 for Qualcomm. The AMD part has a launch MSRP of $270, and the Qualcomm part has no launch MSRP recorded. ECC memory support is false for both, and both are marked as Active in production status.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1E-80-100 has 12 cores, while the AMD Ryzen 7 8700F has 8 cores. However, the AMD processor has 16 threads, whereas the Qualcomm part has 12 threads.

Q: What are the clock speed differences?

A: The AMD Ryzen 7 8700F has a base clock of 4.10 GHz and a boost clock of 5.00 GHz. The Qualcomm Snapdragon X1E-80-100 has a base clock of 3.40 GHz and a boost clock of 4.00 GHz.

Q: How does memory bandwidth compare?

A: The Qualcomm Snapdragon X1E-80-100 supports LPDDR5X memory with a bandwidth of 135.2 GB/s. The AMD Ryzen 7 8700F supports DDR5 memory with a bandwidth of 83.2 GB/s, which is 52 GB/s lower.

Q: Does either processor include integrated graphics?

A: The Qualcomm Snapdragon X1E-80-100 includes Adreno X1-85 integrated graphics. The AMD Ryzen 7 8700F has no integrated graphics.

Q: What is the TDP of each processor?

A: The AMD Ryzen 7 8700F has a TDP of 65 watts. The Qualcomm Snapdragon X1E-80-100 has a TDP of 35 watts.

Q: Are the benchmark scores for both processors available?

A: The AMD Ryzen 7 8700F has extensive benchmark scores, including a Cinebench R23 multicore score of 26646 and a Geekbench multicore score of 13523. The Qualcomm Snapdragon X1E-80-100 has no benchmark scores recorded in the database.

DETAILED SPECIFICATIONS

SPECIFICATION
7 8700F
Snapdragon X1E-80-100
Core Specs
Cores
8
12 +50.0%
Threads
16
12 -25.0%
Base Clock (GHz)
4.1
3.4 -17.1%
Boost Clock (GHz)
5
4 -20.0%
Frequency (GHz)
4.1
3.4 -17.1%
Turbo Clock (GHz)
5
4 -20.0%
Multiplier
41
34 -17.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
288 KB (per core)
L2 Cache
1 MB (per core)
12 MB (per module)
L3 Cache
16 MB (shared)
6 MB (shared)
Power
TDP (W)
65
35 -46.2%
PL2
—
80 W
PPT
61-88 W
—
Configurable TDP
45 W
—
Architecture
Architecture
Zen 4
—
Codename
Phoenix
Oryon
Generation
Ryzen 7 (Zen 4 (Phoenix))
Snapdragon X (Elite)
Process Size
4 nm
4 nm
Transistors
25,000 million
—
Die Size
178 mm²
—
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
135.2 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM5
Qualcomm BGA 2073
Chipsets
X670E, X670, B650E, B650, A620
—
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
AI/NPU
NPU
Yes / 16 TOPS
Yes / 45 TOPS
Graphics
Integrated Graphics
—
Adreno X1-85
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$270
—
Part Number
100-000001590
X1E80100
Package
FC-LGA1718
FC-BGA
Tj Max
95°C
—
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