Intel Core 9 273PTE vs Qualcomm Snapdragon X1E-78-100 Comparison

Intel Core 9 273PTE and Qualcomm Snapdragon X1E-78-100 occupy different corners of the processor market, and the recorded data shows a clear divergence in performance, architecture, and intended use. The Intel part is a desktop processor with 12 cores and 24 threads, while the Qualcomm chip is a mobile processor with 12 cores and 12 threads. The benchmark database contains a full set of measurements for the Intel processor, while the Qualcomm processor has no recorded benchmark scores, which limits direct comparison but still allows for a thorough analysis based on the available specifications and the Intel part’s standing against its nearest rivals.

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark results between the Intel Core 9 273PTE and the Qualcomm Snapdragon X1E-78-100. The Qualcomm chip has an empty benchmark array, meaning no Cinebench, PassMark, or other test scores are recorded for it. As a result, the head-to-head comparison must rely on the Intel processor’s absolute scores and its percentile position relative to all CPUs.

The Intel Core 9 273PTE delivers a Cinebench R23 multi-core score of 20445 and a single-core score of 2886. In Cinebench R20, the multi-core score is 8586 and the single-core score is 1212. The older Cinebench R15 test shows a multi-core score of 2060 and a single-core score of 290. These numbers indicate strong multi-threaded performance for a desktop part, with the 24 threads providing substantial parallel workload capability.

In PassMark tests, the Intel processor shows a multi-thread score of 24054 and a single-thread score of 3433. The integer math score is 82411, floating point math is 60673, and extended instructions score is 15952. Data compression reaches 258704, data encryption is 14253, and random string sorting is 28973. The physics score is 1917 and find prime numbers is 142.

The Intel Core 9 273PTE holds an 82nd percentile ranking among all CPUs in the database. Its average benchmark score is 31143. The nearest rivals in the database are the Intel Core i7-12700F with an average score of 31081 and a delta of 0.2 percent, the AMD Ryzen 9 8945HS with an average score of 31074 and a delta of 0.2 percent, the Intel Core i7-13700TE with an average score of 31028 and a delta of 0.4 percent, and the Intel Core i7-12650HX with an average score of 31290 and a delta of -0.5 percent. This places the Core 9 273PTE essentially at parity with the Core i7-12700F and Ryzen 9 8945HS, slightly ahead of the Core i7-13700TE, and marginally behind the Core i7-12650HX.

For the Qualcomm Snapdragon X1E-78-100, the database records no benchmark scores and no average score, and its percentile ranking is 50. This means the Qualcomm chip sits at the median of all CPUs in the database by percentile, but without any actual test data, the performance cannot be quantified. The absence of measurements prevents any direct numeric comparison for Cinebench or PassMark tests.

Architecture Differences

The Intel Core 9 273PTE uses the Bartlett Lake codename and belongs to the Core 9 generation. It is built on a 10 nm process node at Intel’s own foundry. The processor has 12 cores and 24 threads, with a base clock of 1.40 GHz and a boost clock of 5.50 GHz. The cache hierarchy includes 80 KB of L1 per core, 2 MB of L2 per core, and 36 MB of shared L3 cache. The processor supports DDR4 and DDR5 memory in a dual-channel configuration, with a memory bandwidth of 89.6 GB/s. ECC memory is supported. The PCIe interface is Gen 5 with 16 lanes from the CPU. Integrated graphics are provided by UHD Graphics 730. The socket is Intel Socket 1700, and the market segment is desktop. The production status is active, and the release date is March 8, 2026. The launch MSRP is $549.

The Qualcomm Snapdragon X1E-78-100 uses the Oryon codename and belongs to the Snapdragon X (Elite) generation. It is built on a 4 nm process node at TSMC’s foundry. The processor has 12 cores and 12 threads, with a base clock of 3.40 GHz and no recorded boost clock. The cache hierarchy includes 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3 cache. The memory support is LPDDR5X only, in a dual-channel configuration, with a memory bandwidth of 135.2 GB/s. ECC memory is not supported. The PCIe interface is Gen 4 with 12 lanes from the CPU. Integrated graphics are provided by Adreno X1-85. The socket is Qualcomm BGA 2073, and the market segment is mobile. The production status is active, and the release date is April 23, 2024. No launch MSRP is recorded.

The process node difference is significant: 10 nm for Intel versus 4 nm for Qualcomm, with the latter using TSMC as the foundry. The Intel chip has a lower base clock at 1.40 GHz but a much higher boost clock at 5.50 GHz, while the Qualcomm chip has a higher base clock at 3.40 GHz but no boost clock listed. The thread count differs, with Intel offering 24 threads versus Qualcomm’s 12, indicating simultaneous multithreading on the Intel part. Cache sizes are structured differently, with Intel providing a larger L3 cache at 36 MB versus Qualcomm’s 6 MB, but Qualcomm has larger per-core L1 and per-module L2 allocations.

Memory bandwidth favors Qualcomm at 135.2 GB/s versus Intel’s 89.6 GB/s, although Intel supports both DDR4 and DDR5 while Qualcomm is limited to LPDDR5X. PCIe generation favors Intel with Gen 5 and 16 lanes versus Qualcomm’s Gen 4 and 12 lanes. ECC support is present on Intel but absent on Qualcomm.

