Intel Processor 300 vs Qualcomm Snapdragon X1E-84-100 Comparison

Head-to-Head Benchmarks

The recorded data for the Intel Processor 300 and the Qualcomm Snapdragon X1E-84-100 contains no head-to-head benchmark entries. The benchmark arrays for both processors are empty, and the wins counters for each item are set to zero. This means the database currently holds no direct performance comparisons between these two specific parts. What can be analyzed is the architectural and specification profile of each processor as recorded, along with their relative standing in the broader database. Both processors share a percentile ranking of 50 against all CPUs, which indicates that, based on the aggregated historical data, neither part is positioned as an outlier at either the top or the bottom of the performance distribution. The average benchmark score for each is also recorded as zero, a placeholder that reflects the absence of populated benchmark results rather than a genuine measurement of zero performance.

Because no direct scores exist, the most informative comparison derives from the structural differences in their core configurations and memory pathways. The Intel Processor 300 operates with 2 cores and 4 threads, while the Qualcomm Snapdragon X1E-84-100 operates with 12 cores and 12 threads. The thread count difference is notable: the Intel part supports two threads per core, whereas the Qualcomm part has a one-to-one core-to-thread ratio. In workloads that scale with thread count, the Qualcomm part has a clear numerical advantage, offering three times the physical cores and three times the logical threads. In workloads that favor higher per-core frequency, the Intel part holds a slight base clock advantage at 3.90 GHz compared to 3.80 GHz for the Qualcomm part. However, the Qualcomm part has a boost clock of 4.20 GHz, a feature entirely absent from the Intel processor's recorded data, which lists no boost clock value.

The thermal design power values differ substantially, with the Intel part rated at 46 watts and the Qualcomm part rated at 35 watts. This indicates that the Qualcomm processor is designed to operate within a lower thermal envelope despite having six times the core count. The process node difference is also significant: Intel uses a 10 nm process, while Qualcomm uses a 4 nm process fabricated by TSMC. The smaller process node likely contributes to the Qualcomm part's ability to pack more cores into a lower TDP. The cache hierarchy further separates the two. The Intel processor has an L1 cache of 80 KB per core, an L2 cache of 1.25 MB per core, and a shared L3 cache of 6 MB. The Qualcomm processor has an L1 cache of 288 KB per core, an L2 cache of 12 MB per module, and a shared L3 cache of 6 MB. The per-core L1 advantage for Qualcomm is substantial, and the L2 cache organization differs completely, with Intel using per-core L2 and Qualcomm using per-module L2. Total L3 cache is identical at 6 MB shared, but the L1 and L2 allocations suggest the Qualcomm part is designed to feed a much wider set of execution units.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X1E-84-100 has 12 cores, while the Intel Processor 300 has 2 cores. The Qualcomm part also has 12 threads, while the Intel part has 4 threads.

Q: What are the base clock speeds of each processor?

A: The Intel Processor 300 has a base clock of 3.90 GHz. The Qualcomm Snapdragon X1E-84-100 has a base clock of 3.80 GHz and a boost clock of 4.20 GHz. The Intel processor has no recorded boost clock.

Q: What is the process node for each processor?

A: The Intel Processor 300 uses a 10 nm process from Intel. The Qualcomm Snapdragon X1E-84-100 uses a 4 nm process from TSMC.

Q: How much L3 cache does each processor have?

A: Both processors have 6 MB of shared L3 cache. The L1 and L2 caches differ: Intel has 80 KB L1 per core and 1.25 MB L2 per core, while Qualcomm has 288 KB L1 per core and 12 MB L2 per module.

Q: What memory types do the two processors support?

A: The Intel Processor 300 supports DDR4 and DDR5 memory in a dual-channel configuration. The Qualcomm Snapdragon X1E-84-100 supports LPDDR5X memory in a dual-channel configuration with a recorded memory bandwidth of 135.2 GB/s. The Intel part has no memory bandwidth value recorded.

Q: What are the market segments for these processors?

A: The Intel Processor 300 is classified as a Desktop segment processor and uses Intel Socket 1700. The Qualcomm Snapdragon X1E-84-100 is classified as a Mobile segment processor and uses Qualcomm BGA 2073.

Where Each One Wins

The Intel Processor 300 wins in scenarios that favor desktop platforms with conventional memory support. It uses Intel Socket 1700 and supports both DDR4 and DDR5 memory, which provides flexibility for system builders working within the desktop ecosystem. The integrated graphics are UHD Graphics 710, and the processor has a base clock of 3.90 GHz, which is higher than the base clock of the Qualcomm part. The Intel part also has a smaller die size at 163 mm², which is recorded in the database, and a launch MSRP of $82. The PCIe implementation differs as well, with the Intel part using Gen 5 with 16 lanes (CPU only), which is a generation ahead of the Qualcomm part's Gen 4 with 12 lanes (CPU only). For workloads that depend on high per-core base frequency, desktop memory compatibility, or PCIe Gen 5 connectivity, the Intel Processor 300 presents the stronger profile.

