CPU Comparison

A

AMD

AMD

AMD Ryzen 7 PRO 3700

CORE STATE Matisse

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 4.4 GHz Turbo

CACHE 32 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core i7-1065G7

CORE STATE Ice Lake-U

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 1300 Base / 3.9 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 15W

ARCHITECTURE Ice Lake

nm

PROCESS 10 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,955

700

cinebench_cinebench_r15_singlecore

275

98

cinebench_cinebench_r20_multicore

8,146

2,920

cinebench_cinebench_r20_singlecore

1,149

412

cinebench_cinebench_r23_multicore

19,397

6,954

cinebench_cinebench_r23_singlecore

2,738

981

3dmark_16_threads

N/A

2,323

3dmark_2_threads

N/A

1,188

3dmark_4_threads

N/A

1,735

3dmark_8_threads

N/A

2,293

3dmark_max_threads

N/A

2,410

3dmark_single_thread

N/A

683

passmark_data_compression

N/A

88,300

passmark_data_encryption

N/A

4,552

passmark_extended_instructions

N/A

5,998

passmark_find_prime_numbers

N/A

29

passmark_floating_point_math

N/A

16,603

passmark_integer_math

N/A

28,660

passmark_multithread

N/A

8,185

passmark_physics

N/A

589

passmark_random_string_sorting

N/A

10,688

passmark_single_thread

N/A

2,295

passmark_singlethread

N/A

2,295

DETAILED SPECIFICATIONS

SPECIFICATION

7 PRO 3700

i7-1065G7

Core Specs

Cores

8

4 -50.0%

Threads

16

8 -50.0%

Base Clock (GHz)

3.6

1,300 +36011.1%

Boost Clock (GHz)

4.4

3.9 -11.4%

Frequency (GHz)

3.6

1,300 +36011.1%

Turbo Clock (GHz)

4.4

3.9 -11.4%

Multiplier

36

13 -63.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

32 MB

8 MB (shared)

Power

TDP (W)

65

15 -76.9%

PPT

88 W

—

Architecture

Architecture

Zen 2

Ice Lake

Codename

Matisse

Ice Lake-U

Generation

Ryzen 7 (Zen 2 (Matisse))

Core i7 (Sunny Cove-U)

Process Size

7 nm

10 nm

Transistors

3,800 million

—

Die Size

74 mm²

123 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

51.2 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 1526

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 3

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

Iris Plus

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000073

SRG0N

Package

µOPGA-1331

FC-BGA16F

Tj Max

95°C

—

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