Intel Core 9 273PTE vs Qualcomm Snapdragon X2E-96-100 Comparison

Intel
INTEL

Intel Core 9 273PTE

CORE STATE Bartlett Lake
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 1.4 Base / 5.5 GHz Turbo
CACHE 36 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X2E-96-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 5 GHz Turbo
CACHE 9 MB (shared)
MAX TDP
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,060
N/A
cinebench_cinebench_r15_singlecore
290
N/A
cinebench_cinebench_r20_multicore
8,586
N/A
cinebench_cinebench_r20_singlecore
1,212
N/A
cinebench_cinebench_r23_multicore
20,445
N/A
cinebench_cinebench_r23_singlecore
2,886
N/A
passmark_data_compression
258,704
N/A
passmark_data_encryption
14,253
N/A
passmark_extended_instructions
15,952
N/A
passmark_find_prime_numbers
142
N/A
passmark_floating_point_math
60,673
N/A
passmark_integer_math
82,411
N/A
passmark_multithread
24,054
N/A
passmark_physics
1,917
N/A
passmark_random_string_sorting
28,973
N/A
passmark_single_thread
3,433
N/A
passmark_singlethread
3,433
N/A

Analysis: Intel Core 9 273PTE vs Qualcomm Snapdragon X2E-96-100

The Verdict

The data shows two processors with completely different design philosophies and no direct head-to-head benchmark results recorded. The Intel Core 9 273PTE is a desktop part with a full benchmark suite, a percentile ranking of 82, and an average benchmark score of 31,143. The Qualcomm Snapdragon X2E-96-100 is a mobile processor with no recorded benchmark scores, a percentile ranking of 50, and an average benchmark score of 0. For any workload where measured performance matters, the Intel part is the only one with verifiable data. The Qualcomm part is positioned for mobile devices, while the Intel part targets desktop systems. The Intel Core 9 273PTE is the choice for users who need proven multi-threaded performance and established software compatibility. The Snapdragon X2E-96-100 is the choice for users prioritizing a 3 nm process node, higher base clock, larger L1 cache per core, and triple-channel memory support in a mobile form factor.

Architecture Differences

The Intel Core 9 273PTE uses the Bartlett Lake codename, built on a 10 nm process node at Intel's foundry. It features 12 cores and 24 threads, indicating hyper-threading support. The base clock is 1.40 GHz with a boost clock of 5.50 GHz. The thermal design power is 45 watts. The cache hierarchy includes 80 KB of L1 per core, 2 MB of L2 per core, and 36 MB of shared L3. Memory support covers DDR4 and DDR5 with a dual-channel bus and a memory bandwidth of 89.6 GB/s. ECC memory is supported. PCIe connectivity is Gen 5 with 16 CPU-only lanes. The integrated graphics are UHD Graphics 730. It uses Intel Socket 1700 and was released on 2026-03-08. The launch MSRP is $549.

The Qualcomm Snapdragon X2E-96-100 uses the Glymur codename, built on a 3 nm process node at TSMC. It features 18 cores and 18 threads, meaning no hyper-threading. The base clock is 4.45 GHz with a boost clock of 5.00 GHz. The thermal design power is not recorded. The die size is 220 mm². The cache hierarchy includes 288 KB of L1 per core, 16 MB of L2 per module, and 9 MB of shared L3. Memory support is LPDDR5X with a triple-channel bus and a memory bandwidth of 228.6 GB/s. ECC memory is not supported. PCIe connectivity is Gen 5 with 12 CPU-only lanes. The integrated graphics are Adreno X2-90. It uses Qualcomm BGA 2343 and was released on 2026-04-05.

The most significant architectural difference is the process node: Intel uses 10 nm, Qualcomm uses 3 nm. That gives the Snapdragon a transistor-density advantage on paper, but the Intel part compensates with a higher boost clock (5.50 GHz vs 5.00 GHz) and hyper-threading, which doubles thread count relative to core count. The memory bandwidth difference is stark: 228.6 GB/s for the Snapdragon versus 89.6 GB/s for Intel, due to triple-channel LPDDR5X versus dual-channel DDR4/DDR5. The Snapdragon has a much larger L1 cache per core (288 KB vs 80 KB) and larger L2 per module (16 MB vs 2 MB), but Intel has a larger shared L3 pool (36 MB vs 9 MB).

