Intel Core 7 251E vs Qualcomm Snapdragon X2E-96-100 Comparison

Intel
INTEL

Intel Core 7 251E

CORE STATE Bartlett Lake
CORE SPECS 24 Cores / 32 Threads
CLOCK SPEED 2.1 Base / 5.6 GHz Turbo
CACHE 36 MB (shared)
MAX TDP 65W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X2E-96-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 5 GHz Turbo
CACHE 9 MB (shared)
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Core 7 251E vs Qualcomm Snapdragon X2E-96-100

The Verdict

The database shows two fundamentally different processors aimed at different market segments. The Intel Core 7 251E is a desktop part with 24 cores and 32 threads, built on Intel's 10 nm process with a 65 W TDP. The Qualcomm Snapdragon X2E-96-100 is a mobile processor with 18 cores and 18 threads, fabricated on TSMC's 3 nm node, with no TDP listed. The Intel part targets desktop workloads where high thread counts and large shared cache matter. The Qualcomm part targets mobile platforms where power efficiency and memory bandwidth are prioritized.

For users building a desktop system with an Intel Socket 1700 motherboard, the Core 7 251E is the clear choice based on the recorded data. It supports DDR4 and DDR5 memory, includes ECC memory support, and offers 16 PCIe Gen 5 lanes from the CPU. The Snapdragon X2E-96-100 requires a Qualcomm BGA 2343 socket, which is not compatible with desktop motherboards. The Intel part also has a launch MSRP of $384, while the Qualcomm part has no listed launch MSRP.

For mobile users, the Snapdragon X2E-96-100 delivers a different set of capabilities. It has a higher base clock of 4.45 GHz compared to 2.10 GHz on the Intel part, and a boost clock of 5.00 GHz versus 5.60 GHz. The Qualcomm part also features triple-channel LPDDR5X memory with 228.6 GB/s bandwidth, which is more than double the 89.6 GB/s available on the Intel part. The mobile segment benefits from the 3 nm process node, which typically indicates lower power draw per transistor, though no TDP is recorded for the Snapdragon.

The percentile ranking for both processors is identical at 50, meaning both sit at the median of all CPUs in the database. However, the benchmark scores for both are zero, and there are no head-to-head benchmark results recorded. The data indicates that neither processor has been measured in the database's benchmark suite yet, so performance comparisons must rely on architectural specifications rather than measured results.

Architecture Differences

The Intel Core 7 251E uses the Bartlett Lake codename and belongs to the Core 7 generation. It is manufactured on Intel's 10 nm process node at Intel's own foundry. The die size measures 257 mm². The processor integrates 24 cores with 32 threads, indicating that some cores support hyper-threading while others do not, a common hybrid design. Each core has 80 KB of L1 cache and 2 MB of L2 cache. The shared L3 cache totals 36 MB.

The Qualcomm Snapdragon X2E-96-100 uses the Glymur codename and belongs to the Snapdragon X2 Elite generation. It is manufactured on TSMC's 3 nm process node, which is a smaller geometry compared to Intel's 10 nm. The die size is 220 mm², which is smaller than the Intel part despite having fewer cores. The Snapdragon has 18 cores and 18 threads, meaning no hyper-threading. Each core has 288 KB of L1 cache, which is significantly larger than the Intel core's 80 KB. The L2 cache is organized per module at 16 MB, and the shared L3 cache is 9 MB.

The cache hierarchy differs substantially. The Intel part has a larger L3 cache at 36 MB, while the Snapdragon has a smaller 9 MB L3 but much larger L1 per core and L2 per module. This suggests different design philosophies: Intel favors a large shared cache for multi-threaded desktop workloads, while Qualcomm emphasizes per-core and per-module cache for latency-sensitive mobile tasks.

The memory support differs as well. The Intel part supports DDR4 and DDR5 in a dual-channel configuration, delivering 89.6 GB/s of memory bandwidth. The Snapdragon supports LPDDR5X in a triple-channel configuration, delivering 228.6 GB/s. The Intel part supports ECC memory, while the Snapdragon does not. The Intel part uses 16 PCIe Gen 5 lanes from the CPU, while the Snapdragon uses 12 PCIe Gen 5 lanes.

