CPU Comparison
AMD
AMD Ryzen 5 PRO 6650HS
CORE STATE
Rembrandt
CORE SPECS
6 Cores / 12 Threads
CLOCK SPEED
3.3 Base / 4.5 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
35W
ARCHITECTURE
Zen 3+
PROCESS
6 nm
LAUNCH DATE
2022
VS
INTEL
Xeon D-1732TE
CORE STATE
Ice Lake-D
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
1900 Base / 3 GHz Turbo
CACHE
15 MB (shared)
MAX TDP
52W
ARCHITECTURE
Ice Lake
PROCESS
10 nm
LAUNCH DATE
2022
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
5 PRO 6650HS
D-1732TE
Core Specs
Cores
6
8
+33.3%
Threads
12
16
+33.3%
Base Clock (GHz)
3.3
1,900
+57475.8%
Boost Clock (GHz)
4.5
3
-33.3%
Frequency (GHz)
3.3
1,900
+57475.8%
Turbo Clock (GHz)
4.5
3
-33.3%
Multiplier
33
19
-42.4%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1.25 MB (per core)
L3 Cache
16 MB (shared)
15 MB (shared)
Power
TDP (W)
35
52
+48.6%
Architecture
Architecture
Zen 3+
Ice Lake
Codename
Rembrandt
Ice Lake-D
Generation
Ryzen 5
(Zen 3+ (Rembrandt))
Xeon D
(Ice Lake-D)
Process Size
6 nm
10 nm
Die Size
208 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
76.8 GB/s
64.0 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FP7
Intel BGA 2227
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon 660M
—
Other
Market
Mobile
Server/Workstation
Production Status
Active
Active
Launch Price
—
$730
Part Number
100-000000543100-000000565
SRLBW
Package
FP7, FP7r2
FC-BGA16B
Tj Max
95°C
—