CPU Comparison

AMD
AMD

AMD Ryzen 7 8840HX

CORE STATE Dragon Range
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2.9 Base / 5.1 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Xeon 6325P

CORE STATE Raptor Lake-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.5 Base / 5.2 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 55W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
N/A
1,374
cinebench_cinebench_r15_singlecore
N/A
193
cinebench_cinebench_r20_multicore
N/A
5,727
cinebench_cinebench_r20_singlecore
N/A
808
cinebench_cinebench_r23_multicore
N/A
13,638
cinebench_cinebench_r23_singlecore
N/A
1,925
passmark_data_compression
N/A
172,602
passmark_data_encryption
N/A
9,201
passmark_extended_instructions
N/A
11,167
passmark_find_prime_numbers
N/A
65
passmark_floating_point_math
N/A
37,598
passmark_integer_math
N/A
49,670
passmark_multithread
N/A
16,045
passmark_physics
N/A
1,028
passmark_random_string_sorting
N/A
19,534
passmark_single_thread
N/A
4,283
passmark_singlethread
N/A
4,283

DETAILED SPECIFICATIONS

SPECIFICATION
7 8840HX
6325P
Core Specs
Cores
12
4 -66.7%
Threads
24
8 -66.7%
Base Clock (GHz)
2.9
3.5 +20.7%
Boost Clock (GHz)
5.1
5.2 +2.0%
Frequency (GHz)
2.9
3.5 +20.7%
Turbo Clock (GHz)
5.1
5.2 +2.0%
Multiplier
29
35 +20.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
64 MB (shared)
12 MB (shared)
Power
TDP (W)
55
55 0.0%
Configurable TDP
45-75 W
โ€”
Architecture
Architecture
Zen 4
Raptor Lake
Codename
Dragon Range
Raptor Lake-R
Generation
Ryzen 7 (Zen 4 (Dragon Range))
Xeon 6 (Raptor Lake Refresh)
Process Size
5 nm
10 nm
Transistors
13,140 million
โ€”
Die Size
2x 71 mmยฒ
163 mmยฒ
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
โ€”
ECC Memory
No
Yes
DDR4 Speed
โ€”
3200 MT/s
DDR5 Speed
โ€”
4800 MT/s
Platform
Socket
AMD Socket FL1
Intel Socket 1700
Chipsets
โ€”
C262, C266
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
โ€”
Graphics
Integrated Graphics
Radeon 610M
โ€”
Other
Market
Mobile
Server/Workstation
Production Status
Active
Active
Launch Price
โ€”
$281
Part Number
100-000001850
SRPLX
Package
ยตFC-BGAFL1
FC-LGA16A
Tj Max
100ยฐC
100ยฐC
Bundled Cooler
โ€”
Laminar RM1
View Ryzen 7 8840HX Details View Xeon 6325P Details