The integrated graphics differ: the Intel part includes UHD Graphics 770, while the Snapdragon includes Adreno X2-90. The market segments are explicitly different: Desktop for Intel and Mobile for Qualcomm. Both processors are marked as Active in production status. The Intel part was released on 2025-01-12, while the Snapdragon has a release date of 2026-04-05. The Intel part has a part number of SRQDUQ657, and the Snapdragon has X2E96100. Neither processor has an unlocked multiplier.

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for these two processors. The headToHeadBenchmarks array is empty, and both winsA and winsB are zero. The avgBenchmarkScore for both is zero. This means that direct performance measurements are not available in the database at this time.

Without measured scores, the architectural data provides the only basis for comparison. The Intel part has a base clock of 2.10 GHz and a boost clock of 5.60 GHz. The Snapdragon has a base clock of 4.45 GHz and a boost clock of 5.00 GHz. The Intel part has a higher boost clock by 0.60 GHz, while the Snapdragon has a higher base clock by 2.35 GHz. The higher boost clock on the Intel part suggests potential for higher single-thread peak performance, while the Snapdragon's higher base clock indicates sustained performance at lower load levels.

The core and thread counts favor the Intel part. With 24 cores and 32 threads versus 18 cores and 18 threads, the Intel part offers 33% more cores and 78% more threads. For multi-threaded workloads that scale with thread count, the Intel part has a structural advantage. However, the Snapdragon's larger L1 cache per core (288 KB versus 80 KB) and larger L2 per module (16 MB versus 2 MB per core) may reduce memory latency for its 18 threads.

Memory bandwidth strongly favors the Snapdragon. The 228.6 GB/s triple-channel LPDDR5X configuration is 155% higher than the Intel part's 89.6 GB/s dual-channel configuration. For memory-bound workloads such as data compression, encryption, or large in-memory databases, the Snapdragon has a substantial bandwidth advantage. The Intel part's ECC support, however, provides data integrity for error-sensitive applications, which the Snapdragon cannot offer.

The process node difference is notable. The Snapdragon uses TSMC's 3 nm process, while the Intel part uses Intel's 10 nm process. A smaller process node typically allows for higher transistor density and lower power consumption per transistor. The Snapdragon's die size of 220 mm² with 18 cores suggests a denser layout compared to the Intel part's 257 mm² with 24 cores. The power implications are not directly measured in the database, as the Snapdragon has no TDP listed, but the process node difference is recorded.

Specification Differences

The following fields differ between the two processors according to the database:

  • Manufacturer: Intel for the Core 7 251E, Unknown for the Snapdragon X2E-96-100.
  • Cores: 24 for Intel, 18 for Qualcomm.
  • Threads: 32 for Intel, 18 for Qualcomm.
  • Base Clock: 2.10 GHz for Intel, 4.45 GHz for Qualcomm.
  • Boost Clock: 5.60 GHz for Intel, 5.00 GHz for Qualcomm.
  • TDP: 65 W for Intel, null for Qualcomm.
  • Socket: Intel Socket 1700 for Intel, Qualcomm BGA 2343 for Qualcomm.
  • Codename: Bartlett Lake for Intel, Glymur for Qualcomm.
  • Generation: Core 7 (Bartlett Lake) for Intel, Snapdragon X2 (Elite) for Qualcomm.
  • Process Node: 10 nm for Intel, 3 nm for Qualcomm.
  • Foundry: Intel for Intel, TSMC for Qualcomm.
  • Die Size: 257 mm² for Intel, 220 mm² for Qualcomm.
  • L1 Cache: 80 KB per core for Intel, 288 KB per core for Qualcomm.
  • L2 Cache: 2 MB per core for Intel, 16 MB per module for Qualcomm.
  • L3 Cache: 36 MB shared for Intel, 9 MB shared for Qualcomm.
  • Memory Support: DDR4, DDR5 for Intel, LPDDR5X for Qualcomm.
  • Memory Bus: Dual-channel for Intel, Triple-channel for Qualcomm.
  • Memory Bandwidth: 89.6 GB/s for Intel, 228.6 GB/s for Qualcomm.
  • ECC Memory: true for Intel, false for Qualcomm.
  • PCIe: Gen 5, 16 lanes for Intel, Gen 5, 12 lanes for Qualcomm.
  • Integrated Graphics: UHD Graphics 770 for Intel, Adreno X2-90 for Qualcomm.
  • Market Segment: Desktop for Intel, Mobile for Qualcomm.
  • Release Date: 2025-01-12 for Intel, 2026-04-05 for Qualcomm.
  • Launch MSRP: $384 for Intel, null for Qualcomm.
  • Part Number: SRQDUQ657 for Intel, X2E96100 for Qualcomm.

