Intel Core 9 273PQE vs Qualcomm Snapdragon X1E-84-100 Comparison

FAQ

Q: How does the Intel Core 9 273PQE compare to the Qualcomm Snapdragon X1E-84-100 in core and thread counts?

A: Both processors feature 12 cores. The Intel Core 9 273PQE supports 24 threads, while the Qualcomm Snapdragon X1E-84-100 supports 12 threads, giving the Intel part twice the thread count.

Q: What are the clock speed differences between the two processors?

A: The Qualcomm Snapdragon X1E-84-100 has a base clock of 3.80 GHz, higher than the Intel Core 9 273PQE's 3.40 GHz base clock. The Intel part boosts to 5.90 GHz, well ahead of the Snapdragon's 4.20 GHz boost clock.

Q: Which processor has a higher thermal design power (TDP)?

A: The Intel Core 9 273PQE has a TDP of 125 watts, while the Qualcomm Snapdragon X1E-84-100 has a TDP of 35 watts. The Snapdragon is designed for a much lower power envelope.

Q: What memory types does each processor support?

A: The Intel Core 9 273PQE supports DDR4 and DDR5 memory in a dual-channel configuration. The Qualcomm Snapdragon X1E-84-100 supports LPDDR5X memory, also in a dual-channel configuration.

Q: Do these processors use the same manufacturing process?

A: No. The Intel Core 9 273PQE uses a 10 nm process from Intel, while the Qualcomm Snapdragon X1E-84-100 uses a 4 nm process fabricated by TSMC.

Q: Which processor has a higher memory bandwidth rating?

A: The Qualcomm Snapdragon X1E-84-100 has a memory bandwidth of 135.2 GB/s, compared to the Intel Core 9 273PQE's 89.6 GB/s.

Architecture Differences

The Intel Core 9 273PQE, based on the Bartlett Lake codename, is a 12-core, 24-thread desktop processor from Intel. It uses a 10 nm process node fabricated in-house by Intel. The cache hierarchy consists of 80 KB of L1 per core, 2 MB of L2 per core, and 36 MB of shared L3 cache. The processor supports both DDR4 and DDR5 memory over a dual-channel bus, with a rated memory bandwidth of 89.6 GB/s. It includes ECC memory support, a feature absent from the Qualcomm part. The integrated graphics solution is UHD Graphics 770. The CPU provides Gen 5 PCIe connectivity with 16 lanes on the CPU side. It fits the Intel Socket 1700 and is classified as a desktop market segment part.

The Qualcomm Snapdragon X1E-84-100 uses the Oryon codename and is fabricated on a 4 nm process at TSMC. It also has 12 cores but only 12 threads, indicating no simultaneous multithreading. The cache layout differs substantially: 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3. Memory support is limited to LPDDR5X over a dual-channel bus, with a higher bandwidth of 135.2 GB/s. ECC memory is not supported. The integrated GPU is the Adreno X1-85. PCIe connectivity is Gen 4 with 12 lanes on the CPU side. The socket is Qualcomm BGA 2073, and the market segment is mobile.

The process node difference is significant: the 4 nm TSMC node on the Snapdragon is denser than Intel's 10 nm process on the Core 9 273PQE. The cache designs also diverge sharply. The Intel part spreads L2 across each core at 2 MB per core, while Qualcomm allocates 12 MB per module, a different organizational approach. The Snapdragon's L3 is much smaller at 6 MB versus 36 MB on the Intel chip. These architectural choices reflect the different target segments: desktop compute performance for Intel, mobile efficiency for Qualcomm.

Head-to-Head Benchmarks

The head-to-head benchmark data in the database contains no shared test entries between these two processors. The Intel Core 9 273PQE has a full suite of recorded benchmark scores, while the Qualcomm Snapdragon X1E-84-100 has an empty benchmark array. The wins counters show zero for both sides, and the head-to-head table is empty. This means no direct comparison can be made from the recorded measurements.

The Intel Core 9 273PQE does have its own benchmark profile. In Cinebench R23, it scores 39190 in multicore and 5532 in singlecore. In Cinebench R20, the scores are 16459 multicore and 2323 singlecore. Cinebench R15 results are 3950 multicore and 557 singlecore. PassMark results include 164629 in integer math, 125546 in floating point math, 585752 in data compression, 29636 in data encryption, 38743 in extended instructions, 198 in find prime numbers, 46107 in multithread, 2754 in physics, 53167 in random string sorting, and 4573 in single thread. The average benchmark score is 66099, placing it at the 93rd percentile among all CPUs in the database.

