CPU Comparison

AMD
AMD

AMD Ryzen 7 PRO 5845

CORE STATE Vermeer
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.4 Base / 4.6 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
Intel
INTEL

Xeon Gold 5318H

CORE STATE Cooper Lake-SP
CORE SPECS 18 Cores / 36 Threads
CLOCK SPEED 2.5 Base / 3.8 GHz Turbo
CACHE 24.75 MB (shared)
MAX TDP 150W
ARCHITECTURE Cooper Lake
nm
PROCESS 14 nm
LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,232
2,510
cinebench_cinebench_r15_singlecore
314
354
cinebench_cinebench_r20_multicore
9,300
10,460
cinebench_cinebench_r20_singlecore
1,312
1,476
cinebench_cinebench_r23_multicore
22,145
24,905
cinebench_cinebench_r23_singlecore
3,126
3,516
passmark_data_compression
314,363
470,916
passmark_data_encryption
19,815
10,743
passmark_extended_instructions
21,117
33,730
passmark_find_prime_numbers
115
141
passmark_floating_point_math
52,105
66,610
passmark_integer_math
94,884
107,603
passmark_multithread
26,054
29,301
passmark_physics
1,109
2,309
passmark_random_string_sorting
33,754
58,841
passmark_single_thread
3,442
2,225
passmark_singlethread
3,442
2,225

DETAILED SPECIFICATIONS

SPECIFICATION
7 PRO 5845
Gold 5318H
Core Specs
Cores
8
18 +125.0%
Threads
16
36 +125.0%
Base Clock (GHz)
3.4
2.5 -26.5%
Boost Clock (GHz)
4.6
3.8 -17.4%
Frequency (GHz)
3.4
2.5 -26.5%
Turbo Clock (GHz)
4.6
3.8 -17.4%
Multiplier
34
25 -26.5%
SMP CPUs
1
4 +300.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
32 MB (shared)
24.75 MB (shared)
Power
TDP (W)
65
150 +130.8%
PPT
88 W
โ€”
Architecture
Architecture
Zen 3
Cooper Lake
Codename
Vermeer
Cooper Lake-SP
Generation
Ryzen 7 (Zen 3 (Vermeer))
Xeon Gold (Cooper Lake-SP)
Process Size
7 nm
14 nm
Transistors
4,150 million
โ€”
Die Size
74 mmยฒ
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Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Six-channel
Memory Bandwidth
51.2 GB/s
128.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM4
Intel Socket 4189
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
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PCIe
Gen 4, 20 Lanes(CPU only)
Gen 3, 48 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
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Other
Market
Desktop
Server/Workstation
Production Status
Active
Active
Part Number
100-000000832
SRJY3CD8070604481600
Package
ยตOPGA-1331
FC-LGA4189
Bundled Cooler
None
โ€”
View Ryzen 7 PRO 5845 Details View Xeon Gold 5318H Details