CPU Comparison
INTEL
Intel Core i9-11900F
CORE STATE
Rocket Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2.5 Base / 5.2 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
65W
ARCHITECTURE
Rocket Lake
PROCESS
14 nm
LAUNCH DATE
2021
VS
INTEL
Xeon 654
CORE STATE
Granite Rapids
CORE SPECS
18 Cores / 36 Threads
CLOCK SPEED
3.1 Base / 4.8 GHz Turbo
CACHE
72 MB (shared)
MAX TDP
200W
ARCHITECTURE
Granite Rapids
PROCESS
5 nm
LAUNCH DATE
2026
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
i9-11900F
654
Core Specs
Cores
8
18
+125.0%
Threads
16
36
+125.0%
Base Clock (GHz)
2.5
3.1
+24.0%
Boost Clock (GHz)
5.2
4.8
-7.7%
Frequency (GHz)
2.5
3.1
+24.0%
Turbo Clock (GHz)
5.2
4.8
-7.7%
Multiplier
25
31
+24.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
80 KB (per core)
112 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
16 MB (shared)
72 MB (shared)
Power
TDP (W)
65
200
+207.7%
Architecture
Architecture
Rocket Lake
Granite Rapids
Codename
Rocket Lake
Granite Rapids
Generation
Core i9
(Rocket Lake-S)
Xeon 600
(Granite Rapids-WS)
Process Size
14 nm
5 nm
Die Size
276 mm²
2x 598 mm²
Foundry
Intel
Intel
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Eight-channel
Memory Bandwidth
51.2 GB/s
409.6 GB/s
ECC Memory
No
Yes
Platform
Socket
Intel Socket 1200
Intel Socket 4710
Chipsets
H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490
W890
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 128 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
10 nm
Interconnect
CXL
—
Gen 2.0 (Shared with PCI-E)
Other
Market
Desktop
Server/Workstation
Production Status
End-of-life
Active
Launch Price
$422
$1199
Part Number
SRKNK
SA2DP
Package
FC-LGA14A
FC-LGA18N
Tj Max
100°C
96°C
Bundled Cooler
—
None