The nearest rivals in the database for the Intel Core 9 273PQE are all other desktop or server processors. The Intel Core Ultra 5 250KF Plus has an average score of 66159, which is 0.1% higher than the Core 9 273PQE. The AMD Ryzen 9 7950X3D scores 65914, 0.3% lower. The Intel Core Ultra 5 250K Plus scores 66855, 1.1% higher. The AMD EPYC 4465P scores 66925, 1.2% higher. These deltas place the Core 9 273PQE within a tight competitive band around these parts.

The Qualcomm Snapdragon X1E-84-100 has no recorded benchmark scores, no average score, and no nearest rivals in the database. Its percentile ranking is 50, which reflects the absence of measurement data rather than a performance assessment. Without recorded scores, the database cannot establish a comparative performance position for the Snapdragon part.

Specification Differences

The two processors differ across nearly every recorded specification field. The Intel Core 9 273PQE has 24 threads versus 12 threads on the Snapdragon. Base clocks are 3.40 GHz on the Intel part and 3.80 GHz on the Snapdragon. Boost clocks are 5.90 GHz versus 4.20 GHz. TDP is 125 watts for Intel and 35 watts for Qualcomm.

The sockets are different: Intel Socket 1700 for the Core 9 273PQE, Qualcomm BGA 2073 for the Snapdragon. The codenames are Bartlett Lake versus Oryon. The process nodes are 10 nm (Intel) and 4 nm (TSMC). The foundries are Intel and TSMC respectively.

Cache configurations differ at every level. The Intel part uses 80 KB of L1 per core, the Snapdragon uses 288 KB per core. L2 is 2 MB per core on Intel, 12 MB per module on Qualcomm. L3 is 36 MB shared on Intel, 6 MB shared on Qualcomm.

Memory support is DDR4 and DDR5 on the Intel part versus LPDDR5X on the Snapdragon. Memory bandwidth is 89.6 GB/s on Intel and 135.2 GB/s on Qualcomm. ECC memory is supported on the Intel part only. PCIe is Gen 5 with 16 lanes on Intel, Gen 4 with 12 lanes on Qualcomm. Integrated graphics are UHD Graphics 770 versus Adreno X1-85.

The market segments are Desktop for Intel and Mobile for Qualcomm. The release dates differ: 2026-03-08 for the Intel part, 2024-04-23 for the Snapdragon. The Intel part has a launch MSRP of $589; the Snapdragon has no launch MSRP recorded. Neither processor has an unlocked multiplier. The Intel part number is SA4Q9, and the Qualcomm part number is X1E84100.

The Verdict

The database records no shared benchmarks between the Intel Core 9 273PQE and the Qualcomm Snapdragon X1E-84-100, so a direct performance verdict cannot be derived from measurements. The Intel part has a complete benchmark profile with an average score of 66099 and a 93rd percentile ranking. The Snapdragon has no recorded scores and sits at the 50th percentile by default.

The specification data indicates the Intel part targets desktop workloads with high thread counts, a high boost clock of 5.90 GHz, a 125 watt TDP, and support for DDR4 and DDR5 memory with ECC. The Qualcomm part is a mobile processor with a 12-core, 12-thread configuration, a 4.20 GHz boost clock, a 35 watt TDP, and LPDDR5X memory support. The Snapdragon carries a much higher memory bandwidth at 135.2 GB/s and a smaller 6 MB L3 cache, while the Intel part offers 36 MB of L3.

The Intel Core 9 273PQE sits within 1.2% of its nearest rivals in the database, all of which are high-end desktop or server processors. That places it in a competitive position among parts with recorded scores. The Qualcomm Snapdragon X1E-84-100 cannot be positioned relative to any rivals because no comparison data exists in the database.

For a user selecting between these two, the decision rests on segment and workload. The Intel part is a desktop processor with a wide benchmark footprint and strong scores in multi-threaded and single-threaded tests. The Snapdragon is a mobile part with a lower power envelope and no recorded benchmark data. The database supports the Intel part for desktop compute use based on its recorded scores. The Snapdragon's role is defined by its mobile positioning, low TDP, and memory bandwidth advantage, but its performance profile remains unmeasured in the database.