CPU Comparison

AMD
AMD

AMD Ryzen 7 PRO 3700

CORE STATE Matisse
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 4.4 GHz Turbo
CACHE 32 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Core i9-8950HK

CORE STATE Coffee Lake-H
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 2.9 Base / 4.7 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 95W
ARCHITECTURE Coffee Lake
nm
PROCESS 14 nm
LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,955
888
cinebench_cinebench_r15_singlecore
275
125
cinebench_cinebench_r20_multicore
8,146
3,703
cinebench_cinebench_r20_singlecore
1,149
522
cinebench_cinebench_r23_multicore
19,397
8,817
cinebench_cinebench_r23_singlecore
2,738
1,244
geekbench_multicore
N/A
5,254
geekbench_singlecore
N/A
1,437

DETAILED SPECIFICATIONS

SPECIFICATION
7 PRO 3700
i9-8950HK
Core Specs
Cores
8
6 -25.0%
Threads
16
12 -25.0%
Base Clock (GHz)
3.6
2.9 -19.4%
Boost Clock (GHz)
4.4
4.7 +6.8%
Frequency (GHz)
3.6
2.9 -19.4%
Turbo Clock (GHz)
4.4
4.7 +6.8%
Multiplier
36
37 +2.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
32 MB
12 MB (shared)
Power
TDP (W)
65
95 +46.2%
PPT
88 W
โ€”
Architecture
Architecture
Zen 2
Coffee Lake
Codename
Matisse
Coffee Lake-H
Generation
Ryzen 7 (Zen 2 (Matisse))
Core i9 (Coffee Lake-H)
Process Size
7 nm
14 nm
Transistors
3,800 million
โ€”
Die Size
74 mmยฒ
149 mmยฒ
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
โ€”
Memory Bandwidth
51.2 GB/s
โ€”
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
Intel BGA 1440
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
โ€”
PCIe
Gen 4, 24 Lanes(CPU only)
โ€”
AMD Multi-Die
IO Process Size
12 nm
โ€”
Graphics
Integrated Graphics
โ€”
UHD 630
Other
Market
Desktop
Mobile
Production Status
Active
End-of-life
Part Number
100-000000073
SRCKN
Package
ยตOPGA-1331
FC-BGA1440
Tj Max
95ยฐC
โ€”
View Ryzen 7 PRO 3700 Details View Core i9-8950HK Details