CPU Comparison

Intel
INTEL

Intel Xeon 636

CORE STATE Granite Rapids
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.5 Base / 4.7 GHz Turbo
CACHE 48 MB (shared)
MAX TDP 170W
ARCHITECTURE Granite Rapids
nm
PROCESS 5 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Xeon Phi 7210

CORE STATE Knights Landing
CORE SPECS 64 Cores / 256 Threads
CLOCK SPEED 1300 Base / 1500 GHz Turbo
CACHE
MAX TDP 215W
ARCHITECTURE Knights Landing
nm
PROCESS 14 nm
LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,805
625
cinebench_cinebench_r15_singlecore
537
88
cinebench_cinebench_r20_multicore
15,857
2,608
cinebench_cinebench_r20_singlecore
2,238
367
cinebench_cinebench_r23_multicore
37,757
6,210
cinebench_cinebench_r23_singlecore
5,330
876
passmark_data_compression
550,395
332,960
passmark_data_encryption
27,193
3,455
passmark_extended_instructions
43,282
18,359
passmark_find_prime_numbers
255
10
passmark_floating_point_math
107,826
29,356
passmark_integer_math
138,281
84,874
passmark_multithread
44,421
7,306
passmark_physics
3,645
198
passmark_random_string_sorting
54,420
8,956
passmark_single_thread
3,937
460
passmark_singlethread
3,937
460

DETAILED SPECIFICATIONS

SPECIFICATION
636
Phi 7210
Core Specs
Cores
12
64 +433.3%
Threads
24
256 +966.7%
Base Clock (GHz)
3.5
1,300 +37042.9%
Boost Clock (GHz)
4.7
1,500 +31814.9%
Frequency (GHz)
3.5
1,300 +37042.9%
Turbo Clock (GHz)
4.7
1,500 +31814.9%
Multiplier
35
13 -62.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
112 KB (per core)
32 KB (per core)
L2 Cache
2 MB (per core)
512 KB (per core)
L3 Cache
48 MB (shared)
Power
TDP (W)
170
215 +26.5%
Architecture
Architecture
Granite Rapids
Knights Landing
Codename
Granite Rapids
Knights Landing
Generation
Xeon 600 (Granite Rapids-WS)
Xeon Phi (Knights Landing)
Process Size
5 nm
14 nm
Transistors
8,000 million
Die Size
598 mm²
Foundry
Intel
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Quad-channel
Memory Bandwidth
204.8 GB/s
ECC Memory
Yes
Yes
Platform
Socket
Intel Socket 4710
Intel Socket 3647
Chipsets
W890
PCIe
Gen 5, 80 Lanes(CPU only)
AMD Multi-Die
IO Process Size
10 nm
Interconnect
CXL
Gen 2.0 (Shared with PCI-E)
Other
Market
Server/Workstation
Server/Workstation
Production Status
Active
Launch Price
$639
Part Number
SA2DM
SR2MESR2X4
Package
FC-LGA18N
FC-LGA3647
Tj Max
101°C
Bundled Cooler
None
View Xeon 636 Details View Xeon Phi 7210 Details