CPU Comparison
AMD
AMD Ryzen 7 5700
CORE STATE
Cezanne
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.7 Base / 4.6 GHz Turbo
CACHE
16 MB
MAX TDP
65W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2022
VS
INTEL
Xeon 654
CORE STATE
Granite Rapids
CORE SPECS
18 Cores / 36 Threads
CLOCK SPEED
3.1 Base / 4.8 GHz Turbo
CACHE
72 MB (shared)
MAX TDP
200W
ARCHITECTURE
Granite Rapids
PROCESS
5 nm
LAUNCH DATE
2026
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
7 5700
654
Core Specs
Cores
8
18
+125.0%
Threads
16
36
+125.0%
Base Clock (GHz)
3.7
3.1
-16.2%
Boost Clock (GHz)
4.6
4.8
+4.3%
Frequency (GHz)
3.7
3.1
-16.2%
Turbo Clock (GHz)
4.6
4.8
+4.3%
Multiplier
37
31
-16.2%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
112 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
16 MB
72 MB (shared)
Power
TDP (W)
65
200
+207.7%
PPT
61-88 W
—
Configurable TDP
45-65 W
—
Architecture
Architecture
Zen 3
Granite Rapids
Codename
Cezanne
Granite Rapids
Generation
Ryzen 7
(Zen 3 (Cezanne))
Xeon 600
(Granite Rapids-WS)
Process Size
7 nm
5 nm
Transistors
10,700 million
—
Die Size
180 mm²
2x 598 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Eight-channel
Memory Bandwidth
51.2 GB/s
409.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM4
Intel Socket 4710
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
W890
PCIe
Gen 3, 20 Lanes(CPU only)
Gen 5, 128 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
10 nm
Interconnect
CXL
—
Gen 2.0 (Shared with PCI-E)
Other
Market
Desktop
Server/Workstation
Production Status
Active
Active
Launch Price
$179
$1199
Part Number
100-000000743
SA2DP
Package
µOPGA-1331
FC-LGA18N
Tj Max
—
96°C
Bundled Cooler
Wraith Stealth
None