CPU Comparison
AMD
AMD Ryzen 7 PRO 3700
CORE STATE
Matisse
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.6 Base / 4.4 GHz Turbo
CACHE
32 MB
MAX TDP
65W
ARCHITECTURE
Zen 2
PROCESS
7 nm
LAUNCH DATE
2019
VS
INTEL
Xeon E-2286M
CORE STATE
Coffee Lake-H
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2.4 Base / 5 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
45W
ARCHITECTURE
Coffee Lake
PROCESS
14 nm
LAUNCH DATE
2019
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
7 PRO 3700
E-2286M
Core Specs
Cores
8
8
0.0%
Threads
16
16
0.0%
Base Clock (GHz)
3.6
2.4
-33.3%
Boost Clock (GHz)
4.4
5
+13.6%
Frequency (GHz)
3.6
2.4
-33.3%
Turbo Clock (GHz)
4.4
5
+13.6%
Multiplier
36
24
-33.3%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
32 MB
16 MB (shared)
Power
TDP (W)
65
45
-30.8%
PPT
88 W
—
Configurable TDP
—
35 W
Architecture
Architecture
Zen 2
Coffee Lake
Codename
Matisse
Coffee Lake-H
Generation
Ryzen 7
(Zen 2 (Matisse))
Xeon E
(Coffee Lake)
Process Size
7 nm
14 nm
Transistors
3,800 million
—
Die Size
74 mm²
180 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
42.7 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket AM4
Intel BGA 1440
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
—
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
—
Graphics
Integrated Graphics
—
UHD Graphics P630
Other
Market
Desktop
Server/Workstation
Production Status
Active
End-of-life
Launch Price
—
$623
Part Number
100-000000073
SRFCZ
Package
µOPGA-1331
FC-BGA1440
Tj Max
95°C
100°C