CPU Comparison
AMD
AMD Ryzen 3 7335U
CORE STATE
Rembrandt-R
CORE SPECS
4 Cores / 8 Threads
CLOCK SPEED
3 Base / 4.3 GHz Turbo
CACHE
8 MB (shared)
MAX TDP
28W
ARCHITECTURE
Zen 3+
PROCESS
6 nm
LAUNCH DATE
2023
VS
INTEL
Xeon D-2752TER
CORE STATE
Ice Lake-D
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
1800 Base / 2.8 GHz Turbo
CACHE
20 MB (shared)
MAX TDP
77W
ARCHITECTURE
Ice Lake
PROCESS
10 nm
LAUNCH DATE
2022
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
3 7335U
D-2752TER
Core Specs
Cores
4
12
+200.0%
Threads
8
24
+200.0%
Base Clock (GHz)
3
1,800
+59900.0%
Boost Clock (GHz)
4.3
2.8
-34.9%
Frequency (GHz)
3
1,800
+59900.0%
Turbo Clock (GHz)
4.3
2.8
-34.9%
Multiplier
30
18
-40.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1.25 MB (per core)
L3 Cache
8 MB (shared)
20 MB (shared)
Power
TDP (W)
28
77
+175.0%
Architecture
Architecture
Zen 3+
Ice Lake
Codename
Rembrandt-R
Ice Lake-D
Generation
Ryzen 3
(Zen 3+ (Rembrandt))
Xeon D
(Ice Lake-D)
Process Size
6 nm
10 nm
Die Size
208 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
76.8 GB/s
85.3 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP7
Intel BGA 2579
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 32 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon 660M
—
Other
Market
Mobile
Server/Workstation
Production Status
Active
Active
Launch Price
—
$1061
Part Number
100-000000537(FP7)100-000000549(FP7r2)
SRLCNSRM27
Package
FP7, FP7r2
FC-BGA16B
Tj Max
95°C
—