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-96-100 has 18 cores, while the Intel Core 9 273PTE has 12 cores.

Q: Which processor has a higher boost clock?

A: The Intel Core 9 273PTE has a boost clock of 5.50 GHz, which is higher than the Snapdragon X2E-96-100's boost clock of 5.00 GHz.

Q: What is the memory bandwidth difference?

A: The Snapdragon X2E-96-100 delivers 228.6 GB/s via triple-channel LPDDR5X, while the Intel Core 9 273PTE delivers 89.6 GB/s via dual-channel DDR4/DDR5.

Q: Do both processors support ECC memory?

A: No, the Intel Core 9 273PTE supports ECC memory, but the Qualcomm Snapdragon X2E-96-100 does not.

Q: What process nodes are used?

A: The Intel Core 9 273PTE uses a 10 nm process node from Intel, and the Qualcomm Snapdragon X2E-96-100 uses a 3 nm process node from TSMC.

Q: Which processor has recorded benchmark scores?

A: Only the Intel Core 9 273PTE has recorded benchmark scores in the database. The Snapdragon X2E-96-100 has no benchmark entries, an average benchmark score of 0, and no nearest rivals listed.

Specification Differences

The two processors differ across nearly every field. The Intel Core 9 273PTE has 12 cores and 24 threads; the Snapdragon X2E-96-100 has 18 cores and 18 threads. The Intel base clock is 1.40 GHz, the Snapdragon base clock is 4.45 GHz. The Intel boost clock is 5.50 GHz, the Snapdragon boost clock is 5.00 GHz. The Intel TDP is 45 watts, the Snapdragon TDP is not recorded. The Intel socket is Intel Socket 1700, the Snapdragon socket is Qualcomm BGA 2343. The Intel codename is Bartlett Lake, the Snapdragon codename is Glymur. The Intel process node is 10 nm, the Snapdragon process node is 3 nm. The Intel foundry is Intel, the Snapdragon foundry is TSMC. The Intel die size is not recorded, the Snapdragon die size is 220 mm².

The cache structures differ: Intel has 80 KB L1 per core, 2 MB L2 per core, and 36 MB shared L3. Qualcomm has 288 KB L1 per core, 16 MB L2 per module, and 9 MB shared L3. Memory support differs: Intel uses DDR4 and DDR5, Qualcomm uses LPDDR5X. Memory bus differs: Intel is dual-channel, Qualcomm is triple-channel. Memory bandwidth differs: Intel is 89.6 GB/s, Qualcomm is 228.6 GB/s. ECC memory support differs: Intel supports it, Qualcomm does not. PCIe lanes differ: Intel has Gen 5 with 16 lanes, Qualcomm has Gen 5 with 12 lanes. Integrated graphics differ: Intel has UHD Graphics 730, Qualcomm has Adreno X2-90. Market segment differs: Intel is Desktop, Qualcomm is Mobile. Release dates differ: Intel is 2026-03-08, Qualcomm is 2026-04-05. The Intel part has a launch MSRP of $549, the Qualcomm part has no launch MSRP recorded. The Intel part number is SA4QJ, the Qualcomm part number is X2E96100. Both have multiplier unlocked set to false.

Head-to-Head Benchmarks

No head-to-head benchmark results are recorded between these two processors. The database shows zero wins for either side in direct comparison. However, the Intel Core 9 273PTE has a full suite of individual benchmark scores, while the Snapdragon X2E-96-100 has none. The Intel part's Cinebench R23 multi-core score is 20,445, and its single-core score is 2,886. In Cinebench R20, the multi-core score is 8,586 and single-core is 1,212. In Cinebench R15, the multi-core score is 2,060 and single-core is 290. The Passmark suite shows a multi-thread score of 24,054, single-thread score of 3,433, integer math score of 82,411, floating point math score of 60,673, data compression score of 258,704, data encryption score of 14,253, extended instructions score of 15,952, find prime numbers score of 142, physics score of 1,917, and random string sorting score of 28,973.

