CPU Comparison
AMD
AMD Ryzen 3 110
CORE STATE
Rembrandt-R
CORE SPECS
4 Cores / 8 Threads
CLOCK SPEED
3 Base / 4.3 GHz Turbo
CACHE
8 MB (shared)
MAX TDP
28W
ARCHITECTURE
Zen 3+
PROCESS
6 nm
LAUNCH DATE
2025
VS
INTEL
Core i3-12100TE
CORE STATE
Alder Lake-S
CORE SPECS
4 Cores / 8 Threads
CLOCK SPEED
2.1 Base / 4 GHz Turbo
CACHE
12 MB (shared)
MAX TDP
35W
ARCHITECTURE
Alder Lake
PROCESS
10 nm
LAUNCH DATE
—
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
3 110
i3-12100TE
Core Specs
Cores
4
4
0.0%
Threads
8
8
0.0%
Base Clock (GHz)
3
2.1
-30.0%
Boost Clock (GHz)
4.3
4
-7.0%
Frequency (GHz)
3
2.1
-30.0%
Turbo Clock (GHz)
4.3
4
-7.0%
Multiplier
30
21
-30.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1.25 MB (per core)
L3 Cache
8 MB (shared)
12 MB (shared)
Power
TDP (W)
28
35
+25.0%
Configurable TDP
15-30 W
—
Architecture
Architecture
Zen 3+
Alder Lake
Codename
Rembrandt-R
Alder Lake-S
Generation
Ryzen 3
(Zen 3+ (Rembrandt))
Core i3
(Alder Lake-S)
Process Size
6 nm
10 nm
Die Size
210 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
—
ECC Memory
Yes
No
DDR4 Speed
—
3200 MT/s
DDR5 Speed
—
4800 MT/s
Platform
Socket
AMD Socket FP7
Intel Socket 1700
Chipsets
—
H610, H610E
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 20 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon 660M
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
—
$125
Part Number
100-000000549(FP7r2)
—
Package
FP7r2
FC-LGA16A
Tj Max
95°C
100°C