CPU Comparison

AMD
AMD

AMD Ryzen 9 7945HX3D

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.3 Base / 5.4 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
Intel
INTEL

Xeon Platinum 8260M

CORE STATE Cascade Lake-SP
CORE SPECS 24 Cores / 48 Threads
CLOCK SPEED 2.4 Base / 3.9 GHz Turbo
CACHE 35.75 MB (shared)
MAX TDP 165W
ARCHITECTURE Cascade Lake
nm
PROCESS 14 nm
LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

3dmark_16_threads
12,459
N/A
3dmark_2_threads
2,095
N/A
3dmark_4_threads
3,937
N/A
3dmark_8_threads
7,330
N/A
3dmark_max_threads
12,936
N/A
3dmark_single_thread
1,071
N/A
cinebench_cinebench_r15_multicore
4,922
2,963
cinebench_cinebench_r15_singlecore
694
418
cinebench_cinebench_r20_multicore
20,510
12,349
cinebench_cinebench_r20_singlecore
2,895
1,743
cinebench_cinebench_r23_multicore
48,834
29,403
cinebench_cinebench_r23_singlecore
6,894
4,151
geekbench_multicore
16,758
N/A
geekbench_singlecore
2,769
N/A
passmark_data_compression
699,988
573,896
passmark_data_encryption
42,367
17,625
passmark_extended_instructions
52,310
35,529
passmark_find_prime_numbers
446
141
passmark_floating_point_math
121,619
73,514
passmark_integer_math
201,217
129,213
passmark_multithread
57,476
34,592
passmark_physics
4,321
2,080
passmark_random_string_sorting
83,919
69,236
passmark_single_thread
4,050
2,320
passmark_singlethread
4,050
2,320

DETAILED SPECIFICATIONS

SPECIFICATION
9 7945HX3D
Platinum 8260M
Core Specs
Cores
16
24 +50.0%
Threads
32
48 +50.0%
Base Clock (GHz)
2.3
2.4 +4.3%
Boost Clock (GHz)
5.4
3.9 -27.8%
Frequency (GHz)
2.3
2.4 +4.3%
Turbo Clock (GHz)
5.4
3.9 -27.8%
Multiplier
23
24 +4.3%
SMP CPUs
1
8 +700.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
128 MB (shared)
35.75 MB (shared)
3D V-Cache
1x 64MB Slice
โ€”
Power
TDP (W)
55
165 +200.0%
PPT
55-75 W
โ€”
Architecture
Architecture
Zen 4
Cascade Lake
Codename
Dragon Range
Cascade Lake-SP
Generation
Ryzen 9 (Zen 4 (Dragon Range))
Xeon Platinum (Cascade Lake-SP)
Process Size
5 nm
14 nm
Transistors
17,840 million
8,000 million
Die Size
2x 71 mmยฒ
โ€”
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
โ€”
Memory Bandwidth
83.2 GB/s
โ€”
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FL1
Intel Socket 3647
PCIe
Gen 5, 28 Lanes(CPU only)
โ€”
AMD Multi-Die
IO Process Size
6 nm
โ€”
Graphics
Integrated Graphics
Radeon 610M
โ€”
Other
Market
Mobile
Server/Workstation
Production Status
Active
โ€”
Part Number
100-000001086
SRF9JCD8069504201201
Package
ยตFC-BGAFL1
FC-LGA3647
Tj Max
100ยฐC
โ€”
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