CPU Comparison

AMD
AMD

AMD Ryzen 7 8745HX

CORE STATE Dragon Range
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5.1 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Xeon E5-2676 v3

CORE STATE Haswell-EP
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2.4 Base / 3 GHz Turbo
CACHE 30 MB (shared)
MAX TDP 120W
ARCHITECTURE Haswell
nm
PROCESS 22 nm
LAUNCH DATE —

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
N/A
1,138
cinebench_cinebench_r15_singlecore
N/A
160
cinebench_cinebench_r20_multicore
N/A
4,743
cinebench_cinebench_r20_singlecore
N/A
669
cinebench_cinebench_r23_multicore
N/A
11,293
cinebench_cinebench_r23_singlecore
N/A
1,594

DETAILED SPECIFICATIONS

SPECIFICATION
7 8745HX
E5-2676 v3
Core Specs
Cores
8
12 +50.0%
Threads
16
24 +50.0%
Base Clock (GHz)
3.6
2.4 -33.3%
Boost Clock (GHz)
5.1
3 -41.2%
Frequency (GHz)
3.6
2.4 -33.3%
Turbo Clock (GHz)
5.1
3 -41.2%
Multiplier
36
24 -33.3%
SMP CPUs
1
2 +100.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
256 KB (per core)
L3 Cache
32 MB (shared)
30 MB (shared)
Power
TDP (W)
55
120 +118.2%
Configurable TDP
45-75 W
—
Architecture
Architecture
Zen 4
Haswell
Codename
Dragon Range
Haswell-EP
Generation
Ryzen 7 (Zen 4 (Dragon Range))
Xeon E5 (Haswell-EP)
Process Size
5 nm
22 nm
Transistors
6,570 million
2,600 million
Die Size
71 mm²
356 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR3, DDR4
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
83.2 GB/s
68.3 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FL1
Intel Socket 2011-3
Chipsets
—
C612, X99
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 3, 40 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Interconnect
QPI Links
—
2x 9600MT/s
Graphics
Integrated Graphics
Radeon 610M
—
Other
Market
Mobile
Server/Workstation
Production Status
Active
End-of-life
Part Number
100-000001851
SR1Y5
Package
µFC-BGAFL1
FC-LGA12A
Tj Max
100°C
85°C
View Ryzen 7 8745HX Details View Xeon E5-2676 v3 Details