CPU Comparison

A

AMD

AMD

AMD Ryzen 3 PRO 8300G

CORE STATE Phoenix2

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.4 Base / 4.9 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 4

nm

PROCESS 4 nm

LAUNCH DATE 2024

VS

i

Intel

INTEL

Xeon Phi 7210

CORE STATE Knights Landing

CORE SPECS 64 Cores / 256 Threads

CLOCK SPEED 1300 Base / 1500 GHz Turbo

CACHE —

MAX TDP 215W

ARCHITECTURE Knights Landing

nm

PROCESS 14 nm

LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,245

625

cinebench_cinebench_r15_singlecore

175

88

cinebench_cinebench_r20_multicore

5,190

2,608

cinebench_cinebench_r20_singlecore

732

367

cinebench_cinebench_r23_multicore

12,359

6,210

cinebench_cinebench_r23_singlecore

1,744

876

passmark_data_compression

163,197

332,960

passmark_data_encryption

9,350

3,455

passmark_extended_instructions

12,360

18,359

passmark_find_prime_numbers

54

10

passmark_floating_point_math

25,293

29,356

passmark_integer_math

40,469

84,874

passmark_multithread

14,540

7,306

passmark_physics

897

198

passmark_random_string_sorting

20,343

8,956

passmark_single_thread

3,844

460

passmark_singlethread

3,844

460

DETAILED SPECIFICATIONS

SPECIFICATION

3 PRO 8300G

Phi 7210

Core Specs

Cores

4

64 +1500.0%

Threads

8

256 +3100.0%

Base Clock (GHz)

3.4

1,300 +38135.3%

Boost Clock (GHz)

4.9

1,500 +30512.2%

Frequency (GHz)

3.4

1,300 +38135.3%

Turbo Clock (GHz)

4.9

1,500 +30512.2%

Multiplier

40

13 -67.5%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

32 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

8 MB (shared)

—

Power

TDP (W)

65

215 +230.8%

PPT

61-88 W

—

Configurable TDP

45 W

—

Architecture

Architecture

Zen 4

Knights Landing

Codename

Phoenix2

Knights Landing

Generation

Ryzen 3 (Zen 4 (Phoenix))

Xeon Phi (Knights Landing)

Process Size

4 nm

14 nm

Transistors

20,900 million

8,000 million

Die Size

137 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

83.2 GB/s

—

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM5

Intel Socket 3647

Chipsets

X870E, X870, B850, B840, X670E, X670, B650E, B650, A620

—

PCIe

Gen 4, 14 Lanes(CPU only)

—

Intel Hybrid

Hybrid Cores

1 + 3

—

E-Core Frequency

3.2 GHz up to 3.6 GHz

—

Graphics

Integrated Graphics

Radeon 740M

—

Other

Market

Desktop

Server/Workstation

Production Status

Active

—

Part Number

100-000001187

SR2MESR2X4

Package

FC-LGA1718

FC-LGA3647

Tj Max

95°C

—

Bundled Cooler

Wraith Stealth

—

View Ryzen 3 PRO 8300G Details View Xeon Phi 7210 Details