CPU Comparison

A

AMD

AMD

AMD Ryzen 9 5900

CORE STATE Vermeer

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3 Base / 4.7 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

i

Intel

INTEL

Core i7-11700B

CORE STATE Tiger Lake-H

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.2 Base / 4.8 GHz Turbo

CACHE 24 MB (shared)

MAX TDP 65W

ARCHITECTURE Tiger Lake

nm

PROCESS 10 nm

LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,906

1,868

cinebench_cinebench_r15_singlecore

410

263

cinebench_cinebench_r20_multicore

12,110

7,785

cinebench_cinebench_r20_singlecore

1,709

1,099

cinebench_cinebench_r23_multicore

28,834

18,538

cinebench_cinebench_r23_singlecore

4,070

2,617

passmark_data_compression

411,453

N/A

passmark_data_encryption

26,247

N/A

passmark_extended_instructions

26,859

N/A

passmark_find_prime_numbers

213

N/A

passmark_floating_point_math

69,124

N/A

passmark_integer_math

128,641

N/A

passmark_multithread

33,969

N/A

passmark_physics

1,697

N/A

passmark_random_string_sorting

43,386

N/A

passmark_single_thread

3,439

N/A

passmark_singlethread

3,439

N/A

DETAILED SPECIFICATIONS

SPECIFICATION

9 5900

i7-11700B

Core Specs

Cores

12

8 -33.3%

Threads

24

16 -33.3%

Base Clock (GHz)

3

3.2 +6.7%

Boost Clock (GHz)

4.7

4.8 +2.1%

Frequency (GHz)

3

3.2 +6.7%

Turbo Clock (GHz)

4.7

4.8 +2.1%

Multiplier

30

32 +6.7%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1.25 MB (per core)

L3 Cache

64 MB

24 MB (shared)

Power

TDP (W)

65

65 0.0%

PPT

88 W

—

Architecture

Architecture

Zen 3

Tiger Lake

Codename

Vermeer

Tiger Lake-H

Generation

Ryzen 9 (Zen 3 (Vermeer))

Core i7 (Tiger Lake-H)

Process Size

7 nm

10 nm

Transistors

8,300 million

—

Die Size

2x 74 mm²

190 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

51.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket AM4

Intel BGA 1787

Chipsets

AMD 300 Series*, AMD 400 Series, AMD 500 Series

Z590, QM580, HM570, WM590

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 20 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

UHD Graphics (Xe-LP)

Other

Market

Desktop

Mobile

Production Status

Active

End-of-life

Part Number

100-000000062

SRKU5

Package

µOPGA-1331

FC-BGA16F

Tj Max

—

100°C

Bundled Cooler

None

Yes

View Ryzen 9 5900 Details View Core i7-11700B Details