CPU Comparison
AMD
AMD EPYC 7473X
CORE STATE
Milan-X
CORE SPECS
24 Cores / 48 Threads
CLOCK SPEED
2.8 Base / 3.7 GHz Turbo
CACHE
768 MB (shared)
MAX TDP
240W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2022
VS
INTEL
Core Ultra 9 275HX
CORE STATE
Arrow Lake-HX
CORE SPECS
24 Cores / 24 Threads
CLOCK SPEED
2.7 Base / 5.4 GHz Turbo
CACHE
36 MB (shared)
MAX TDP
55W
ARCHITECTURE
Arrow Lake
PROCESS
3 nm
LAUNCH DATE
2025
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 7473X
Ultra 9 275HX
Core Specs
Cores
24
24
0.0%
Threads
48
24
-50.0%
Base Clock (GHz)
2.8
2.7
-3.6%
Boost Clock (GHz)
3.7
5.4
+45.9%
Frequency (GHz)
2.8
2.7
-3.6%
Turbo Clock (GHz)
3.7
5.4
+45.9%
Multiplier
28
27
-3.6%
SMP CPUs
2
1
-50.0%
Cache
L1 Cache
64 KB (per core)
192 KB (per core)
L2 Cache
512 KB (per core)
3 MB (per core)
L3 Cache
768 MB (shared)
36 MB (shared)
Power
TDP (W)
240
55
-77.1%
PL1
—
55 W
PL2
—
160 W
Configurable TDP
225W-280W
—
Architecture
Architecture
Zen 3
Arrow Lake
Codename
Milan-X
Arrow Lake-HX
Generation
EPYC
(Zen 3 (Milan))
Ultra 9
(Arrow Lake-HX)
Process Size
7 nm
3 nm
Transistors
33,200 million
17,800 million
Die Size
8x 81 mm²
243 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
102.4 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP3
Intel BGA 2114
Chipsets
—
WM880, HM870
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 5, 20 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
P-Cores: 8
E-Cores: 16
E-Core Frequency
—
2.1 GHz
up to 4.6 GHz
AMD Multi-Die
CCDs
8
—
Cores per CCD
3
—
IO Process Size
12 nm
—
AI/NPU
NPU
—
Yes /
13 TOPS
Graphics
Integrated Graphics
—
Arc Xe-LPG Graphics 64EU
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$3900
—
Part Number
100-000000507WOF100-000000507
SRVFK
Package
FCLGA-4094
FC-BGA
Tj Max
—
105°C