FAQ

Q: Which processor has more cores and threads?

A: The Intel Core 7 251E has 24 cores and 32 threads. The Qualcomm Snapdragon X2E-96-100 has 18 cores and 18 threads. The Intel part provides 6 more cores and 14 more threads.

Q: What are the clock speed differences?

A: The Intel part has a base clock of 2.10 GHz and a boost clock of 5.60 GHz. The Qualcomm part has a base clock of 4.45 GHz and a boost clock of 5.00 GHz. The Qualcomm part has a higher base clock by 2.35 GHz, while the Intel part has a higher boost clock by 0.60 GHz.

Q: Which processor supports ECC memory?

A: Only the Intel Core 7 251E supports ECC memory. The Qualcomm Snapdragon X2E-96-100 does not list ECC support.

Q: What memory bandwidth does each processor provide?

A: The Intel part provides 89.6 GB/s through dual-channel DDR4 or DDR5 memory. The Qualcomm part provides 228.6 GB/s through triple-channel LPDDR5X memory. The Qualcomm part delivers 139 GB/s more bandwidth.

Q: What are the process nodes and foundries?

A: The Intel Core 7 251E uses Intel's 10 nm process at Intel's foundry. The Qualcomm Snapdragon X2E-96-100 uses TSMC's 3 nm process at TSMC's foundry.

Q: Which processor has a larger L3 cache?

A: The Intel Core 7 251E has a 36 MB shared L3 cache. The Qualcomm Snapdragon X2E-96-100 has a 9 MB shared L3 cache. The Intel part has 27 MB more L3 cache.

Q: What is the market segment for each processor?

A: The Intel Core 7 251E is classified as Desktop. The Qualcomm Snapdragon X2E-96-100 is classified as Mobile. The Intel part uses an Intel Socket 1700, while the Qualcomm part uses a Qualcomm BGA 2343 socket.

Q: When were these processors released?

A: The Intel Core 7 251E was released on 2025-01-12. The Qualcomm Snapdragon X2E-96-100 has a release date of 2026-04-05. Both are marked as Active in production status.

Q: Do either processors have an unlocked multiplier?

A: No. Both the Intel Core 7 251E and the Qualcomm Snapdragon X2E-96-100 have multiplierUnlocked set to false.

DETAILED SPECIFICATIONS

SPECIFICATION
7 251E
Snapdragon X2E-96-100
Core Specs
Cores
24
18 -25.0%
Threads
32
18 -43.8%
Base Clock (GHz)
2.1
4.45 +111.9%
Boost Clock (GHz)
5.6
5 -10.7%
Frequency (GHz)
2.1
4.45 +111.9%
Turbo Clock (GHz)
5.6
5 -10.7%
Multiplier
21
44.5 +111.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
16 MB (per module)
L3 Cache
36 MB (shared)
9 MB (shared)
Power
TDP (W)
65
—
PL1
65 W
—
PL2
219 W
—
Architecture
Codename
Bartlett Lake
Glymur
Generation
Core 7 (Bartlett Lake)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
257 mm²
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
89.6 GB/s
228.6 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
—
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 8 E-Cores: 16
12 + 6
E-Core Frequency
1600 MHz up to 4.4 GHz
3.6 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 770
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$384
—
Part Number
SRQDUQ657
X2E96100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 7 251E Details View Snapdragon X2E-96-100 Details