FAQ

Q: Which processor has more threads?

A: The Intel Core 9 273PTE has 24 threads, while the Qualcomm Snapdragon X1E-78-100 has 12 threads. Both processors have 12 cores, but Intel enables simultaneous multithreading.

Q: What is the process node difference between the two chips?

A: The Intel Core 9 273PTE is built on a 10 nm process at Intel’s foundry, while the Qualcomm Snapdragon X1E-78-100 is built on a 4 nm process at TSMC.

Q: Does the Qualcomm Snapdragon X1E-78-100 support ECC memory?

A: No, ECC memory is not supported on the Qualcomm chip. The Intel Core 9 273PTE does support ECC memory.

Q: What memory types does each processor support?

A: The Intel Core 9 273PTE supports DDR4 and DDR5 in a dual-channel configuration. The Qualcomm Snapdragon X1E-78-100 supports LPDDR5X in a dual-channel configuration.

Q: Which processor has a higher recorded memory bandwidth?

A: The Qualcomm Snapdragon X1E-78-100 has a memory bandwidth of 135.2 GB/s, which is higher than the Intel Core 9 273PTE’s 89.6 GB/s.

Q: How does the Intel Core 9 273PTE compare to its nearest rivals in average benchmark score?

A: The Intel Core 9 273PTE has an average benchmark score of 31143. Its nearest rivals include the Intel Core i7-12700F at 31081 (0.2 percent delta), AMD Ryzen 9 8945HS at 31074 (0.2 percent delta), Intel Core i7-13700TE at 31028 (0.4 percent delta), and Intel Core i7-12650HX at 31290 (-0.5 percent delta).

Specification Differences

The two processors differ in several key specification fields.

Manufacturer: Intel for the Core 9 273PTE, while the Qualcomm Snapdragon X1E-78-100 lists “Unknown” as the manufacturer in the database.

Codename: Bartlett Lake for Intel, Oryon for Qualcomm.

Generation: Core 9 (Bartlett Lake) for Intel, Snapdragon X (Elite) for Qualcomm.

Process node: 10 nm for Intel, 4 nm for Qualcomm.

Foundry: Intel for the Core 9 273PTE, TSMC for the Qualcomm chip.

Threads: 24 for Intel, 12 for Qualcomm.

Base clock: 1.40 GHz for Intel, 3.40 GHz for Qualcomm.

Boost clock: 5.50 GHz for Intel, no recorded value for Qualcomm.

TDP: 45 for Intel, 35 for Qualcomm.

Socket: Intel Socket 1700 for Intel, Qualcomm BGA 2073 for Qualcomm.

Cache L1: 80 KB per core for Intel, 288 KB per core for Qualcomm.

Cache L2: 2 MB per core for Intel, 12 MB per module for Qualcomm.

Cache L3: 36 MB shared for Intel, 6 MB shared for Qualcomm.

Memory support: DDR4 and DDR5 for Intel, LPDDR5X for Qualcomm.

Memory bandwidth: 89.6 GB/s for Intel, 135.2 GB/s for Qualcomm.

ECC memory: true for Intel, false for Qualcomm.

PCIe: Gen 5 with 16 lanes for Intel, Gen 4 with 12 lanes for Qualcomm.

Integrated graphics: UHD Graphics 730 for Intel, Adreno X1-85 for Qualcomm.

Market segment: Desktop for Intel, Mobile for Qualcomm.

Release date: March 8, 2026 for Intel, April 23, 2024 for Qualcomm.

Launch MSRP: $549 for Intel, no recorded value for Qualcomm.

Where Each One Wins

The Intel Core 9 273PTE wins in multi-threaded workloads based on its 24 threads and the recorded benchmark scores. The Cinebench R23 multi-core score of 20445 and PassMark multi-thread score of 24054 indicate strong parallel processing capability. Tasks such as video encoding, 3D rendering, and software compilation benefit from the higher thread count. The Intel processor also has a higher boost clock of 5.50 GHz, which supports single-thread performance, reflected in its Cinebench R23 single-core score of 2886 and PassMark single-thread score of 3433. The desktop market segment, PCIe Gen 5 with 16 lanes, and support for DDR4 and DDR5 memory make it suitable for systems requiring expansion and memory flexibility. ECC memory support adds reliability for error-sensitive workloads.

The Qualcomm Snapdragon X1E-78-100 wins in power efficiency based on its lower TDP of 35 versus Intel’s 45, and its 4 nm process node at TSMC. The mobile market segment and BGA socket indicate integration into compact, battery-powered devices. The higher memory bandwidth of 135.2 GB/s versus Intel’s 89.6 GB/s gives an advantage in memory-intensive tasks, particularly with LPDDR5X memory. The higher base clock of 3.40 GHz suggests sustained performance without reliance on boost states. The larger L1 cache per core at 288 KB and L2 cache per module at 12 MB could reduce memory latency for certain workloads. The Adreno X1-85 integrated graphics provide a different visual processing path compared to Intel’s UHD Graphics 730. The earlier release date of April 23, 2024 means the platform has been available longer. Without any recorded benchmark scores, the Qualcomm chip’s performance remains undefined in the database, but its specifications point to a design focused on mobile efficiency and memory throughput rather than raw multi-threaded compute.