The Qualcomm Snapdragon X1E-84-100 wins in scenarios that emphasize core count, mobile integration, and power efficiency. With 12 cores and 12 threads, it offers six times the core count of the Intel part. The boost clock of 4.20 GHz gives it a higher maximum frequency than the Intel part's 3.90 GHz base clock. The lower TDP of 35 watts, combined with the 4 nm TSMC process, positions it for mobile platforms where thermal and power constraints are tighter. The LPDDR5X memory support and recorded memory bandwidth of 135.2 GB/s indicate a design aimed at high-bandwidth memory access in a compact form factor. The integrated graphics are Adreno X1-85, which is a different integrated solution from the Intel UHD Graphics 710. The cache configuration, with 288 KB L1 per core and 12 MB L2 per module, suggests a design intended to keep a large number of cores fed with data. For mobile workloads, multi-threaded applications, and tasks that benefit from a high boost clock, the Qualcomm part has the advantage.

Specification Differences

The two processors differ across nearly every major specification field. The Intel Processor 300 has 2 cores and 4 threads, while the Qualcomm Snapdragon X1E-84-100 has 12 cores and 12 threads. Base clocks are 3.90 GHz for Intel and 3.80 GHz for Qualcomm, with a boost clock of 4.20 GHz recorded only for Qualcomm. TDP is 46 watts for Intel and 35 watts for Qualcomm. The socket types are entirely different: Intel Socket 1700 for the Intel part and Qualcomm BGA 2073 for the Qualcomm part. The process node is 10 nm for Intel and 4 nm for Qualcomm, with the foundry listed as Intel for the former and TSMC for the latter. Die size is 163 mm² for Intel, with no value recorded for Qualcomm. Cache configurations differ in L1 and L2: Intel has 80 KB L1 per core and 1.25 MB L2 per core, while Qualcomm has 288 KB L1 per core and 12 MB L2 per module. Both share 6 MB of L3 cache. Memory support differs, with Intel supporting DDR4 and DDR5 and Qualcomm supporting LPDDR5X. Memory bandwidth is 135.2 GB/s for Qualcomm, with no value for Intel. PCIe differs by generation and lane count: Gen 5 with 16 lanes for Intel and Gen 4 with 12 lanes for Qualcomm. Integrated graphics are UHD Graphics 710 for Intel and Adreno X1-85 for Qualcomm. Market segments are Desktop for Intel and Mobile for Qualcomm. Release dates differ, with Intel released on 2024-01-07 and Qualcomm on 2024-04-23. The launch MSRP is $82 for Intel, with no recorded MSRP for Qualcomm. The Intel part has a part number of SRN3J, while the Qualcomm part has a part number of X1E84100.

Architecture Differences

The architecture records show fundamentally different design approaches. The Intel Processor 300 uses the Raptor Lake architecture with the codename Raptor Lake-S, placing it in the Intel Processor (Raptor Lake) generation. The Qualcomm Snapdragon X1E-84-100 has no architecture field recorded, but its codename is Oryon and its generation is listed as Snapdragon X (Elite). The process node difference is substantial: Intel uses 10 nm, while Qualcomm uses 4 nm from TSMC. This process disparity likely underpins the core count difference, as the smaller node allows for a 12-core design within a 35-watt TDP, compared to a 2-core design at 46 watts. The cache hierarchy reflects the scaling difference. Intel's per-core L1 of 80 KB and per-core L2 of 1.25 MB suit a low-core-count desktop part. Qualcomm's per-core L1 of 288 KB and per-module L2 of 12 MB suit a high-core-count mobile part where modules group multiple cores and share cache. Both have 6 MB of shared L3, but the surrounding cache architecture is otherwise dissimilar. The PCIe implementations also differ by generation, with Intel providing Gen 5 and 16 lanes and Qualcomm providing Gen 4 and 12 lanes. The memory controllers are matched in channel count, both dual-channel, but the memory types diverge: Intel supports DDR4 and DDR5, while Qualcomm supports LPDDR5X. The integrated graphics differ as well, with Intel using UHD Graphics 710 and Qualcomm using Adreno X1-85. The production status for both is Active, and neither processor has an unlocked multiplier. ECC memory support is false for both, so that field does not differentiate them. The Qualcomm part has a recorded memory bandwidth of 135.2 GB/s, while the Intel part has none recorded, which further emphasizes the mobile design target for Qualcomm. The Intel part has a recorded die size of 163 mm², while the Qualcomm die size is not recorded. Transistor counts are not recorded for either processor. The release timing shows a roughly three-and-a-half-month gap, with Intel launching in early January 2024 and Qualcomm launching in late April 2024.