CPU Comparison

AMD
AMD

AMD Ryzen 9 PRO 5945

CORE STATE Vermeer
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
Intel
INTEL

Xeon Platinum 8270

CORE STATE Cascade Lake-SP
CORE SPECS 26 Cores / 52 Threads
CLOCK SPEED 2.7 Base / 4 GHz Turbo
CACHE 35.75 MB (shared)
MAX TDP 205W
ARCHITECTURE Cascade Lake
nm
PROCESS 14 nm
LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,959
2,568
cinebench_cinebench_r15_singlecore
417
362
cinebench_cinebench_r20_multicore
12,333
10,704
cinebench_cinebench_r20_singlecore
1,740
1,511
cinebench_cinebench_r23_multicore
29,366
25,488
cinebench_cinebench_r23_singlecore
4,145
3,598
passmark_data_compression
416,599
728,144
passmark_data_encryption
26,313
8,798
passmark_extended_instructions
27,031
51,191
passmark_find_prime_numbers
228
84
passmark_floating_point_math
70,291
99,432
passmark_integer_math
129,768
160,322
passmark_multithread
34,549
29,986
passmark_physics
1,772
903
passmark_random_string_sorting
43,447
80,208
passmark_single_thread
3,499
2,325
passmark_singlethread
3,499
2,325

DETAILED SPECIFICATIONS

SPECIFICATION
9 PRO 5945
Platinum 8270
Core Specs
Cores
12
26 +116.7%
Threads
24
52 +116.7%
Base Clock (GHz)
3
2.7 -10.0%
Boost Clock (GHz)
4.7
4 -14.9%
Frequency (GHz)
3
2.7 -10.0%
Turbo Clock (GHz)
4.7
4 -14.9%
Multiplier
30
27 -10.0%
SMP CPUs
1
8 +700.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
35.75 MB (shared)
Power
TDP (W)
65
205 +215.4%
PPT
88 W
โ€”
Architecture
Architecture
Zen 3
Cascade Lake
Codename
Vermeer
Cascade Lake-SP
Generation
Ryzen 9 (Zen 3 (Vermeer))
Xeon Platinum (Cascade Lake-SP)
Process Size
7 nm
14 nm
Transistors
8,300 million
8,000 million
Die Size
2x 74 mmยฒ
โ€”
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
โ€”
Memory Bandwidth
51.2 GB/s
โ€”
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM4
Intel Socket 3647
PCIe
Gen 4, 20 Lanes(CPU only)
โ€”
AMD Multi-Die
IO Process Size
12 nm
โ€”
Other
Market
Desktop
Server/Workstation
Production Status
Active
โ€”
Part Number
100-000000831
SRF96CD8069504195201
Package
ยตOPGA-1331
FC-LGA3647
Bundled Cooler
None
โ€”
View Ryzen 9 PRO 5945 Details View Xeon Platinum 8270 Details