The Intel part's average benchmark score is 31,143, which places it at the 82nd percentile among all CPUs. Its nearest rivals are the Intel Core i7-12700F with an average score of 31,081 and a delta of 0.2 percent, the AMD Ryzen 9 8945HS with an average score of 31,074 and a delta of 0.2 percent, the Intel Core i7-13700TE with an average score of 31,028 and a delta of 0.4 percent, and the Intel Core i7-12650HX with an average score of 31,290 and a delta of -0.5 percent. This means the Core 9 273PTE sits within 0.5 percent of its nearest rivals, effectively a statistical tie in average score. The Snapdragon has no benchmark data, no rivals, and a percentile of 50 with an average score of 0.

Where Each One Wins

The Intel Core 9 273PTE wins on measured performance, thread count, boost clock, L3 cache capacity, ECC support, PCIe lane count, and desktop market positioning. It has 24 threads versus 18, which benefits heavily threaded workloads like Cinebench multi-core where it scores 20,445. Its single-thread performance is also strong, with a Cinebench R23 single-core score of 2,886 and a Passmark single-thread score of 3,433. The 36 MB shared L3 cache is four times larger than the Snapdragon's 9 MB, which helps workloads with large working sets. ECC memory support makes it suitable for error-sensitive computing. The 16 PCIe Gen 5 lanes provide more expansion bandwidth than the Snapdragon's 12 lanes. The 45 watt TDP is a recorded power envelope, whereas the Snapdragon's TDP is absent from the database.

The Qualcomm Snapdragon X2E-96-100 wins on core count, base clock, process node, die size, L1 and L2 cache size, memory bandwidth, and mobile market positioning. It has 18 cores, which is 6 more than the Intel part. Its base clock of 4.45 GHz is more than triple the Intel base clock of 1.40 GHz, meaning it sustains higher frequency at idle or low load. The 3 nm process node from TSMC is a generation ahead of Intel's 10 nm node. The 220 mm² die size is recorded, while Intel's is not. Its 288 KB L1 per core is 3.6 times larger than Intel's 80 KB, and its 16 MB L2 per module is 8 times larger than Intel's 2 MB per core. Memory bandwidth of 228.6 GB/s is 2.55 times higher than Intel's 89.6 GB/s, which matters for memory-bound mobile workloads. The triple-channel LPDDR5X bus enables that bandwidth. The Adreno X2-90 integrated graphics may offer different media capabilities than Intel's UHD Graphics 730, though no benchmark data confirms this.

For users building a desktop system with established software compatibility, the Intel Core 9 273PTE is the only option with verifiable performance numbers. For users needing a mobile processor with a more advanced process node and higher memory bandwidth, the Snapdragon X2E-96-100 offers architectural advantages, but the absence of any benchmark scores means its real-world performance is unmeasured in this database. The data cannot confirm a winner in direct competition because no head-to-head results exist.

DETAILED SPECIFICATIONS

SPECIFICATION
9 273PTE
Snapdragon X2E-96-100
Core Specs
Cores
12
18 +50.0%
Threads
24
18 -25.0%
Base Clock (GHz)
1.4
4.45 +217.9%
Boost Clock (GHz)
5.5
5 -9.1%
Frequency (GHz)
1.4
4.45 +217.9%
Turbo Clock (GHz)
5.5
5 -9.1%
Multiplier
14
44.5 +217.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
16 MB (per module)
L3 Cache
36 MB (shared)
9 MB (shared)
Power
TDP (W)
45
PL1
45 W
PL2
219 W
Architecture
Codename
Bartlett Lake
Glymur
Generation
Core 9 (Bartlett Lake)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
89.6 GB/s
228.6 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
12 + 6
E-Core Frequency
3.6 GHz
P-Core Turbo
5.3 GHz
AI/NPU
NPU
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$549
Part Number
SA4QJ
X2E96100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
View Core 9 273PTE Details View Snapdragon X2E-96-100 Details